Probing Lead Free Solder Bumps in Final Wafer Test
Probing Lead Free Solder Bumps in Final Wafer Test
Probing Lead Free Solder Bumps in Final Wafer Test
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Microelectronics<br />
-10°C Cobra/C4 Photos<br />
6 MIL O D<br />
7 MIL O D<br />
8 MIL O D<br />
9 MIL O D<br />
6 MIL O D<br />
7 MIL O D<br />
8 MIL O D<br />
9 MIL O D<br />
Sam McKnight June 2002 Southwest <strong>Test</strong> Workshop<br />
14
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