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INCH-POUND MIL-PRF-13830B 9 January 1997 SUPERSEDING ...

INCH-POUND MIL-PRF-13830B 9 January 1997 SUPERSEDING ...

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<strong>MIL</strong>-<strong>PRF</strong>-<strong>13830B</strong><br />

APPENDIX D<br />

(Application for copies should be addressed to American National Standards<br />

Institute, 11 West 42nd Street, New York, NY 10036.)<br />

AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)<br />

ASTM D1640 - Standard Test Method for Drying, Curing, or Film Formation of<br />

Organic Coatings at Room Temperature<br />

(Application for copies should be addressed to American Society for Testing and<br />

Materials, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959.)<br />

D.2.3 Order of precedence. In the event of a conflict between the text of this<br />

document and the references cited herein, the text of this document takes<br />

precedence. Nothing in this document, however, supersedes applicable laws and<br />

regulations unless a specific exemption has been obtained. (See contract<br />

provisions for additional precedence criteria).<br />

D.3 REQUIREMENTS<br />

D.3.1 Qualification. The adhesive furnished under this specification shall be a<br />

product which has been tested, and passed the qualification tests specified herein.<br />

Contractor certified test reports are to be made available upon request (see 6.2).<br />

D.3.2 Materials.<br />

D.3.2.1 Components. The components of the Type I adhesive system shall<br />

consist of a primer and an epoxy-elastomer adhesive. The components of the Type<br />

II adhesive system shall consist of the epoxy-elastomer adhesive only.<br />

D.3.2.2 Adhesive. The adhesive shall be a thermosetting resin and shall be<br />

based on epichlorohydrin-bisphenol A-Type epoxy resin, modified with<br />

acrylonitrile-butadiene rubber.<br />

D.3.2.3 Primer. The Primer shall be a two component (Parts A and B) room<br />

temperature curing liquid epoxy and shall meet the physical properties of this<br />

specification.<br />

D.3.3 Bond Strength (Type I and Type II). The bond strength for the Type I and<br />

Type II adhesive bonding systems shall be as specified in Table 1D.<br />

56<br />

Source: http://www.assistdocs.com -- Downloaded: 2006-05-24T15:32Z<br />

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