Download our Space Databook - Teledyne Relays
Download our Space Databook - Teledyne Relays
Download our Space Databook - Teledyne Relays
Create successful ePaper yourself
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.
Lead Forming Options<br />
M SPREADER PAD<br />
The M spreader pad is used to create<br />
separation between the relay and a PCB to<br />
avoid potential short circuits from circuit<br />
traces lying directly underneath relay header.<br />
M2 SPREADER PAD<br />
The M2 spreader pad is used to reconfi gure<br />
the TO-5 package relay that has a circular<br />
footprint into a .100” spacing, IC-type pattern.<br />
It also serves to create separation between<br />
the relay and a PCB to avoid potential short<br />
circuits from circuit traces lying directly<br />
underneath relay header.<br />
M3 SPREADER PAD<br />
The M3 spreader pad is used to create<br />
separation between the relay and a PCB to<br />
avoid potential short circuits from circuit<br />
traces lying directly underneath relay header.<br />
Page 52 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE © 2013 <strong>Teledyne</strong> <strong>Relays</strong>
Change language