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Processing and working instructions HPL and HPL elements PR ...

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<strong>PR</strong>ODUCT INFORMATION<br />

7. WOrKINg WITH DUrOPAL <strong>HPL</strong> AND DUrOPAL <strong>HPL</strong> ELEMENTS<br />

7.1 general<br />

DUROPAL <strong>HPL</strong> with a thickness of less than 2 mm needs a flat, stress-free core material with minimum flex.<br />

A smooth surface is an essential requirement for a permanently good result. The right adhesives, application<br />

quantity, pressure <strong>and</strong> press temperature are equally important.<br />

Since DUROPAL <strong>HPL</strong> may be subject to slight dimensional changes, depending on the air humidity <strong>and</strong><br />

temperature, these properties must always be taken into account when <strong>working</strong> with DUROPAL <strong>HPL</strong>.<br />

7.2 Core material<br />

The following table describes the suitability of different materials as cores <strong>and</strong> their application possibilities.<br />

With all such information, it should be noted that the properties of a core materials of different composition<br />

(e.g. honeycomb with frame) can have an effect on the surface texture of the DUROPAL <strong>HPL</strong>. This should<br />

be checked in advance <strong>and</strong> taken into account.<br />

Material/properties <strong>and</strong> suitability as core material<br />

Chipboard panels<br />

On free supporting constructions, the necessary thickness must be taken into account.<br />

The fixing of the flat bonded element depends on the thickness <strong>and</strong> size of the panel.<br />

The surface quality of the DUROPAL <strong>HPL</strong> element depends largely on the structure of the<br />

chipboard panel construction, i.e. the shape of the chips, resin content, density, <strong>and</strong> in<br />

particular on the s<strong>and</strong>ing quality of the surface. Multi-ply chipboard panels are suitable<br />

as core materials. The panels should be evenly s<strong>and</strong>ed on both sides in order to prevent<br />

bowing <strong>and</strong> visual surface defects.<br />

In order to enable a short bonding <strong>and</strong> pressing time, ensure good surface absorption<br />

properties if you are using water-based bonding system. The surface must also have a<br />

resistance to delamination strength of at least 1.2 N/mm2 to avoid detachment of the<br />

laminate (DIN 52 366). Please contact us in the event of any further questions on these<br />

special chipboard panels.<br />

099 PI <strong>Processing</strong> <strong>and</strong> <strong>working</strong> <strong>instructions</strong> Page 14 of 34

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