Presentation for NCCAVS â Plasma Applications Group (formerly ...

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Plasma Before Wire Bonding • Wire Bonding Issues • Fine Pitch Wire Bonding (thinner wires, more bonds, smaller area) • Pad Contamination • Bond Pad Metallization Issues • Aluminum, Copper • Nickel & Palladium • Thin Film Gold • Changing Substrate Technology 12 | 08 October 2009 |
Plasma Before Wire Bonding Let’s examine one specific issue for Wire Bonding… • Bond Pad Contamination by Organics Wire Intermetallic Compound Contamination Pad 30 to 300 Angstroms 13 | 08 October 2009 |
Page 1 and 2: Presentation for NCCAVS - Plasma Ap
Page 3 and 4: 4 Common Plasma Applications for AS
Page 5 and 6: 5 | 08 October 2009 | Plasma Before
Page 7 and 8: Die Attach Adhesion Experiment •
Page 9 and 10: Conclusions for Die Attach • Plas
Page 11: Plasma Before Wire Bonding • Plas
Page 15 and 16: Epoxy Bleed - Plasma Cleaning Exper
Page 17 and 18: 17 | 08 October 2009 | • Optimize
Page 19 and 20: Conclusions for This Contamination
Page 21 and 22: Oxide on Pad - Cleaning Experiment
Page 23 and 24: Plasma Treatment to Remove Contamin
Page 25 and 26: Optimized Plasma Is Required Sample
Page 27 and 28: 27 | 08 October 2009 | Plasma Befor
Page 29 and 30: Mold & Encapsulation: Why Plasma
Page 31 and 32: Mold Adhesion Experiment • Evalua
Page 33 and 34: Mold Adhesion Results • Pull Test
Page 35 and 36: 35 | 08 October 2009 | Plasma Befor
Page 37 and 38: Flip Chip Underfill (FCUF) Issues
Page 39 and 40: Flip Chip Underfill Experiment •
Page 41 and 42: FCUF Results - Wicking Speed • Ti
Page 43: Thank you! Q&A Session 43 | 08 Octo

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Presentation for NCCAVS â Plasma Applications Group (formerly ...