Presentation for NCCAVS â Plasma Applications Group (formerly ...

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Plasma Before Die Attach • Plasma Treatment to: • Activate surface of die attach pad for improved die bonding • Remove contamination from die attach pad • Benefits: • Increase die-to-substrate bond strength • Increase die-to-substrate bond reliability • Reduce scrap/re-work • Reduce costs 6 | 08 October 2009 |
Die Attach Adhesion Experiment • Objective: Maximize die attach adhesion (shear testing) • Test Set-up • QFN devices • Copper leadframes • Silver-filled epoxy die attach (oven-cured) • 15 leadframes plasma treated • 15 leadfames untreated (control) • Commercially avail. Plasma System • Argon only • Shear test 1 die per leadframe (chosen at random) • Considerations • Maximize cleaning & surface activation rates (for high throughput) • No damage to leadframe wire bond pads 7 | 08 October 2009 |
Page 1 and 2: Presentation for NCCAVS - Plasma Ap
Page 3 and 4: 4 Common Plasma Applications for AS
Page 5: 5 | 08 October 2009 | Plasma Before
Page 9 and 10: Conclusions for Die Attach • Plas
Page 11 and 12: Plasma Before Wire Bonding • Plas
Page 13 and 14: Plasma Before Wire Bonding Let’s
Page 15 and 16: Epoxy Bleed - Plasma Cleaning Exper
Page 17 and 18: 17 | 08 October 2009 | • Optimize
Page 19 and 20: Conclusions for This Contamination
Page 21 and 22: Oxide on Pad - Cleaning Experiment
Page 23 and 24: Plasma Treatment to Remove Contamin
Page 25 and 26: Optimized Plasma Is Required Sample
Page 27 and 28: 27 | 08 October 2009 | Plasma Befor
Page 29 and 30: Mold & Encapsulation: Why Plasma
Page 31 and 32: Mold Adhesion Experiment • Evalua
Page 33 and 34: Mold Adhesion Results • Pull Test
Page 35 and 36: 35 | 08 October 2009 | Plasma Befor
Page 37 and 38: Flip Chip Underfill (FCUF) Issues
Page 39 and 40: Flip Chip Underfill Experiment •
Page 41 and 42: FCUF Results - Wicking Speed • Ti
Page 43: Thank you! Q&A Session 43 | 08 Octo

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Presentation for NCCAVS â Plasma Applications Group (formerly ...