Presentation for NCCAVS â Plasma Applications Group (formerly ...

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Plasma Before Wire Bonding Let’s examine another issue for Wire Bonding… • Bond Pad Metallization Issues (a.k.a. Bond Pad Contamination by Metal Oxide) Wire Intermetallic Compound Contamination Pad 30 to 300 Angstroms 20 | 08 October 2009 |
Oxide on Pad - Cleaning Experiment • Common bond pad metalization: Nanometers of gold (Au) on palladium (Pd) on nickel (Ni) • Problem: Nickel migrates through gold, forms NiOx on surface NiOx contamination causes wire bonding problems • Solution: Plasma clean to remove NiOx • However: Top layer of metallization (i.e. thin gold) can be sensitive to sputtering • Without expertise, possible to remove entire layer of gold in a single plasma cycle! • Challenge: Find a plasma treatment to clean the NiOx w/o removing a significant amount of gold 21 | 08 October 2009 |
Page 1 and 2: Presentation for NCCAVS - Plasma Ap
Page 3 and 4: 4 Common Plasma Applications for AS
Page 5 and 6: 5 | 08 October 2009 | Plasma Before
Page 7 and 8: Die Attach Adhesion Experiment •
Page 9 and 10: Conclusions for Die Attach • Plas
Page 11 and 12: Plasma Before Wire Bonding • Plas
Page 13 and 14: Plasma Before Wire Bonding Let’s
Page 15 and 16: Epoxy Bleed - Plasma Cleaning Exper
Page 17 and 18: 17 | 08 October 2009 | • Optimize
Page 19: Conclusions for This Contamination
Page 23 and 24: Plasma Treatment to Remove Contamin
Page 25 and 26: Optimized Plasma Is Required Sample
Page 27 and 28: 27 | 08 October 2009 | Plasma Befor
Page 29 and 30: Mold & Encapsulation: Why Plasma
Page 31 and 32: Mold Adhesion Experiment • Evalua
Page 33 and 34: Mold Adhesion Results • Pull Test
Page 35 and 36: 35 | 08 October 2009 | Plasma Befor
Page 37 and 38: Flip Chip Underfill (FCUF) Issues
Page 39 and 40: Flip Chip Underfill Experiment •
Page 41 and 42: FCUF Results - Wicking Speed • Ti
Page 43: Thank you! Q&A Session 43 | 08 Octo

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Presentation for NCCAVS â Plasma Applications Group (formerly ...