Presentation for NCCAVS â Plasma Applications Group (formerly ...

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Contamination Sources (Causes reduced wire bond reliability & yield) • Bleed of silver-filled epoxy (i.e. die attach step) • Thermal, Snap Cure processes • Resin bleed • Organic contamination from other sources (Unfortunately, many sources in a Fab) 14 | 08 October 2009 |
Epoxy Bleed - Plasma Cleaning Experiment • Quad Flat No-Lead (QFN) Package • Cu frame with Ni/Pd/Au • 32 lead/die; 576 die/strip • Silver-filled epoxy die attach • 2 cases: Oven-cure, snap-cure • 25 mm gold wire • Commercially avail. Plasma System • Argon & Oxygen mixture Courtesy ASM, C. Vath 15 | 08 October 2009 |
Page 1 and 2: Presentation for NCCAVS - Plasma Ap
Page 3 and 4: 4 Common Plasma Applications for AS
Page 5 and 6: 5 | 08 October 2009 | Plasma Before
Page 7 and 8: Die Attach Adhesion Experiment •
Page 9 and 10: Conclusions for Die Attach • Plas
Page 11 and 12: Plasma Before Wire Bonding • Plas
Page 13: Plasma Before Wire Bonding Let’s
Page 17 and 18: 17 | 08 October 2009 | • Optimize
Page 19 and 20: Conclusions for This Contamination
Page 21 and 22: Oxide on Pad - Cleaning Experiment
Page 23 and 24: Plasma Treatment to Remove Contamin
Page 25 and 26: Optimized Plasma Is Required Sample
Page 27 and 28: 27 | 08 October 2009 | Plasma Befor
Page 29 and 30: Mold & Encapsulation: Why Plasma
Page 31 and 32: Mold Adhesion Experiment • Evalua
Page 33 and 34: Mold Adhesion Results • Pull Test
Page 35 and 36: 35 | 08 October 2009 | Plasma Befor
Page 37 and 38: Flip Chip Underfill (FCUF) Issues
Page 39 and 40: Flip Chip Underfill Experiment •
Page 41 and 42: FCUF Results - Wicking Speed • Ti
Page 43: Thank you! Q&A Session 43 | 08 Octo

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Presentation for NCCAVS â Plasma Applications Group (formerly ...