Presentation for NCCAVS â Plasma Applications Group (formerly ...
Presentation for NCCAVS â Plasma Applications Group (formerly ...
Presentation for NCCAVS â Plasma Applications Group (formerly ...
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Die Attach Adhesion Experiment<br />
• Objective: Maximize die attach adhesion (shear testing)<br />
• Test Set-up<br />
• QFN devices<br />
• Copper leadframes<br />
• Silver-filled epoxy die attach (oven-cured)<br />
• 15 leadframes plasma treated<br />
• 15 leadfames untreated (control)<br />
• Commercially avail. <strong>Plasma</strong> System<br />
• Argon only<br />
• Shear test 1 die per leadframe (chosen at random)<br />
• Considerations<br />
• Maximize cleaning & surface activation rates (<strong>for</strong> high throughput)<br />
• No damage to leadframe wire bond pads<br />
7 | 08 October 2009 |