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Presentation for NCCAVS – Plasma Applications Group (formerly ...

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Die Attach Adhesion Experiment<br />

• Objective: Maximize die attach adhesion (shear testing)<br />

• Test Set-up<br />

• QFN devices<br />

• Copper leadframes<br />

• Silver-filled epoxy die attach (oven-cured)<br />

• 15 leadframes plasma treated<br />

• 15 leadfames untreated (control)<br />

• Commercially avail. <strong>Plasma</strong> System<br />

• Argon only<br />

• Shear test 1 die per leadframe (chosen at random)<br />

• Considerations<br />

• Maximize cleaning & surface activation rates (<strong>for</strong> high throughput)<br />

• No damage to leadframe wire bond pads<br />

7 | 08 October 2009 |

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