Presentation for NCCAVS â Plasma Applications Group (formerly ...
Presentation for NCCAVS â Plasma Applications Group (formerly ...
Presentation for NCCAVS â Plasma Applications Group (formerly ...
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Flip Chip Underfill Experiment<br />
• <strong>Plasma</strong> Recipe Variables (to optimize plasma treatment)<br />
• Gases, Combination of Gasses<br />
• Power<br />
• Pressure<br />
• Time<br />
• System Configuration (H/W, S/W, etc.)<br />
• 25 Years <strong>Plasma</strong> Expertise<br />
Must get plasma to go between Flip Chip and Substrate<br />
• Flip Chip Samples<br />
• 11 mm x 11mm bumped die<br />
• Polyimide-based final die passivation<br />
• Organic (FR4-type) substrate<br />
• Measureables<br />
• Filet height<br />
• Filet uni<strong>for</strong>mity<br />
• Wicking speed<br />
39 | 08 October 2009 |
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