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PRODUCT DESCRlP TION REV.A 1.2.1 Main System Unit Specifications PROCESSOR ••.•.•..•..•.••• 80286-10 CO-PROCESSOR •••••.••.••.. 80287-8 ROM •..•.•••.••••....•.••• 64KB (27256 x 2) RAM ••..••......•.•..•.•.. 640KB is standard MASS MEMORy 5 1/4" 1.2MB FDD is standard MASS MEMORY SLOTS ••••.•.• 6 16-bit 1/0 expansion slots 3 8-bit 1/0 expansion slots CPU CLüCK ••••.••..•.•...• 6 }lliz, 8 }lliz, 10 }lliz (Switch selectable) H<strong>Al</strong>T CYCLES ...•.•••...... Selectable DIMENSIONS (W x D x R) ••. 498.5 x 442 x 169 mm WEICHT ••.•.•..•.••.•..••. 14.5 Kg (Standard model - 1FDD) 1.2.2 Keyboard Specifications LAYOUT ..••••••••....•..•• New AT compatible CORD ..•••.••.••.••.•.•..• App rox. 2 meters DIMENSIONS (W x D x H) .... 490 x 197.5 x 47.7 mm lmICHT .•••.••.••.••..•... 1.8 Kg 1.2.3 FD1155C Floppy Disk Drive Specification High Density Mode Capacity (KBytes) Unformatted Formatted Transfer Rate (K-bits/sec) Number of Tracks Recording Density (BPI max.) (MFM / FM) 1670 / 830 1065 / 532 (256 byte x 26 sector) 1229 / 614 (512 byte x 15 sector) 1311 / 655 (1024 byte x 8 sector) 500 / 250 160 (80 tracks x 2 sides) 9870 1-4
REV.A PRODUCT DESCRIPTIOH Normal Density Mode Capacity (KBytes) (MFM / FM) Unformatted 1000 / 500 Formatted 655 / 328 (256 byte x 16 sector) Transfer Rate 300 / 150 Number of Tracks 160 (80 tracks x 2 sides) Recording Density (HPI max. ) 5922 Seek Speed (1 track) Seek Settling Time Head Loading Time Disk Speed Track Density Recording Method Power Consumption x 2 3 ms 15 ms 35 ms 360 RPM 96 TPI HFtl/FM 4.8 w 1.2.4 MD5501-61 Floppy Disk Drive Specification Normal Density Mode High Density Mode Capacity (KBytes) Unformatted Formatted (IBM format) Lf8 TP I 500 327.7 (8 sector) 96 TPI 1000 655.4 (16 sector) 96 TPI 1667 1065 (26 sector) Transfer Rate (Kbits/sec.) 300 Access Time (track-track)(ms) 10 Recording Density (BPI) 5876 Number of Tracks (p.er side) 40 300 5 5922 80 500 3 9870 80 Seek Settling Time Disk Speed Recording Mode Power Consumption 15 ms 360 RPH HFN 3.0 \v 1-5
Page 1 and 2: EPSON pe AX TECHNICAL MANUAL Seiko
Page 3 and 4: PRECAUTIONS Precautlonary notations
Page 5: PREFACE Thls manual descrlbes the t
Page 9: CHAPTER 1 PRODOCT DESCRIPTION TAßL
Page 12 and 13: PRODUCT DESCRIPTION REV.A WX Clock
Page 16 and 17: PRODUCT DFßCRIPTION REV.A 1.2.5 D5
Page 18 and 19: PRODUCT DESCRlPTION HEV.A 1.3 HARDW
Page 20 and 21: PRODUCT DESCRIPTION HEV.A TABU 1-3-
Page 22 and 23: PRODUCT DESCRIPTION REV.A FIGURE 1-
Page 24 and 25: 2.3.9 2.3.10 2.3.10.1 2.3.11 2.3.12
Page 26 and 27: 2-3-14 2-3-15 2-3-16 2-3-17 2-3-18
Page 29 and 30: REV.A PRINCIPLES OF OPERATION 2.1 H
Page 31 and 32: REV .A PRINCIPLES OF OPERATION 1 D1
Page 33 and 34: REV.A PRINCIPLES OF OPERATION 1) If
Page 35 and 36: REV . B PRINCIPLES OF OPERATION 2.2
Page 37 and 38: REV.A PRINCIPLES OF OPERATION A vol
Page 39 and 40: HEV.A PRINCIPLES OF OPERATION Chara
Page 41 and 42: RKV.A PRINCIPLES OF OPERATION 2.2.2
Page 43 and 44: REV.B PRINCIPLES OF OPERATION +12 +
Page 45 and 46: REV.A PRINCIPLES OF OPERATION TABLE
Page 47 and 48: N I I-' \Q 2 .3 ARTA MAHl CONTROL B
Page 49 and 50: N I N """ 2.3.1 System Clock Genera
Page 51 and 52: N I N W 2.3.1.4 Oscillator There ar
Page 53 and 54: N 2.3.2 System Reset Signal Generat
Page 55 and 56: N +5·5 ~Hls~ CN3~--·"'-" (j flJ5:
Page 57 and 58: t-,) I t-,) ID 2.3.3.3 Jumper Conne
Page 59 and 60: N ( OA TA BUS C~ TO FRO"" RA"" RA""
Page 61 and 62: N I ~ ~ 2.3.4.2 Circuit Operation o
Page 63 and 64: N I ~ To int......l ....ry GAATCK _
Page 65 and 66:
MOlS l :;1 MOl l@j { i~~~TRI l READ
Page 67 and 68:
N I wIQ - 1. . . I :>
Page 69 and 70:
!',) I oll J-I 2.3.5 "C 1/0 Devic
Page 71 and 72:
N },. w The LS612 has sixteen 12-bi
Page 73 and 74:
N I ~ GAATCK 10 GAATM21 I ino OMA 1
Page 75 and 76:
N I 01> -..I GAATCK { CPU GAATM' @
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N I ~ (16-bit bus operation) * NOTE
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N I \Jl ~ 2.3.8 Command Delay Signa
Page 81 and 82:
INT , \ DTR 00 DEN ) t +,5 INT..H C
Page 83 and 84:
N I VI \oll lOG......T... ' TOGur..
Page 85 and 86:
N I VI GAATCK GAATAB GAATRF l5590 a
Page 87 and 88:
N I VI \Cl - _.... -- - ~ AATRF GAA
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N ~,... 2.3.14 Keyboard Interface C
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N ~ IJ,) KID CLK KID DATA GAATCK GA
Page 93 and 94:
REV.A PRINCIPLES OF OPERATION 2.4 M
Page 95 and 96:
HEV.A PRINCIPLES OF OPERATION Data
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REV.A PRINCIPLES OF OPERATION 1.2 M
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REV.A PRINCIPLES OF OPERATION 2.4.3
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REV.B PRINCIPLES OF OPERATION VFO c
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REV.A PRINCIPLES OF OPERATION If DS
Page 105 and 106:
REV .A PRINCIPLES OF OPERATION 2.5
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REV.A PRINCIPLES OF OPERATION 2.5.2
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REV .A PRINCIPLES OF OPERATION T6 ~
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REV .A PRINCIPLES OF OPERATION 2.5.
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REV.A PRINCIPLES OF OPERATION (4) I
Page 115 and 116:
HEV.A PRINCIPLES OF OPERATION 2.5.7
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REV.A PRINCIPLES OF OPERATION ii) E
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REV.A PRINCIPLES OF OPERATION Key C
Page 121 and 122:
REV.A PRINCIPLES OF OPERATION 1) DE
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REV .A PRINCIPLES OF OPERATION (10)
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REV.A PRINCIPLES OF OPERATION (3) B
Page 127:
CHAPTER 3 OPTIONS TAßlE OF CONTENT
Page 131 and 132:
REV.A TROUBLESHOOTIBG 4.1 Service T
Page 133 and 134:
RKV.A TROUBLESHOOTING INSTANCE 1 In
Page 135 and 136:
REV.A TROUBLESHOOTIBG 4.3 RESPONSE
Page 137 and 138:
t PORT 80 01H 04H 05H 06H 07H or 08
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t (3) Error bit pattern (1 second)
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tt-' t-' 22H 23H 25H II GAATIO 8259
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2AH 2BH 8254-2 RAM, GAATIO option b
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t~ I.n (3AH) Unfixed value (Address
Page 147 and 148:
,... I ..... .t:' (3FH) Unfixed v
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ol:l I t \C (45H) WHDC Unfixed
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.p I N ""'" Parity check 1 80000
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Fi gure 5-1-1 5-1-2 5-1-3 5-1-4 5-1
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DIASSEMBLY AND ASSEMBLY HEV.A 5.1.3
Page 158 and 159:
DIASSEMBLY AND ASSEMBLY REV.A 5.1.7
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DIASSKMBLY AN» ASSKMBLY HEV.A 5.1.
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DISASSEMBLY AND ASSEMBLY REV.A 5.1.
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DISASSEKBLY ABO ASSEKBLY REV.A 5.1.
Page 166 and 167:
DISASSEMBLY AND ASSEMBLY REV.A 5.3
Page 168 and 169:
DISASSEMBLY AND ASSEMBLY REV.A 5.3.
Page 171:
CHAPTER 6 ADJUSTMENT AHD MAINTENANC
Page 174 and 175:
7-1-8 Factory Settings (SPFG Board)
Page 176 and 177:
DIAGRAMS AND REFERENCE MATERIALS RE
Page 178 and 179:
DIAGRAKS AHn REFERENCE MATERIALS HE
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Page 182 and 183:
DIAGRAHS AND REFERENCE MATERIALS RE
Page 184 and 185:
Page 186 and 187:
Page 188 and 189:
DIAGRAHS AHn REFERENCE MATERIALS RE
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DIAGRAMS AN» REFERENCE MATERIALS R
Page 192 and 193:
D1AGRAKS AND REFERENCE MATERIALS RE
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DIAGRAMS AHn REFERENCE MATERIALS HE
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Page 198 and 199:
DIAGRAMS AND REFERENCE MATERIALS HE
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Page 202 and 203:
DIAGRAMS AHn REFERENCE MATERIALS RE
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Page 206 and 207:
Page 208 and 209:
Page 210 and 211:
Page 212 and 213:
DIAGRAMS ARD REFERENCE MATERIALS RE
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Page 220 and 221:
DIAGRAKS AND REFERENCE MATERIALS HE
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Page 224 and 225:
Page 226 and 227:
DIAGRAMS AB» REFERENCE MATERIALS R
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Page 238 and 239:
DIAGRAMS AND REFERENCE MATERIALS KE
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Page 242 and 243:
DIAGRAHS AND REFERENCE MATERIALS HE
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Page 246 and 247:
DIAGRAMS AN» REFERENCE MATERIALS H
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Page 250 and 251:
DIAGRAMS AN» REFERENCE MATERIALS H
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Page 254 and 255:
DIAGlU\MS AND REFERENCE MATERIALS H
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Page 258 and 259:
Page 260 and 261:
Page 262 and 263:
Page 264 and 265:
DIAGRAMS ABO REFERENCE MATERIALS RE
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8.1 MAJOR PARTS 8.1.1 Excluding P.C
Page 269 and 270:
8.2 COMPONENT PARTS 8.2.1 ANTA Boar
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Unit Description ANTA Board (6) Mod
Page 273 and 274:
8.2.3 ANT-RMA Board Unit Modificati
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8.2.5 SPFG Board Unit Modification
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8.3.2 ANT-RM/RMA Board Jumper Setti
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8.3.4 WHDC Board Jumper Settings Un
Page 281:
(Xl .... I 01 8.4.2 P.C.B Unit Boar
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1 2 3 4 +5 +5 A B c o E F G H R8 Sl
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1 2 3 4 5 +5 +5 A B c o E F G H R8
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1 2 3 4 5 +5 +5 A B c o E F G H R8
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A B c D E F G H J K L M N o p 4~3 ~
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I T MD 111 I" 13 12 • 11 10 9 •
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PG TO POWER SUPPlY UNIT NO CONNECT
Page 298 and 299:
OUTPUT SOCKET ® RIII CI06 O.OI/lF
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T DACK2 2 3 4 t- 0 ...J CJ) Z 0 5 0
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A B c o E F G H 1 2 3 4 5 6 I ọ
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* +5V -r ,,;I: R2 01 ~ J27K + ~ CI
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I A B c o E F G H T 2 3 JI -DRIVE S
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134 132 126 500 \ --- ~ I 103 /~'~3
Page 311 and 312:
EPSON OVERSEAS MARKETING LOCATIONS
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