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80960KA EMBEDDED 32-BIT MICROPROCESSOR - Datasheet ...

80960KA EMBEDDED 32-BIT MICROPROCESSOR - Datasheet ...

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<strong>80960KA</strong>3.0 MECHANICAL DATA3.1. PackagingThe <strong>80960KA</strong> is available in two package types:• 1<strong>32</strong>-lead ceramic pin-grid array (PGA). Pins arearranged 0.100 inch (2.54 mm) center-to-center, ina 14 by 14 matrix, three rows around (see Figure17).• 1<strong>32</strong>-lead plastic quad flat pack (PQFP). Thispackage uses fine-pitch gull wing leads arranged ina single row along the package perimeter with0.025 inch (0.64 mm) spacing (see Figure 20).3.1.1. Pin AssignmentThe PGA and PQFP have different pin assignments.Figure 18 shows the view from the PGA bottom (pinsfacing up) and Figure 19 shows a view from the PGAtop (pins facing down). Figure 20 shows the PQFPpackage; Figure 21 shows the PQFP pinout withsignal names. Notice that the pins are numbered inorder from 1 to 1<strong>32</strong> around the package perimeter.Table 9 and Table 10 list the function of each PGApin; Table 11 and Table 12 list the function of eachPQFP pin.Dimensions for both package types are given in theIntel Packaging handbook (Order #240800).1234567891011121314A B C D E F G H J K L M N PFigure 17. 1<strong>32</strong>-Lead Pin-Grid Array (PGA) Package21

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