80960KA EMBEDDED 32-BIT MICROPROCESSOR - Datasheet ...

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80960KA3.3. Package Thermal SpecificationThe 80960KA is specified for operation when casetemperature is within the range 0°C to 85°C (PGA) or0°C to 100°C (PQFP). Measure case temperature atthe top center of the package. Ambient temperaturecan be calculated from:T J = T C + P*θ jcT A = T J + P*θ jaT C = T A + P*[θ ja −θ jc ]Values for θ ja and θ jc for various airflows are given inTable 13 for the PGA package and in Table 14 for thePQFP package. The PGA’s θ ja can be reduced byadding a heatsink. For the PQFP, however, a heatsinkis not generally used since the device is intended tobe surface mounted.Maximum allowable ambient temperature (T A )permitted without exceeding T C is shown by thegraphs in Figures 23, 24, 25 and 26. The curvesassume the maximum permitted supply current (I CC )at each speed, V CC of +5.0 V and a T CASE of +85°C(PGA) or +100°C (PQFP).If the 80960KA is to be used in a harsh environmentwhere the ambient temperature may exceed the limitsfor the normal commercial part, consider using anextended temperature device. These components aredesignated by the prefix “TA” and are available at 16,20 and 25 MHz in the ceramic PGA package.Extended operating temperature range is –40° C to+125°C (case).Figure 26 shows the maximum allowable ambienttemperature for the 20 MHz extended temperatureTA80960KA at various airflows. The curve assumesan I CC of 420 mA, V CC of 5.0 V and a T CASE of+125°C.Table 13. 80960KA PGA Package Thermal CharacteristicsThermal Resistance — °C/WattAirflow — ft./min (m/sec)Parameter0(0)50(0.25)100(0.50)200(1.01)400(2.03)600(3.04)800(4.06)θ Junction-to-Case 2 2 2 2 2 2 2θ Case-to-Ambient(No Heatsink)19 18 17 15 12 10 9θ JAθ Case-to-Ambient(OmnidirectionalHeatsink)16 15 14 12 9 7 6θ J-PINθ JCθ J-CAPθ Case-to-Ambient(UnidirectionalHeatsink)15 14 13 11 8 6 5NOTES:3. θ J-CAP = 4°C/W (approx.)1. This table applies to 80960KA PGA plugged intoθ J-PIN = 4°C/W (inner pins) (approx.)socket or soldered directly to board.θ J-PIN = 8°C/W (outer pins) (approx.)2. θ JA = θ JC + θ CA29
80960KAParameterTable 14. 80960KA PQFP Package Thermal CharacteristicsThermal Resistance — °C/Watt0(0)50(0.25)Airflow — ft./min (m/sec)100(0.50)200(1.01)400(2.03)600(3.04)θ Junction-to-Case 9 9 9 9 9 9 9θ Case-to-Ambient(No Heatsink)800(4.06)22 19 18 16 11 9 83. θ = 18°C/W (approx.)NOTES:2. θ JA = θ JC + θ CA1. This table applies to 80960KA PQFP soldereddirectly to board.JLθ JB = 18°C/W (approx.)θ JCθ JLθ JBT h T h T hCLK2CLKT 12T11HOLDT 6HT 9HHLDAFigure 22. HOLD Timing30
Page 3 and 4: CONTENTSFigure 24.Figure 25.Figure
Page 6 and 7: 80960KATable 1. 80960KA Instruction
Page 8 and 9: 80960KApurpose registers provided i
Page 10 and 11: 80960KAdebug instruction. In each c
Page 12 and 13: 80960KABE3:0OO.D.BYTE ENABLE LINES
Page 14 and 15: 80960KA2.3. Connection Recommendati
Page 16 and 17: 80960KATEMP = +22°C@5.5V@5.0V@4.5V
Page 18 and 19: 80960KA2.6. Absolute Maximum Rating
Page 20 and 21: 80960KA2.8.1. AC Specification Tabl
Page 22 and 23: 80960KA1. Clock rise and fall times
Page 24 and 25: 80960KA3.0 MECHANICAL DATA3.1. Pack
Page 26 and 27: 80960KA14 13 12 11 10 9 8 7 6 5 4 3
Page 28 and 29: 80960KA3.2. PinoutTable 9. 80960KA
Page 30 and 31: 80960KATable 11. 80960KA PQFP Pinou
Page 34 and 35: 80960KATEMPERATURE ( o C)9085807570
Page 36 and 37: 80960KA4.0 WAVEFORMSFigures 27, 28,
Page 38 and 39: 80960KAT a T w T w T d T w T d T w
Page 40 and 41: 80960KAPREVIOUSCYCLEINTERRUPTACKNOW
Page 42 and 43: 80960KA39

80960KA EMBEDDED 32-BIT MICROPROCESSOR - Datasheet ...

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