Dual-Core Intel® Xeon® Processor 5200 Series
Dual-Core Intel® Xeon® Processor 5200 Series
Dual-Core Intel® Xeon® Processor 5200 Series
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
3.4 Package Handling Guidelines<br />
44<br />
Mechanical Specifications<br />
Table 3-2 includes a list of guidelines on a package handling in terms of recommended<br />
maximum loading on the processor IHS relative to a fixed substrate. These package<br />
handling loads may be experienced during heatsink removal.<br />
Table 3-2. Package Handling Guidelines<br />
Parameter Maximum Recommended Units Notes<br />
Shear 311<br />
70<br />
Tensile 111<br />
25<br />
Notes:<br />
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.<br />
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.<br />
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top<br />
surface.<br />
4. These guidelines are based on limited testing for design characterization and incidental applications (one<br />
time only).<br />
5. Handling guidelines are for the package only and do not include the limits of the processor socket.<br />
3.5 Package Insertion Specifications<br />
The <strong>Dual</strong>-<strong>Core</strong> <strong>Intel®</strong> <strong>Xeon®</strong> <strong>Processor</strong> <strong>5200</strong> <strong>Series</strong> can be inserted and removed 15<br />
times from an LGA771 socket, which meets the criteria outlined in the LGA771 Socket<br />
Design Guidelines.<br />
3.6 <strong>Processor</strong> Mass Specifications<br />
The typical mass of the <strong>Dual</strong>-<strong>Core</strong> <strong>Intel®</strong> <strong>Xeon®</strong> <strong>Processor</strong> <strong>5200</strong> <strong>Series</strong> is 21.5 grams<br />
[0.76 oz.]. This includes all components which make up the entire processor product.<br />
3.7 <strong>Processor</strong> Materials<br />
The <strong>Dual</strong>-<strong>Core</strong> <strong>Intel®</strong> <strong>Xeon®</strong> <strong>Processor</strong> <strong>5200</strong> <strong>Series</strong> is assembled from several<br />
components. The basic material properties are described in Table 3-3.<br />
Table 3-3. <strong>Processor</strong> Materials<br />
Torque 3.95<br />
35<br />
3.8 <strong>Processor</strong> Markings<br />
Figure 3-5 shows the topside markings on the processor. This diagram aids in the<br />
identification of the <strong>Dual</strong>-<strong>Core</strong> <strong>Intel®</strong> <strong>Xeon®</strong> <strong>Processor</strong> <strong>5200</strong> <strong>Series</strong>.<br />
N<br />
lbf<br />
N<br />
lbf<br />
N-m<br />
LBF-in<br />
Component Material<br />
Integrated Heat Spreader (IHS) Nickel over copper<br />
Substrate Fiber-reinforced resin<br />
Substrate Lands Gold over nickel<br />
1,4,5<br />
2,4,5<br />
3,4,5