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High Speed Backplane Interconnect Solutions

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<strong>High</strong> <strong>Speed</strong> <strong>Backplane</strong><strong>Interconnect</strong> <strong>Solutions</strong>COMMUNICATIONS, COMPUTER & CONSUMER ELECTRONICS


<strong>High</strong> <strong>Speed</strong> <strong>Backplane</strong><strong>Interconnect</strong> <strong>Solutions</strong><strong>High</strong> <strong>Speed</strong> <strong>Backplane</strong> Connectors<strong>Speed</strong>12.5 Gbps2 Pair 3 Pair 4 PairMULTIGIG RT20.84 Pair15 Pair5.0 GbpsZ-PACK HM-ZdNewDevelopmentZ-PACK TinMan6 Row10 Row3.0 GbpsZ-PACK HS32.5 Gbps4 Row0.811.0 Gbps5 Row 8 RowMULTIGIG RT1Z-PACK 2 mm HMDensity20/8 40/16 60/24 80/32 100/40 120/48 140/56[Signal Linesper Inch/cm]0.6/15.240.8/20.321.0/25.401.2/30.48System Pitch[Inch/mm]<strong>High</strong> <strong>Speed</strong> <strong>Backplane</strong> Connectors Ranked by:• <strong>Speed</strong> Versus Signal Density• System Slot-Pitch Versus Signal Density<strong>Speed</strong>12.5 GbpsMULTIGIG RT25.0 GbpsNew DevelopmentZ-PACK TinManZ-PACK HM-Zd3.0 Gbps2.5 GbpsZ-PACK HS3MULTIGIG RT11.0 GbpsZ-PACK 2 mm HMZ-PACK 2 mm HM0.6/15.24 0.8/20.321.0/25.40 1.2/30.48SystemPitch[Inch/mm]<strong>High</strong> <strong>Speed</strong> <strong>Backplane</strong> Connectors Ranked by:• <strong>Speed</strong> Versus System Slot-PitchCatalog 1654263-1 Dimensions are in millimeters Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-3611-1514Issued 12-05 and inches unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013www.tycoelectronics.com are standard equivalents. to change. C. America: 52-55-5-729-0425 UK: 44-141-810-8967


<strong>High</strong> <strong>Speed</strong> <strong>Backplane</strong><strong>Interconnect</strong> <strong>Solutions</strong><strong>High</strong> <strong>Speed</strong> <strong>Backplane</strong> Connectors (Continued)Z-PACK 2 mm HM ProductHard Metric 2 mm pitch in accordance to IEC 917 andIEC 61076-4-101.Open pin field connector capable of supporting data rates of2.5 Gb/s depending on the S/G ratio.Modular units give flexible configurations.Extensive range of signal, power, coaxial and fibre board-to-boardand cable-to-board connections.Available in four, five, eight (and twelve-row) configurations,respectively fitting 15.25 mm (0.6″), 20.32 mm (0.8″),25.40 mm (1″) slot-pitches.Four row configuration is specially designed to fit IEC 917-2-2.Available shielded and unshielded for board and cable versions.Order Catalog 65911, “Z-PACK 2 mm HM <strong>Interconnect</strong>ionCatalog”.Z-PACK HS3 Product<strong>High</strong>-speed connector designed for both single ended anddifferential signals.Capable of supporting data rates up to 5 Gb/s.Available in 2 versions: six row and ten row, respectively fitting20.32 mm (0.8″) and 25.40 mm (1″) slot-pitches.Flexible for right-angle board-to-board & mid-plane boardconnections.Includes features such as integrated guiding, keying andESD protection.Density up to 40 signal lines per cm board space, in 25.4 mm (1″)slot-pitch.Order Catalog 1773095, “<strong>High</strong> <strong>Speed</strong> Board-to-Board Products”.Website: http://hs3.tycoelectronics.comZ-PACK HM-Zd ProductDesigned specifically for high-speed differential applications.Capable of supporting data rates up to 12.5 Gb/s.Modular connector system designed as Z-PACK 2 mm HMfamily extension.Available in two, three and four pairs/column, fitting 20.32 mm(0.8″) slot-pitch for two and three pair version and 25.4 mm (1″)slot-pitch for the four pair version.Standard four pair right-angle board-to-board connectorspecified in the PICMG 3.X Advanced TCA specifications.Density up to 32 signal lines (16 diff. Pairs) per cm board space,in 25.4 mm (1″) slot-pitch.Product family includes right-angle board-to-board, mid-planeboard, co-planar board, mezzanine board and cable-to-boardconnectors.Future plans to increase product density based on similarconnector design in SMT & Press-Fit: Z-PACK HM-Zd HD.Connector footprint optimized for improved electrical performanceand ease of trace routing (including Quad-routing to improveelectrical performance and reduce PCB cost).Order Catalog 1773095, “<strong>High</strong> <strong>Speed</strong> Board-to-Board Products”.Website: http://www.tycoelectronics.com/zpackmaxCatalog 1654263-1 Dimensions are in millimeters Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-3611-1514Issued 12-05 and inches unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013www.tycoelectronics.com are standard equivalents. to change. C. America: 52-55-5-729-0425 UK: 44-141-810-8967


<strong>High</strong> <strong>Speed</strong> <strong>Backplane</strong><strong>Interconnect</strong> <strong>Solutions</strong><strong>High</strong> <strong>Speed</strong> <strong>Backplane</strong> Connectors (Continued)MULTIGIG RT ProductPinless backplane connector capable of supporting data ratesup to 12.5 Gb/s.Available in two tiers, third tier in development.Available in 2 versions per tier: 0.8″ and 1″, respectively fitting20.32 mm (0.8″) and 25.4 mm (1″) slot-pitches.Up to 56 high-speed lines per cm board space, in 25.4 mm (1″)slot-pitch.Connector system specified in VME standards:VITA 41 & VITA 46.Daughtercard connector utilizes a PCB construction, whichallows the connector system to have extreme flexibility.100 Ohm differential, 50 Ohm single ended, open pin field andpower wafers can be mixed within one connector module.Future plans to include components, active and passive, withinthe daughtercard connector.Order Catalog 1773095, “<strong>High</strong> <strong>Speed</strong> Board-to-Board Products”.Website: http://www.multigigrt.comZ-PACK TinMan <strong>Backplane</strong> Connector SystemDesigned for high density, high-speed applications.Capable of supporting data rates up to 12.5 Gb/s.Connector uses a “shieldless” construction.Available in two versions: four and five pair/column, respectivelyfitting 20.32 mm (0.8″) and 25.4 mm (1″) slot pitches.Density up to 52 high-speed signal lines per cm board space,in 25.4 mm (1″) slot-pitch.Pin headers are available in three styles:open ended, single closed end and dual closed end.Product extensions planned include: 3 pair/column receptaclesand header, right-angle pin headers (coplanar), vertical receptacles(mezzanine) and cable assemblies.Order Catalog 2-1773441-5, “Z-PACK TinMan <strong>High</strong> <strong>Speed</strong>,<strong>High</strong> Density <strong>Backplane</strong> Connector”.Website: http://www.tycoelectronics.com/zpacktinmanCatalog 1654263-1 Dimensions are in millimeters Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-3611-1514Issued 12-05 and inches unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013www.tycoelectronics.com are standard equivalents. to change. C. America: 52-55-5-729-0425 UK: 44-141-810-8967


<strong>High</strong> <strong>Speed</strong> <strong>Backplane</strong><strong>Interconnect</strong> <strong>Solutions</strong>Signal Integrity at Tyco Electronics<strong>High</strong> <strong>Speed</strong> <strong>Backplane</strong> Connectors (Continued)Tyco Electronics gets the best performance out of connectors by applying system-level signal integrity design expertise to each high-speedproduct. Our modeling and simulation skills are second to none with global expertise in the U.S., Europe, and Asia. Our global presenceplaces simulation, modeling, and system layout experts next to the customer.Modeling and SimulationAt Tyco Electronics the design process starts with signal integrity. Signal Integrity Engineers use sophisticated 3D tools to provide accurateconnector and footprint via pattern performance prior to production. Tyco Electronics has the tools and expertise to get the right answer.● HFSS and MICROWAVESTUDIO Full-wave 3D tools● Both connector and footprintvia pattern(s) analyzed beforeproduction● S-parameter and SPICEanalysis● Sophisticated ADS and Matlabsystem analysisTest CapabilityWith measurement capabilities beyond 12.5 Gbps and 50 GHz, Tyco Electronics can characterize and provide detailed measurementsfor its products. Cutting-edge measurement calibration techniques and board design enable accurate de-embedding of test fixtures.Tyco Electronics has also teamed with numerous silicon companies to provide active device measurements that can be invaluable to assurethe successful implementation of a design.● Advanced calibration techniques de-embed fixture● Frequency domain to 50 GHz● Time domain eye pattern/BERT to 12.5 Gbps● Active silicon testing – multiple vendors 2 – 10+ Gbps● Both system and “connector only” boardsCustomer Support and ToolsFrom test boards to simulation models, Tyco Electronics provides a library of tools that help you successfully implement your system.Requests can be easily made through our signal integrity website: www.tycoelectronics.com/products/simulation● Measurement based S-parameter connector models (64+ ports)● Modeling based S-parameter connector models (64+ ports)● Footprint via pattern S-parameter and SPICE models● SPICE connector models● Connector evaluation test boards● System test boardsCatalog 1654263-1 Dimensions are in millimeters Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-3611-1514Issued 12-05 and inches unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013www.tycoelectronics.com are standard equivalents. to change. C. America: 52-55-5-729-0425 UK: 44-141-810-8967


Supported by technology know-how,Tyco Electronics also serves theCommunications Industry where it is well placedto supply solutions for today and tomorrow,regarding applications such as networkinghardware, switching and transmissionequipment, cellular phones and base stations.Using computer simulation and analysis, thesystem performance can be tested which helpscustomers’ accelerating development cycles andconsequently leads to cost reductions. Our earlyinvolvment at the concept stage enables us todevelop interconnection systems for the nextgeneration of products at higher speed orimproved packaging.For the rapidly changing requirements in theComputer and Entertainment ElectronicsIndustry, Tyco Electronics is continuing itscost-effective development of high performance,high-density systems.These high performancesystems are used throughout the industry suchas laptops and PCs, workstations, servers,background store systems and also in discdrives.For the Telecommunications Industry,Tyco Electronics designs and manufacturessealants and adhesives that weather-proof andprotect telephone and CATV networks; and acomplete line of splices and interconnectproducts for copper, fiber optics and coaxialcable networks for application from exchanged/head end to the subscriber premises. Ourcommitment to customers is demonstratedin the global sales service and support offeredby an extensive sales network, businessdevelopment and applications engineers.Welcome to Global Communications,Computer & Consumer ElectronicsWe invite you to take the Internet tourwww.tycoelectronics.comwww.tycoelectronics.com/communications/www.tycoelectronics.com/computer/Detailed Product Information is available at the following Tyco Electronics Companies:Tyco Electronics AMP GmbHAMPèrestr. 12–1464625 BensheimPhone: +49-(0)6251-133-0Fax: +49-(0)6251-133-1600www.tycoelectronics.comAMP, MULTIGIG RT, TinMan, TYCO and Z-PACK are trademarks.Advanced TCA is a trademark of PICMG-PCIIndustrial Computer Mfg’s Group.VITA is a trademark of VMEbus International TradeAssociation.© 2005 Tyco International1654263-1 Issued 05-2007 Rev. PASEurope/Middle East/AfricaGermany – BensheimPhone: +49-6251-133-1499Fax: +49-6251-133-1600Product Information CenterPhone: +49-6251-133-1999Fax: +49-6251-133-1988BerlinProduct Information CenterPhone: +49-30-38638-775Fax: +49-30-38638-545Austria – ViennaPhone: +43-1-90-560-0Fax: +43-1-90-560-1333Belgium – Kessel-LoPhone: +32-16-352-300Fax: +32-16-352-352Czech Republic – KurimPhone: +420-5-41-162-111Fax: +420-5-41-162-223Denmark – GlostrupPhone: +45-434-804-62Fax: +45-434-414-14Finland – HelsinkiPhone: +358-95-12-34-20Fax: +358-95-12-34-250France – Cergy-PontoisePhone: +33-1-3420-8888Fax: +33-1-3420-8600Tyco Electronics Export –Cergy-PontoisePhone: +33-1-3420-8866Fax: +33-1-3420-8300Hungary – BudapestPhone: +36-1-289-1000Fax: +36-1-289-1010India – PunePhone: +91-20-5607-1770Fax: +91-20-2663-2294Italy – CollegnoPhone: +39-011-401-2111Fax: +39-011-403-1116Netherlands –’s-HertogenboschPhone: +31-73-6246-246Fax: +31-73-6212-365Norway – NesbruPhone: +47-66-77-88-99Fax: +47-66-77-88-55Poland – WarsawPhone: +48-22-4576-700Fax: +48-22-4576-720Russia – St. PetersburgPhone: +7-812-325-30-83Fax: +7-812-325-32-88South Africa – Port ElisabethPhone: +27-41-503-4500Fax: +27-41-503-0440Spain – BarcelonaPhone: +34-93-291-0330Fax: +34-93-201-7879Sweden – Upplands VäsbyPhone: +46-8-5072-5000Fax: +46-8-5072-5001Switzerland – SteinachPhone: +41-71-447-0447Fax: +41-71-447-0444Turkey – IstanbulPhone: +90-212-281-8181..3Fax: +90-212-281-8184United Kingdom – StanmorePhone: +44-8706-080-208Fax: +44-208-954-6234United Kingdom – SwindonPhone: +44-8706-080-208Fax: +44-1793-572-516AmericasUSA – Harrisburg, PAPhone: +1-717-564-0100Fax: +1-717-986-7575Troy, MIPhone: +1-248-273-3359Toll free:+1-877-216-7829Fax: +1-248-273-3322Customer ServicePhone: +1-800-522-6752Canada – TorontoPhone: +1-905-475-6222Fax: +1-905-474-5520Mexico – Mexico CityPhone: +52-5-729-0400Fax: +52-5-361-8545Brasil – São PauloPhone: +55-11-2103-6000Fax: +55-11-2103-6200Asia/PacificJapan – KawasakiPhone: +81-44-844-8079Fax: +81-44-844-8733Australia – SydneyPhone: +61-2-9554-2600Fax: +61-2-9150-0246Korea – SeoulPhone: +82-2-3415-4586Fax: +82-2-3486-3595Malaysia – SelangorPhone: +60-3-7805-3055Fax: +60-3-7805-3066People’s Republic of China –ShanghaiPhone: +86-21-6485-7333Fax: +86-21-6485-6222

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