High Speed Backplane Interconnect Solutions

High Speed BackplaneInterconnect SolutionsHigh Speed Backplane Connectors (Continued)Z-PACK 2 mm HM ProductHard Metric 2 mm pitch in accordance to IEC 917 andIEC 61076-4-101.Open pin field connector capable of supporting data rates of2.5 Gb/s depending on the S/G ratio.Modular units give flexible configurations.Extensive range of signal, power, coaxial and fibre board-to-boardand cable-to-board connections.Available in four, five, eight (and twelve-row) configurations,respectively fitting 15.25 mm (0.6″), 20.32 mm (0.8″),25.40 mm (1″) slot-pitches.Four row configuration is specially designed to fit IEC 917-2-2.Available shielded and unshielded for board and cable versions.Order Catalog 65911, “Z-PACK 2 mm HM InterconnectionCatalog”.Z-PACK HS3 ProductHigh-speed connector designed for both single ended anddifferential signals.Capable of supporting data rates up to 5 Gb/s.Available in 2 versions: six row and ten row, respectively fitting20.32 mm (0.8″) and 25.40 mm (1″) slot-pitches.Flexible for right-angle board-to-board & mid-plane boardconnections.Includes features such as integrated guiding, keying andESD protection.Density up to 40 signal lines per cm board space, in 25.4 mm (1″)slot-pitch.Order Catalog 1773095, “High Speed Board-to-Board Products”.Website: http://hs3.tycoelectronics.comZ-PACK HM-Zd ProductDesigned specifically for high-speed differential applications.Capable of supporting data rates up to 12.5 Gb/s.Modular connector system designed as Z-PACK 2 mm HMfamily extension.Available in two, three and four pairs/column, fitting 20.32 mm(0.8″) slot-pitch for two and three pair version and 25.4 mm (1″)slot-pitch for the four pair version.Standard four pair right-angle board-to-board connectorspecified in the PICMG 3.X Advanced TCA specifications.Density up to 32 signal lines (16 diff. Pairs) per cm board space,in 25.4 mm (1″) slot-pitch.Product family includes right-angle board-to-board, mid-planeboard, co-planar board, mezzanine board and cable-to-boardconnectors.Future plans to increase product density based on similarconnector design in SMT & Press-Fit: Z-PACK HM-Zd HD.Connector footprint optimized for improved electrical performanceand ease of trace routing (including Quad-routing to improveelectrical performance and reduce PCB cost).Order Catalog 1773095, “High Speed Board-to-Board Products”.Website: http://www.tycoelectronics.com/zpackmaxCatalog 1654263-1 Dimensions are in millimeters Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-3611-1514Issued 12-05 and inches unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013www.tycoelectronics.com are standard equivalents. to change. C. America: 52-55-5-729-0425 UK: 44-141-810-8967