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FOUP Load Port

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<strong>FOUP</strong> <strong>Load</strong> <strong>Port</strong>MODEL: TAS300TYPE: E4Product SpecificationsNote◇Specifications and design may be changed without prior notice.E190E120 2005/JUL


1. IntroductionThe TAS 300 is installed in a variety of semiconductor manufacturing machines and is a standard load portthat automatically opens/closes the <strong>FOUP</strong> (Front Opening Unified Pod) used in the semiconductormanufacturing process.All semiconductor-manufacturing machines require a low dust level, high throughput and repetition durability.And the TAS 300 provides the highest performance to meet these demands.2. Features(1) Complies with the SEMI Standard.E15.1-1104 Specification for 300mm tool load portE57-0600EMechanical specification for kinematic couplings used to align and support 300mm wafercarriersE62-0703E Provisional specification for 300mm front-opening interface mechanical standard (FIMS)E63-1104 Mechanical specification for 300mm box opener/loader to tool standard (BOLTS-M) interfaceE64-0600 Specification for 300mm cart to SEMI E15.1docking interface port(2) The movable parts (including the mapping unit) are installed in level below the wafer surface. Theworld’s highest level particle free environment is achieved by complete airflow analysis.(3) An air-cushion method is used for the docking plate and the FIMS door. This means that TAS300provides complete and reliable opening/closing of various <strong>FOUP</strong> (according to SEMI E47.1 and E62)without an individual adjustment.(4) An optional mapping unit (transmission sensor) can be installed.(5) The TAS 300 maintains reliable and high performance for door opening/closing repeated operationsover prolonged periods and has high durability.(6) The TAS 300 has an obstacle detection function when the <strong>FOUP</strong> is docked.(7) The TAS 300 has functions that detect the <strong>FOUP</strong> (when the <strong>FOUP</strong> is loaded) and detect its correctposition.(8) The TAS 300 has a load port positioning mechanism on the BOLTS surface that shortens the loadport installation/removal time.1E190E120


3. Basic Specifications3-1 Applicable <strong>FOUP</strong>sManufacturer Model NotesEntegris F300・A300 A300: Manufactured by former AsystShin-Etsu Polymer300E・300EXDainichi ShojiSF300-02MiraialKT-3003Other300mm <strong>FOUP</strong> complies with SEMI E47.1 andE62.3-2 Mechanical SpecificationsDimensions/WeightHeight1,386mmWidth472mmDepth 493mm From the BOLTS surfaceWeight 60kg Mapping: included, Other options: not includedOperation timeNo mapping Open 10sec or less <strong>FOUP</strong> insertion ~ Robot access enabled( Standard Close 10sec or less Robot access enabled ~ <strong>FOUP</strong> ejection enabledspecifications )With mapping Open 20sec or less <strong>FOUP</strong> insertion ~ Robot access enabled( Optionalspecifications )Close 10sec or less Robot access enabled ~ <strong>FOUP</strong> ejection enabledDocking mechanism<strong>FOUP</strong> clamp Front Retaining Feature Air driven<strong>FOUP</strong> door holdVacuum suctionDocking stroke70mmRepeatability precision±0.1mmFDP ~ FIMS door distance 165.0mmFDP ~ frame distance166.5mmUtility/OtherClean dry Pressure 0.52 ~ 0.60MPa ( G )air Flow 30L/min ( ANR )External diameter 6mm air tubeVacuumPressure -61±10kPa ( G )Flow 10L/min ( ANR )External diameter 6mm air tubeExhaustExternal diameter 6mm air tubeNoise MAX 60Db ( Aeq )2E190E120


3-3 Electrical SpecificationsInterface specifications *1Connector Purpose NotesCNA1 Power DC24V 3ACNA2 Upper communication RS-232C communication : D-sub 9 pin ( male )CNA3 Maintenance terminal RS-232C communication : D-sub 9 pin ( male )communicationCNA4 Parallel I/O D-sub 25 pin ( male ) *2CNA5 Operation panel I/O TAS300 indicator control : D-sub 15 pin ( female )CNA6 CID communication CID communication ( option ) : D-sub 9 pin ( male/female )CNA7 AMHS communication AMHS communication ( option ) : D-sub 25 pin ( male )CNA8 CID communication CID communication ( option ) : D-sub 9 pin ( male/female )PowerUtilityDC24V±5% 3A ( Full-load current : 2A ) Circuit breaker rating : 50A*1. For details, see the separate interface specifications.*2. The D-sub 15 pin connector can be used ( option ).3-4 EnvironmentUsage environmentAmbient temperature 5 ~ 30°CAmbient humidity 30~80% 20°C : 90% or less, 40°C : 50% or less( no condensation )Ambient Working area300Luxbrightness Operation area 500LuxAltitudeSea level 1,000m orlowerOtherInstall the machine in a clean roomStorage environmentAmbient temperature -10 ~ 55°CAmbient humidity 30 ~ 85%( no condensation )3E190E120


3-5 Operation Flow(1) <strong>Load</strong><strong>FOUP</strong> clamp <strong>FOUP</strong> docking <strong>FOUP</strong> door - SuctionWafer mappingMapping arm: ForwardStopper: ON<strong>FOUP</strong> unlatchMapping arm: RetractDescends to the mappingstarting positionFIMS door: OpenStopper: OFFFIMS door: DescendsFIMS door: Descends* Area with dotted lines: With mapping( See “5. Options: Mapping unit” )Wafer transport robot access: Enables(2) Unload<strong>FOUP</strong> latchFIMS door: CloseFIMS door: Ascends<strong>FOUP</strong> door: Suction cancel <strong>FOUP</strong> undocking <strong>FOUP</strong> unclamp4E190E120


3-6 Detection Function<strong>FOUP</strong> presence detection<strong>FOUP</strong> placement check透 過 式 センサ 光 軸Transmission sensor optical axisセンサピン/フォトマイクロセンサSensor pin/Photo microsensor<strong>FOUP</strong> docked: Obstacle detectionWafer protrusion in <strong>FOUP</strong>透 過 式 センサ 光 軸Transmission sensor optical axisウエハwafer透 過 式 センサ 光 軸Transmision sensor optical axis<strong>FOUP</strong> door detection*※<strong>FOUP</strong> Wafer protrusion シェルシール (3mm) is 面 detected よりfrom 3 mm 飛 the 出 <strong>FOUP</strong> 状 態 shell を 検 seal 出 surface.*※ガラスウエハ Glass wafer function: 対 応 Optional はオプション 仕 様センサピン/フォトマイクロセンサSensor pin/Photo microsensor5E190E120


3-7 IndicatorOP.ACCESS(Green) (Amber) (White)(Yellow)(Green)Blank(Red)(Yellow)(Yellow)(ブランク)LOADUNLOADOP.ACCESS PRESENCEPLACEMENTALARMSTATUS1STATUS2SPARE6E190E120


3-8 External ViewドッキングテーブルDocking tableCID リーダー/ライター *オプションCID reader/writer *OptionalマニュアルスイッチManual switch正 常 載 置 センサCollect load sensorキネマッティックピンKinematic pin上 カバーTop coverインジケータIndicator<strong>FOUP</strong> クランプ<strong>FOUP</strong> clampカムロックCam lockテーブルベースTable baseBOLTS 面 シール*オプションBOLTS surface seal *OptionalBOLTS 面 ( 取 付 面 )BOLTS surface (Installation surface)ラッチキーLatch key吸 着 パッドSuction padFIMS ドアFIMS doorサイドベースSide baseマッピングアーム *オプションMapping arm *Optional下 カバーLower cover電 源 コネクタ(カバー 内 )Power connector(Inside the cover)カムロックCam lock光 I/O*オプションOptical I/O*OptionalF l o o r チューブコネクタ(CDA、 真 空 、 排 気 :カバー 内 )Tube connectors(CDA、Vacuum、Exhaust:Inside the cover)通 信 コネクタ(カバー 内 )Communication connectors(Inside the cover)7E190E120


3-9 Dimensions※FDP:Facial Datum PlaneFDP(When <strong>FOUP</strong> is undocked)BOLTSPlane70 17344Bilateral Datum Plane416(SEMI E63 x71)FDP(When <strong>FOUP</strong> is docked)472 493 (99)166.5HorizontalDatum Plane1069001386(22)1189(SEMI E63 z71・z76)Floor※unit:mm8E190E120


4. Installation Environment4-1 Mechanical Interface4 - M8* 本 体 取 付 ネジ*Main unitinstration screw(ロードポート 本 体 寸 法 )472(<strong>Load</strong> port main unit dimension)215 215208 2082 2FacialDatumBOLTSPlanePlane22(ロードポート 本 体 寸 法 )486(<strong>Load</strong> port main unit dimension)455.5395BilateralDatum PlaneHorizontalDatum Plane開 口 部Opening開 口 部Opening(ロードポート 本 体 寸 法 )862(<strong>Load</strong> port main unit dimension)794832150.259003Floor面 の 傾 き 支 点Surface inclination fulcrum point※unit:mm* Complies with SEMI Standard E63-1104.* Specifications for the load port installation surface on the machine side.* In order to prevent particles from outside, maintain ( Internal pressure of equipment ) − ( External pressure of equipment ) ≥ 2Pa.* For the communication interface, see the separate “Interface Specifications”.9E190E120


4-2 Working Area* Front of the load port: 1m後 側Rear前 側Front( 作 業 領 域 )1m (Working Area)4-3 Preparation(1) Installation tools1 Horizontal jig: <strong>Load</strong> port Horizon Calibration Jig ( 99MC104A: Nikon ) *Recommended2 Plum bob: To check the inclination of the bolt plane3 Square: 300mm with frame ( FD107: Ohbishi Keiki ) *Recommended4 Parallel ber: L250mm×H35mm×W25mm ( LC103: Ohbishi Keiki ) *Recommended5 Scale: 1,000mm6 Flat level: L100mm×H40mm×W35mm×0.05mm/m ( AD102: Ohbishi Keiki ) *Recommended7 General tools8 <strong>Load</strong> port installation jigs: Option ( S54F1550: TDK )(2) Operation check1 Power cable: Connector 206060-1・Pin 66101-1 ( Tyco Electronics AMP )2 Air tube: External diameter 6mm ( Clean dry air source・Vacuum source・Exhaust )3 PC: Windows95・98・ME・NT4.0・2000・XP with serial I/F4 RS232C cable: D-sub 9-Pin cross-cable5 Maintenance tools: Option ( Recorded in the CD-R Manual )4-4 Accessories1 Adjustment plate A・B2 Mechanical stopper3 Interlock release key4 Electrical setting management table5 Inspection record form6 Written guarantee7 Invoice10E190E120


5. OptionsWafer skew Skip one shelfdetection ( See Fig. 1 )Skip two shelves( See Fig. 2 )Start loadingAllowedNotAllowedMapping unitFig. 1 Fig. 2ドア 正 面 よりFront view(door)〇 <strong>FOUP</strong> 載 置Place the <strong>FOUP</strong>〇 <strong>FOUP</strong> クランプ<strong>FOUP</strong> clamp〇 <strong>FOUP</strong> ドッキングDock the <strong>FOUP</strong>〇 <strong>FOUP</strong> ドア 吸 着<strong>FOUP</strong> door suction〇 <strong>FOUP</strong> ドアアンラッチUnlatch the door〇 マッピングアーム 前 進 〇 マッピング 開 始 位 置 へ 下 降 〇 ドアオープンMapping arm: Forward Descends to the mapping starting position Open the door〇 ウエハマッピング 〇 マッピングアーム 後 退 〇 ドア・マッピングアーム 下 降Wafer mapping Mapping arm: Retract Door & mapping arm descendsEnd of loading11E190E120


Power cableConnector name Connector 206060-1 ( Tyco Electronics AMP )CNA1 Contact pin 66101-1 ( Tyco Electronics AMP )Fitting tool 58495-1 ( Tyco Electronics AMP )Cable clamp 206062-1 ( Tyco Electronics AMP )WireRO-FLEX 1100T AWG19 3 cores ( Nichigoh Communication ElectricWire )Wire length2m・4m・6m123DC24V(Black 1)FG(Green/Yellow)DC0V(Black 2)4 ※ Sheathed length:2m/4m/6mDC24VFGDC0V※ Mark the tubes with "DC24V"/"FG"/and"DC0V"OtherKeyence BL-601Omron V700-HMD13A・V640Carrier IDBrooks TLG Series ( Manufactured by former Hermos )Reader/WriterAsyst ATR9000・ATR9100・PB-90For other CID, contact TDK.AMHS (Optical I/O) DMS-HB1・DMG-HB1 ( Hokuyo Automatic )Info Pad PinInfo Pad A・B Electrical detection・Lock out pinInfo Pad C・D Lock out pinOverlapped wafer sensorDetects if two wafers are stacked in a slot.For details, contact TDK.Quartz glass wafer protrusionsensorThe detection characteristics differ depending on the <strong>FOUP</strong> used.For details, contact TDK.BOLTS surface seal material T/#9096-TB-54 ( Nichias )CE markingFor details, contact TDK.<strong>Load</strong> port installation jig For details, contact TDK.Cross mark jig for OHT For details, contact TDK.ManualCD-R ( Maintenance tools is Recorded ) ・Booklet6. Warnings, Cautions and Notes on Operation SafetyTDK provides an instruction manual that describes product characteristics and specifications. Toensure safe operation and to prevent accidents by operating the machine incorrectly, please readcarefully the instruction manual before using the product. Contact TDK for a copy of the instructionmanual.12E190E120

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