Thesis Defense Presentation

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Contributions• Design: Starting zone to reduce the pull-in voltage• Numerical modeling: easier and more accurate• Optimization of the system• Specified design for implementation in a relay• Fabrication and measurement of the actuator-relay• Wet-anisotropically-etched micro relay contact23Fabrication: Process Flow (1)Starting substrate: 4''DSP Si WaferSpin and pattern 10 µmof photoresistDRIE etch throughStrip photoresist inPiranha, RCA cleanGrow 0.2 µm ofthermal oxidevSilicon Silicon Oxide Photoresist2412
Fabrication: Process Flow (2)Starting substrate: 4''DSP Si WaferSpin and pattern 10 µmof photoresistDRIE etch throughStrip photoresist inPiranhaBond shadow waferand device wafer, etchoxide selectivelySeparate wafers, cleandevice wafer in PiranhaSilicon Silicon Oxide Photoresist25Fabrication: Process Flow (3)Starting substrate: 4''Pyrex 7740 wafer, 500mm thickDeposite 0.005 mm Ti,0.03 mm CrPattern Cr in CR-7Etch Pyrex 50 mm in49% HFBond device wafer toPyrex wafer at 800 Vand 350 degree CSputter Au on relaycontactsSilicon Silicon Oxide PhotoresistTitaniumChromiumGold2613
Page 1 and 2: Electrostatic Zipping Actuators and
Page 3: F-D Curve of Three Electrostatic Ac
Page 6: Design: Compliant Starting Zone•T
Page 9 and 10: Forces: Actuator vs. Switch Beam•
Page 11: Contributions• Design: Starting z
Page 15 and 16: Measurement: Pull_in of the Startin
Page 17 and 18: Switching Time• Contact bouncetim
Page 19 and 20: KOH-etched Relay Contacts: Experime
Page 21 and 22: Acknowledgements• Advisors: Prof.
Page 23 and 24: •Beam equation:( E I w'')''+ T w'
Page 25: •Far from x = sy( x) B( x s)Analy

Thesis Defense Presentation

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