Robin Z5xx Datasheet - Toradex
Robin Z5xx Datasheet - Toradex
Robin Z5xx Datasheet - Toradex
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<strong>Robin</strong> <strong>Z5xx</strong> <strong>Datasheet</strong>8. Thermal considerationsThermal management is an important part of a Design with a <strong>Robin</strong> <strong>Z5xx</strong> module. Designers mustanalyze the application and design an appropriate thermal solution. <strong>Toradex</strong> provides heatsink orheatspreader as a possible part for a final design.8.1. Temperature RangeDescription <strong>Robin</strong> <strong>Z5xx</strong> V1.0 / V2.0 UnitMin Typ MaxOperation Temperature 1) 0 60 °CStorage Temperature -10 85 °C1) Maximum temperature depends on the cooling solution.8.2. Notes for a custom heatsink or heatspreaderDO NOT use electrically conductive thermal grease, paste or interface material!!!Using thermal grease is not recommendedThe height of the SCH and CPU varies; the thermal solution must be adaptive to the height.See chapter: 9.3.3 Details with height informationUsing a thermal gap pad (=TIM (thermal interface material)) instead of thermal grease ishighly recommended.Recommended TIM:oTIM thickness: 1mmo TIM Hardness: 5 W/(mK)TIM Resistance: >10^13 OhmRecommendation for distance from nominal CPU/SCH height to Heatsink: 0.5mm if usingrecommended TIM (thermal interface material).o Distance from PCB to Heatsink for SCH: 2.4 mmo Distance from PCB to Heatsink for CPU: 1.9mm<strong>Toradex</strong> AG l Altsagenstrasse 5 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l info@toradex.com Page | 43
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