Test Technology Technical Council - BiTS Workshop

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Burn-in & Test SocketWorkshopSupplier DisplaysCompanies Displaying3M Electronics & Inabata America Corp. Pycon, IncHandling DivisionEles Semiconductor Johnstech International Rika Denshi America,Inc.Enplas Tesco, Inc. Kulicke & SoffaRS Tech, Inc.Industries, Inc.Everett CharlesTechnologiesLoranger InternationalCorporationShin-Etsu PolymerAmerica, Inc.EWI Electro World, Inc. M&M Specialities, Inc. Texas InstrumentsGryphics, Inc. Micro Control Company Wells-CTIHoneywell ElectronicMaterialsNepenthePlastronicsYamaichi Electronics
Burn-in & Test SocketWorkshopTechnical Program• Panel Discussion: "Broad Package Specifications: And TheSocket Is Expected To Always Work?"• Guest Speaker - Dr. Tom DiStefano! “Wafer Level Paradigm For Burn-in And Test”• Burn-in: Product Trends And Manufacturing Challenges• Directions in Test Socketing• Electrical And Mechanical Modeling And Analysis• Burn-in Board Design• Methods In Burn-in And Test• Thermal Management Approaches• Advancements In Socket Products• Test And Burn-in At The Wafer Level
Page 1 and 2: Burn-in & TestSocket WorkshopIEEEWE
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Page 15 and 16: IEEE SPECTRUM Magazine
Page 17 and 18: IEEE Newspaper‘the institute’
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