12.07.2015 Views

Test Technology Technical Council - BiTS Workshop

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Burn-in & <strong>Test</strong> Socket<strong>Workshop</strong><strong>Technical</strong> Program• Panel Discussion: "Broad Package Specifications: And TheSocket Is Expected To Always Work?"• Guest Speaker - Dr. Tom DiStefano! “Wafer Level Paradigm For Burn-in And <strong>Test</strong>”• Burn-in: Product Trends And Manufacturing Challenges• Directions in <strong>Test</strong> Socketing• Electrical And Mechanical Modeling And Analysis• Burn-in Board Design• Methods In Burn-in And <strong>Test</strong>• Thermal Management Approaches• Advancements In Socket Products• <strong>Test</strong> And Burn-in At The Wafer Level

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