section 1 - World Intellectual Property Organization
section 1 - World Intellectual Property Organization
section 1 - World Intellectual Property Organization
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12/2002<br />
5706 PCT Gazette - Section I - Gazette du PCT 21 Mar/mar 2002<br />
EE (Utility model / modèle d’utilité) ESFI<br />
FI (Utility model / modèle d’utilité) GBGD<br />
GE GH GM HR HU ID IL IN IS JP KE KG<br />
KP KR KZ LC LK LR LS LT LU LV MA<br />
MD MG MK MN MW MX MZ NO NZ PH<br />
PL PT RO RU SD SE SG SI SK SK (Utility<br />
model / modèle d’utilité) SLTJTMTRTT<br />
TZ UA UG US UZ VN YU ZA ZW.<br />
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ<br />
UG ZW); EA (AM AZ BY KG KZ MD RU<br />
TJ TM); EP (AT BE CH CY DE DK ES FI<br />
FR GB GR IE IT LU MC NL PT SE TR); OA<br />
(BF BJ CF CG CI CM GA GN GQ GW ML<br />
MR NE SN TD TG).<br />
Published / Publiée :(c)<br />
(51) 7 G03F 7/004<br />
(11) WO 02/23273<br />
(21) PCT/JP01/07826<br />
(13) A2<br />
(22) 10 Sep/sep 2001 (10.09.2001)<br />
(25) en (26) en<br />
(30) 2000-275704 11 Sep/sep 2000<br />
(11.09.2000)<br />
JP<br />
(30) 60/238,046 6 Oct/oct 2000<br />
(06.10.2000)<br />
US<br />
(30) 2000-367131 1 Dec/déc 2000<br />
(01.12.2000)<br />
JP<br />
(30) 60/256,916 21 Dec/déc 2000<br />
(21.12.2000)<br />
US<br />
(30) 2001-088113 26 Mar/mar 2001<br />
(26.03.2001)<br />
JP<br />
(30) 2001-268392 5 Sep/sep 2001<br />
(05.09.2001)<br />
JP<br />
(43) 21 Mar/mar 2002 (21.03.2002)<br />
(54) PHOTOSENSITIVE COMPOSITION,<br />
CURED ARTICLE THEREOF, AND<br />
PRINTED CIRCUIT<br />
THE SAME<br />
BOARD USING<br />
COMPOSITION PHOTOSENSIBLE,<br />
ARTICLE DURCI PREPARE AVEC<br />
CETTE COMPOSITION, ET CARTE DE<br />
CIRCUIT IMPRIME COMPRENANT<br />
CET ARTICLE<br />
(71) SHOWA DENKO K.K. [JP/JP]; 13-9,<br />
Shibadaimon 1-chome, Minato-ku, Tokyo<br />
105-8518 (JP).<br />
(for all designated States except / pour tous<br />
les États désignés sauf US)<br />
(72, 75) TAMURA, Kenji [JP/JP]; Showa Denko<br />
K.K., Central Research Laboratory, Kawasaki<br />
Research Laboratory, 3-2, Chidori-cho,<br />
Kawasaki-ku, Kawasaki-shi, Kanagawa<br />
210-0865 (JP). HIRATA, Motoyuki [JP/JP];<br />
Showa Denko K.K., Central Research Laboratory,<br />
Kawasaki Research Laboratory, 3-2,<br />
Chidori-cho, Kawasaki-ku, Kawasaki-shi,<br />
Kanagawa 210-0865 (JP). KANEMARU,<br />
Yoshikazu [JP/JP]; 96-25, Motohachioji-cho<br />
1-chome, Hachioji-shi, Tokyo 193-0826 (JP).<br />
(74) SHIGA, Masatake et al. / etc.; OR Building,<br />
23-3, Takadanobaba 3-chome, Shinjuku-ku,<br />
Tokyo 169-8925 (JP).<br />
(81) AE AG AL AM AT AU AZ BA BB BG BR<br />
BY BZ CA CH CN CO CR CU CZ DE DK<br />
DM DZ EC EE ES FI GB GD GE GH GM<br />
HR HU ID IL IN IS KE KG KR KZ LC LK<br />
LR LS LT LU LV MA MD MG MK MN MW<br />
MX MZ NO NZ PH PL PT RO RU SD SE SG<br />
SI SK SL TJ TM TR TT TZ UA UG US UZ<br />
VN YU ZA ZW.<br />
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ<br />
UG ZW); EA (AM AZ BY KG KZ MD RU<br />
TJ TM); EP (AT BE CH CY DE DK ES FI<br />
FR GB GR IE IT LU MC NL PT SE TR); OA<br />
(BF BJ CF CG CI CM GA GN GQ GW ML<br />
MR NE SN TD TG).<br />
(51) 7 G03F 7/004<br />
(11) WO 02/23274 (13) A2<br />
(21) PCT/US01/28195<br />
(22) 8 Sep/sep 2001 (08.09.2001)<br />
(25) en (26) en<br />
(30) 60/231,640 11 Sep/sep 2000 US<br />
(11.09.2000)<br />
(30) 60/234,652 22 Sep/sep 2000 US<br />
(22.09.2000)<br />
(43) 21 Mar/mar 2002 (21.03.2002)<br />
(54) PHOTORESIST COMPOSITION<br />
COMPOSITION DE PHOTORESIST<br />
(71) SHIPLEY COMPANY, L.L.C. [US/US];<br />
455 Forest Street, Marlborough, MA 01752<br />
(US).<br />
(72) ZAMPINI, Anthony; 43 Wayside Drive,<br />
Westborough, MA 01581 (US).<br />
(74) CAIRNS, S., Matthew et al. / etc.; Edwards<br />
& Angell, LLP, Dike, Bronstein, Roberts &<br />
Cushman, IP Group, P.O. Box 9169, Boston,<br />
MA 02209 (US).<br />
(81) AE AG AL AM AT AU AZ BA BB BG BR<br />
BY BZ CA CH CN CO CR CU CZ DE DK<br />
DM DZ EC EE ES FI GB GD GE GH GM<br />
HR HU ID IL IN IS JP KE KG KP KR KZ<br />
LC LK LR LS LT LU LV MA MD MG MK<br />
MN MW MX MZ NO NZ PH PL PT RO RU<br />
SD SE SG SI SK SL TJ TM TR TT TZ UA<br />
UG UZ VN YU ZA ZW.<br />
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ<br />
UG ZW); EA (AM AZ BY KG KZ MD RU<br />
TJ TM); EP (AT BE CH CY DE DK ES FI<br />
FR GB GR IE IT LU MC NL PT SE TR); OA<br />
(BF BJ CF CG CI CM GA GN GQ GW ML<br />
MR NE SN TD TG).<br />
(51) 7 G03F 7/027, 7/038, 7/004, C08F 290/06,<br />
C08G 59/17, H05K 3/28<br />
(11) WO 02/23275<br />
(21) PCT/JP01/07944<br />
(13) A1<br />
(22) 13 Sep/sep 2001 (13.09.2001)<br />
(25) ja (26) ja<br />
(30) 2000-281034 14 Sep/sep 2000<br />
(14.09.2000)<br />
JP<br />
(30) 2000-282403 18 Sep/sep 2000<br />
(18.09.2000)<br />
JP<br />
(30) 2000-375130 8 Dec/déc 2000<br />
(08.12.2000)<br />
JP<br />
(43) 21 Mar/mar 2002 (21.03.2002)<br />
(54) ULTRAVIOLET-CURING RESIN COM-<br />
POSITION AND PHOTO SOLDER RE-<br />
SIST INK CONTAINING THE SAME<br />
COMPOSITION DE RESINE A SE-<br />
CHAGE ULTRAVIOLET ET ENCRE<br />
RESERVE SOUDURE PHOTO<br />
(71) GOO CHEMICAL CO., LTD. [JP/JP]; 58,<br />
Ijiri, Iseda-cho, Uji-shi, Kyoto 611-0043 (JP).<br />
(for all designated States except / pour tous<br />
les États désignés sauf US)<br />
(72, 75) DAIDO, Hiroko [JP/JP]; c/o Goo Chemical<br />
Co., Ltd., 58, Ijiri, Iseda-cho, Uji-shi,<br />
Kyoto 611-0043 (JP). HASHIMOTO, Soichi<br />
[JP/JP]; c/o Goo Chemical Co., Ltd., 58, Ijiri,<br />
Iseda-cho, Uji-shi, Kyoto 611-0043 (JP).<br />
(74) NISHIKAWA, Yoshikiyo et al. / etc.;<br />
Hokuto Patent Attorneys Office, Umeda-Daiichiseimei<br />
Bldg. 5F, 12-17, Umeda 1-chome,<br />
Kita-ku, Osaka-shi, Osaka 530-0001 (JP).<br />
(81) AE AG AL AM AT AU AZ BA BB BG BR<br />
BY BZ CA CH CN CR CU CZ DE DK DM<br />
DZ EE ES FI GB GD GE GH GM HR HU<br />
ID IL IN IS JP KE KG KP KR KZ LC LK<br />
LR LS LT LU LV MA MD MG MK MN MW<br />
MX MZ NO NZ PL PT RO RU SD SE SG SI<br />
SK SL TJ TM TR TT TZ UA UG US UZ VN<br />
YU ZA ZW.<br />
(84) AP (GH GM KE LS MW MZ SD SL SZ TZ<br />
UG ZW); EA (AM AZ BY KG KZ MD RU<br />
TJ TM); EP (AT BE CH CY DE DK ES FI<br />
FR GB GR IE IT LU MC NL PT SE TR); OA<br />
(BF BJ CF CG CI CM GA GN GQ GW ML<br />
MR NE SN TD TG).<br />
(51) 7 G03F 7/038, 7/004, C08L 79/08<br />
(11) WO 02/23276 (13) A1<br />
(21) PCT/JP01/07876<br />
(22) 11 Sep/sep 2001 (11.09.2001)<br />
(25) ja (26) ja<br />
(30) 2000-318607 12 Sep/sep 2000 JP<br />
(12.09.2000)<br />
(43) 21 Mar/mar 2002 (21.03.2002)<br />
(54) NEGATIVE PHOTOSENSITIVE POLY-<br />
IMIDE COMPOSITION AND METHOD<br />
OF FORMING IMAGE FROM THE<br />
SAME<br />
COMPOSITION PHOTOSENSIBLE DE<br />
POLYIMIDE POUR NEGATIF ET PRO-<br />
CEDE DE FORMATION D’IMAGE AS-<br />
SOCIEE<br />
(71) PI R & D CO., LTD. [JP/JP]; 12-5, Torihamacho,<br />
Kanazawa-ku, Yokohama-shi,<br />
Kanagawa 236-0002 (JP).<br />
(for all designated States except / pour tous<br />
les États désignés sauf US)<br />
(72, 75) ITATANI, Hiroshi [JP/JP]; 17-1-605,<br />
Namiki 1-chome, Kanazawa-ku, Yokohama-shi,<br />
Kanagawa 236-0005 (JP). MAT-<br />
SUMOTO, Shunichi [JP/JP]; 5-51, Tsunishi<br />
2-chome, Kamakura-shi, Kanagawa<br />
248-0034 (JP).<br />
(74) TANIGAWA, Hidejiro; c/o TANIGAWA<br />
AND ASSOCIATES, Patent Firm, 6F, Iwata<br />
Bldg., 5-12, Iidabashi 4-chome, Chiyoda-ku,<br />
Tokyo 102-0072 (JP).<br />
(81) JP US.<br />
(84) EP (AT BE CH CY DE DK ES FI FR GB GR<br />
IE IT LU MC NL PT SE TR).<br />
(51) 7 G03F 7/30<br />
(11) WO 02/23277 (13) A1<br />
(21) PCT/IT00/00358<br />
(22) 12 Sep/sep 2000 (12.09.2000)<br />
(25) en (26) en<br />
(43) 21 Mar/mar 2002 (21.03.2002)<br />
(54) MACHINE FOR THE TREATMENT OF<br />
PRINTING PLATES