TIMARIS - Singulus Technologies AG
TIMARIS - Singulus Technologies AG
TIMARIS - Singulus Technologies AG
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Combination-Process-Module<br />
The Combination-Process-Module<br />
(CPM) comprises both technologies,<br />
of oxidation and pre-clean in one<br />
module. This is a cost-efficient<br />
option, since only one module for<br />
two process steps is required. It is<br />
mainly envisaged for R&D purposes,<br />
where a high throughput is of less<br />
importance. The process performance<br />
is identical with the Oxidation-<br />
Module and the Pre-Clean-Module.<br />
Combi-Process-Module (CPM)<br />
Details:<br />
_ Low energy remote plasma<br />
oxidation<br />
_ Natural oxidation<br />
_ Surface treatment by low<br />
energetic ions<br />
_ Wafer cleaning, removal of native<br />
oxides by sputter etch<br />
_ Variable distance between<br />
substrate and ion source<br />
_ Ultra-High-Vacuum technology,<br />
base pressure < 1*10 -8 Torr<br />
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