TIMARIS - Singulus Technologies AG

Typical TIMARIS configuration
for 300 mm MRAM wafer
production with full throughput,
consisting of:
_ 2 Multi-Target-Modules
_ 1 Oxidation-Module
_ 1 Pre-Clean-Module
_ 1 Transport Module (Brooks)
including two FOUP Loadports
_ Multiple wafer handling
_ Throughput: up to 20 Wafer*
_ Software integration:
GEM/SECSII Interface
* standard MRAM layer stack
Typical TIMARIS configuration
for 150/200 mm Thin-Film
Head wafer production. The
footprint shown is for a tool for
TMR (GMR) sensor fabrication
and consists of:
_ 1 Multi-Target-Module
_ 1 Oxidation-Module
_ 1 Pre-Clean Module
_ 1 Transport Module (Brooks)
_ Multiple wafer handling
_ Throughput: 9 wafers for a standard
TMR layer stack
_ Software integration:
GEM/SECSII Interface
_ Variants: HMM film deposition
(no oxidation module)
300 mm
Wafer
150 mm
200 mm
Wafer