TIMARIS - Singulus Technologies AG

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4 Linear Dynamic Deposition (LDD) Deposition Technique: Linear PVD Magnetron and linear movement of wafer Linear Dynamic Deposition (LDD)⋅ _ Short target-substrate distance: _ Best coating efficiency _ Low cost of owner ship _ Thickness adjusted by wafer speed: _ Precise thickness control & repeatability _ Ultra thin film < 0.1 nm; smallest thickness step: < 0.01 nm _ Special LDD capabilities _ Deposition of thickness wedges _ Preparation of concentration gradients _ Multi-directional coating: _ Smooth films and interfaces _ Stationary Aligning Magnetic Field (AMF): _ Magnetic pre-alignment of easy axis direction _ Leakage field of cathode parallel to wafer travel direction: _ Ideal symmetry for magnetic film applications _ Robust and reliable design
Multi-Target-Module with 10 DC/RF Cathodes Multiple film stack deposition, without the need to break ultra-high vacuum, is one of the key advantages of the MTM process module. Additional features as wafer heating for hot substrate deposition or a collinear Aligning Magnetic Field (AMF) can be activated to align the magnetic Easy Axis during deposition of ferromagnetic films. The Linear Dynamic Deposition (LDD) technology enables the capability to deposit wedge films with a different film thickness across the wafer and to deposit alloy films with adjustable concentration gradients across one wafer. Both features allow a very cost effective development of film stacks and accelerate the devices development. The LDD technology is the key to delivering world class material uniformity across large wafers and exceptional precise control of ultra thin layer thickness down to 1 % of a nanometer. Details: _ DC/RF magnetron _ All sputter deposition modes selectable by recipe for all 10 cathodes _ LDD technology _ RF bias option _ Ultra-High-Vacuum technology, base pressure < 5*10 -9 Torr _ Wafer heating and cooling 5 Multi-Target-Module
Page 1 and 2: TIMARIS PVD Cluster Tool for Magnet
Page 3: Multi Target Module Top: Target Dru
Page 7 and 8: Rotating-Substrate-Module (RSM) The
Page 9 and 10: Oxidation-Process-Module The Oxidat
Page 11 and 12: Combination-Process-Module The Comb
Page 13: TIMARIS configuration for 300 mm MR
Page 16: Headquarters SINGULUS TECHNOLOGIES

TIMARIS - Singulus Technologies AG

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