TIMARIS - Singulus Technologies AG

Multi Target Module
Top: Target Drum with
10 rectangular cathodes;
Drum design ensures
easy maintenance;
Bottom: Main part of the
chamber containing LDD
equipment
Oxidation Module
Low Energy Remote
Atomic Plasma Oxidation;
Natural Oxidation;
Soft Energy
Surface Treatment
Thin-Film Heads (TFH)
_ High Moment Material
(Writer Material)
_ TMR (Reader Material)
_ GMR (Reader Material)
_ Deposition of seed and gap layers
Semiconductor
_ MRAM
_ Sensors
_ High-k dielectrics
_ Metal gates
_ Phase-change material deposition
_ SAW/BAW film deposition
_ In-circuit Inductors
Ultra-High-Vacuum Design:
High Throughput (e.g. MRAM):
High Effective Up-time:
Reliability:
All TIMARIS applications require
the deposition of ultra-thin metallic
and insulating film stacks down to
a thickness of one (1) nanometer
and below with very precise material
thickness and high uniformity
specifications.
The MTM is the key component
of the TIMARIS platform; it
incorporates the Linear Dynamic
Deposition (LDD, US patent US
7,799,179 B2) technology in
combination with ten (10) sputter
targets in one vacuum chamber.
Base Pressure < 5*10-9 Torr
(Deposition Chamber)
up to 18 Wafer/h (see page 11)
Maintenance friendly Design
Solid and well Engineered Design,
no fast moving Parts
3
Cassette Module
(according to Customer
Specification)
Soft-Etch Module
(PreClean, Surface
Treatment)
Transport Module
(UHV wafer handler)
The FTM module uses Linear
Dynamic Deposition in combination
with up to four cathodes. The LDD
technology is especially designed
for deposition of ultra-thin films,
magnetic films, high-quality metallic,
conductive and insulating films and is
the key to deliver world class material
uniformity across large wafer sizes,
combined with an exceptional
precise control of ultra-thin
layer thickness down to 1 % of
a nanometer.