TIMARIS - Singulus Technologies AG
TIMARIS - Singulus Technologies AG
TIMARIS - Singulus Technologies AG
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<strong>TIMARIS</strong> configuration<br />
for 300 mm MRAM and<br />
semiconductor wafer<br />
production, consisting of:<br />
_ 1 Multi-Target-Module<br />
_ 3 Flexible-Target-Modules<br />
_ 1 Pre-Clean-Module<br />
_ 1 Oxidation-Module<br />
_ 1 Transport Module (Brooks)<br />
including three FOUP Loadports<br />
_ Multiple wafer handling<br />
_ Software integration:<br />
GEM/SECSII Interface<br />
Typical <strong>TIMARIS</strong> configuration<br />
for R&D purposes and/or low<br />
volume production. All wafer<br />
up to 300 mm wafer can be<br />
handled. The footprint shown<br />
consists of:<br />
_ 2 Rotating-Substrate-Modules<br />
_ 1 Combi-Process-Module<br />
_ 1 Transport Module<br />
all Wafer<br />
up to<br />
300 mm<br />
all Wafer<br />
up to<br />
300 mm
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