Packaging requirements for Smart Antennas - JePPIX
Packaging requirements for Smart Antennas - JePPIX
Packaging requirements for Smart Antennas - JePPIX
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<strong>Packaging</strong> <strong>requirements</strong><br />
<strong>for</strong> <strong>Smart</strong> <strong>Antennas</strong><br />
7 July, 2011, TU/e Eindhoven
� Founded in Enschede<br />
December 2009<br />
� Design & Manufacturing of<br />
Innovative microwave<br />
photonics components and<br />
beam <strong>for</strong>ming networks<br />
� Applications:<br />
communication, observation,<br />
security and smart networks<br />
� Chair of Point One R&D Project<br />
Company Introduction<br />
Management Team<br />
Paul van Dijk<br />
CEO<br />
Chris Roeloffzen<br />
CTO<br />
2
Motivation: In-flight live satellite TV<br />
Required :<br />
Broadband,<br />
continuous and<br />
squint-free<br />
beamsteering<br />
To receive : Phased-array<br />
Digital video<br />
broadcasting<br />
via satellite<br />
(DVB-S) signal<br />
Antenna tile<br />
antenna with<br />
large number<br />
of elements<br />
Solution :<br />
Photonic<br />
+<br />
beam<strong>for</strong>mer<br />
Aim:<br />
Live television<br />
channels and<br />
broadband<br />
communication at<br />
passenger seats<br />
3
modulators<br />
Why integration is needed<br />
Fiber based system with discrete<br />
components is highly unstable<br />
Optical splitters<br />
chip<br />
4
Laser<br />
From<br />
antenna<br />
elements<br />
PM fiber<br />
Integrated<br />
1×16 splitter<br />
From<br />
antenna<br />
elements<br />
Mechanical<br />
interconnection:<br />
•Silicon common base<br />
Modulator<br />
drivers<br />
Modulator<br />
array<br />
Silicon common base<br />
shaped PCB<br />
brass heat sink<br />
Optical interconnection:<br />
OBFN<br />
controller<br />
•Butt coupling: splitter – modulators –<br />
OBFN – detector<br />
•Fiber: laser - splitter<br />
Photonic integration<br />
Modulator<br />
drivers<br />
Optical Beam<strong>for</strong>mer<br />
Detector<br />
Temperature<br />
controller<br />
Electrical<br />
interconnection:<br />
•Wire bonding + PCB<br />
5
• A modulator array is absolutely necessary<br />
• MZM array in InP technology from Oclaro<br />
• Per<strong>for</strong>mance � V π = 3.5 V – 4.5 V � sufficient<br />
Aim: to integrate the modulator array<br />
in InP with the beam<strong>for</strong>mer in<br />
TriPleX TM<br />
Samples from Oclaro<br />
Optical modulator array: MZM<br />
=<br />
+<br />
Array of >25 Mach-Zehnder modulators<br />
6
Miniaturization<br />
~2 cm<br />
~1 cm<br />
7
System integration (RF and photonics)<br />
8
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