kinetic response of thermosetting adhesive systems to heat

REFERENCES
Atkins, P.W. (1986): Physical Chemistry. Oxford University Press
Bolton, A.J., P.E. Humphrey, and P.K. Kavvouras (1989): The hot pressing of dry-formed woodbased
composites. Part VI. The importance of stresses in the pressed mattress and their
relevance to the minimization of pressing time and the variability of board properties.
Holzforschung, 43 (6), pp. 406 - 410.
Denisov, O.B. (1978): Die Verklebung der Holzpartikeln bei der Heißpressung von Spanplatten
aus Holz. Holztechnologie, 19 (3), pp. 139 - 141.
Geimer, R.L.; Follensbee, R.A.; Christiansen, A.W.; Koutsky, J.A.; Myers, G.E. (1990): Resin
Characterization. In: Proceedings of the 24 th Particleboard/Composite Materials
Symposium Pullman (WA), pp. 65 - 83.
Heinemann, C. (2002): Kinetic von Leimsystemen. In: Tagungsband zum Holzwerkstoff
Workshop an der Universität Hamburg, pp. 15 - 20.
Humphrey, P.E. (1997): The Bonding Speed of Adhesives: An Auomated Evaluation System. In:
Proc. First European Panel Products Symposium. Llandudno, Wales. Pub.
BioComposites Centre, UWB, Bangor. LL57 2UW, UK. 145-155
Humphrey, P.E. (1996): Thermoplastic characteristics of partially cured thermosetting adhesiveto-wood
bonds: the significance for wood-based composite manufacture. In: Proc. Third
Pacific Rim BioBased Composites conference. Kyoto, Japan. Pub. Forest Research
Institute, Univ. Kyoto.
Humphrey, P.E. (1993): A device to test adhesive bonds. US Patent number 5,170,028 (and other
patents). US Patent Office, Washington (DC), USA
Humphrey, P. E. (1991): Pressing Issues in Panel Manufacture: Internal Behavior During
Pressing and its Impact on Time Minimization, Properties and Profit. In: Proceedings of
the 25 th Particleboard/Composite Materials Symposium, Pullman (WA), pp. 99 - 108.
Humphrey, P.E; Bolton, A.J. (1979): Urea Formaldehyde Resin Bond Strength Development
with Reference to Wood Particleboard Manufacture. Holzforschung, 33, pp. 129 - 133.
Humphrey, P. E; Ren, S. (1989): Bonding Kinetics of Thermosetting Adhesive Systems used in
Wood-based Composites: The combined Effect of Temperature and Moisture Content.
Journal of Adhesion Science Technology, 3 (5), pp. 397 - 413.
Humphrey, P. E; Zavala, D. (1989): A Technique to Evaluate the Bonding Reactivity of
Thermosetting Adhesives. Journal of testing and Evaluation, 17 (6), pp. 323 - 328.
Kim, J. (2002): Doctoral Thesis, Oregon State University, Department of Wood Science and
Engineering.