kinetic response of thermosetting adhesive systems to heat

Exothermic Heat [0,5 W/g]
UF#2
UF#3
UFm#4
UFm#5
30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190
Temperature [°C]
Lab: METTLER
Figure 1 - DSC curves obtained with a 2°K/min heating rate for samples weighing 10 mg.
The relationship between temperature and the rate at which a first-order reaction proceeds
and temperature is commonly described using the Arrhenius Equation (Eqn. 1):
ln k = ln A – EA/RT (1)
where k is the rate coefficient (kJ/mol), A is the pre-exponential factor, R is the universal
gas constant (8,314*10 -3 kJ*mol -1 *K -1 ) and T is the absolute temperature (°K).
In the present DSC experiments, activation energy values have been extracted by
analyzing temperature peaks measured for runs conducted using three different heating rates of
1°K/min, 2°K/min and 4°K/min following the method of Kissinger (Kissinger 1957).
Automated Bonding Evaluation System (ABES)
The ABES technique may be used to characterize the mechanical response (bond strength
in this case) of adhesive systems to a wide range of parameters; the influence of temperature was
of concern in the present investigation. The test arrangement is shown conceptually as Figure 2
and the bond forming and testing zone of the ABES instrument as Figure 3.
Figure 2 - A schematic representation of the ABES approach.