kinetic response of thermosetting adhesive systems to heat

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REFERENCES Atkins, P.W. (1986): Physical Chemistry. Oxford University Press Bolton, A.J., P.E. Humphrey, and P.K. Kavvouras (1989): The hot pressing of dry-formed woodbased composites. Part VI. The importance of stresses in the pressed mattress and their relevance to the minimization of pressing time and the variability of board properties. Holzforschung, 43 (6), pp. 406 - 410. Denisov, O.B. (1978): Die Verklebung der Holzpartikeln bei der Heißpressung von Spanplatten aus Holz. Holztechnologie, 19 (3), pp. 139 - 141. Geimer, R.L.; Follensbee, R.A.; Christiansen, A.W.; Koutsky, J.A.; Myers, G.E. (1990): Resin Characterization. In: Proceedings of the 24 th Particleboard/Composite Materials Symposium Pullman (WA), pp. 65 - 83. Heinemann, C. (2002): Kinetic von Leimsystemen. In: Tagungsband zum Holzwerkstoff Workshop an der Universität Hamburg, pp. 15 - 20. Humphrey, P.E. (1997): The Bonding Speed of Adhesives: An Auomated Evaluation System. In: Proc. First European Panel Products Symposium. Llandudno, Wales. Pub. BioComposites Centre, UWB, Bangor. LL57 2UW, UK. 145-155 Humphrey, P.E. (1996): Thermoplastic characteristics of partially cured thermosetting adhesiveto-wood bonds: the significance for wood-based composite manufacture. In: Proc. Third Pacific Rim BioBased Composites conference. Kyoto, Japan. Pub. Forest Research Institute, Univ. Kyoto. Humphrey, P.E. (1993): A device to test adhesive bonds. US Patent number 5,170,028 (and other patents). US Patent Office, Washington (DC), USA Humphrey, P. E. (1991): Pressing Issues in Panel Manufacture: Internal Behavior During Pressing and its Impact on Time Minimization, Properties and Profit. In: Proceedings of the 25 th Particleboard/Composite Materials Symposium, Pullman (WA), pp. 99 - 108. Humphrey, P.E; Bolton, A.J. (1979): Urea Formaldehyde Resin Bond Strength Development with Reference to Wood Particleboard Manufacture. Holzforschung, 33, pp. 129 - 133. Humphrey, P. E; Ren, S. (1989): Bonding Kinetics of Thermosetting Adhesive Systems used in Wood-based Composites: The combined Effect of Temperature and Moisture Content. Journal of Adhesion Science Technology, 3 (5), pp. 397 - 413. Humphrey, P. E; Zavala, D. (1989): A Technique to Evaluate the Bonding Reactivity of Thermosetting Adhesives. Journal of testing and Evaluation, 17 (6), pp. 323 - 328. Kim, J. (2002): Doctoral Thesis, Oregon State University, Department of Wood Science and Engineering.
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Page 1 and 2: KINETIC RESPONSE OF THERMOSETTING A
Page 3 and 4: Exothermic Heat [0,5 W/g] UF#2 UF#3
Page 5 and 6: It is the regressed gradient of thi
Page 7 and 8: Activation Energy Index 1,00 0,95 0
Page 9: Shear Strength [N/mm²] 2,0 1,5 1,0

kinetic response of thermosetting adhesive systems to heat

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