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ABSTRACT<br />

We have investigated usin some polymer films<br />

such <strong>as</strong> polyimide and Parylene ?or acoustic impedance<br />

matching applications. Polyimide films were spin<br />

coated and Parylene films were vapor deposited on<br />

silicon and l<strong>as</strong>s substrates, respectively. The<br />

impedance, ve P ocity of sound and acoustic attenuation<br />

of these films were me<strong>as</strong>ured in the 70-230 MHz<br />

frequency range. The curing temperature of the<br />

polyimide films w<strong>as</strong> also varied to determine the<br />

dependence of the material properties on processing<br />

conditions. The impedance of these films were<br />

me<strong>as</strong>ured to be in the 2.7 to 3.7 Mrayl range.<br />

Therefore, these films can be used to obtain a good<br />

acoustic matching between most liquids and most low<br />

impedance solids. The me<strong>as</strong>ured Q values also<br />

promise operation at frequencies up to a few hundred<br />

MHz.<br />

INTRODUCTION<br />

Efficient coupling of acoustic fields from a liquid<br />

into a solid require a quarter-wave matching layer due<br />

to the large impedance mismatch between most<br />

liquids and solids. For most applications the<br />

impedance of the matching layer h<strong>as</strong> to be in the 3 to<br />

10 Mrayl range. Unfortunately, there are not a lot of<br />

materials available with an impedance in this<br />

frequency range. Typically at gi ahertz frequencies a<br />

vacuum-deposited thin-film 07 borosilicate gl<strong>as</strong>s<br />

(impedance, Z, is 11 Mrayls) or amorphous carbon<br />

(Z=8 Mrayls) is used <strong>as</strong> matching layers.1 At low<br />

megahertz frequencies thin sheets of solids such <strong>as</strong><br />

epoxy composites are laminated on the substrate <strong>as</strong><br />

anti-reflection coatings. When frequencies on the<br />

order of a few hundred megahertz are used, however,<br />

neither of these techniques can be applied. Typical<br />

wavelengths in solids are on the order of a few tens of<br />

microns at frequencies around 100 MHz. Vacuum<br />

deposition of materials at these thicknesses is either<br />

ver costly or impossible at all. Laminating materials<br />

wit{ such thicknesses can not be done because<br />

polishing materials down to such thicknesses is very<br />

difficult.<br />

We have investigated polymer films such <strong>as</strong><br />

polyimide and Parylene <strong>as</strong> acoustic matching layers at<br />

frequencies in the 100 to 200 MHz range. The<br />

*E. L. Ginzton Laboratory, Stanford University,<br />

Stanford, CA. 94305<br />

1051-0117/90/0000-1337 $1.00 0 1990 IEEE<br />

POLYMER FILMS AS ACOUSTIC MATCHING LAYERS<br />

B. Hadimioglu and B. T. <strong>Khuri</strong>-<strong>Yakub</strong>*<br />

XEROX Palo Alto Research Center<br />

3333 Coyote Hill Road<br />

Palo Alto, CA. 94304<br />

me<strong>as</strong>urements indicate that these films promise good<br />

transmission efficiencies between most liquids and<br />

especially low impedance solids such <strong>as</strong> silicon, gl<strong>as</strong>s<br />

and quartz.<br />

EXPERIMENTAL PROCEDURE<br />

The acoustic me<strong>as</strong>urements were performed using<br />

a pulse-echo detection system. Figure 1 shows a<br />

diagram of the setup. Typically 200 nsec-wide pulses<br />

of rf signal are applied into a LiNbO3 acoustic<br />

transducer. The transducer is bonded on a double side<br />

polished quartz crystal and it generates plane sound<br />

waves in the quartz rod. The transducer h<strong>as</strong> a center<br />

frequency of 130 MHz although its broad bandwidth<br />

allows me<strong>as</strong>urements in the 70 to 230 MHz frequency<br />

range. The amplitude of the signal applied into the<br />

transducer is controlled by a precision step attenuator.<br />

The signals received from the transducer are detected<br />

using a low-noise superheterodyne receiver. The<br />

attenuation value of the step attenuator is recorded <strong>as</strong><br />

the frequency is varied to determine the frequency<br />

response of the device-under-test. The system h<strong>as</strong> a<br />

dynamic range of over 80 dBs with a me<strong>as</strong>urement<br />

accuracy of better than T.5 dB over the entire<br />

frequency range.<br />

Figure 2 shows a diagram of the transducer-<br />

me<strong>as</strong>ured device configuration along with various<br />

signals received from the transducer. In order to<br />

RFmclllator FETSwltch Digital<br />

Attenuator<br />

Mixer<br />

I’ I<br />

‘a +h<br />

Control<br />

Power Splitter Transducer<br />

Test<br />

wafer<br />

Figure 1. The rf-electronics of the me<strong>as</strong>urement system<br />

1990 ULTRASONICS SYMPOSIUM - 1337


Liquid<br />

(Zl)<br />

<strong>Matching</strong><br />

Laver<br />

Ar (Reflection loss)= A,(mat) - A,(ref)<br />

At (Transmission loss) = At(ref) - At(mat)<br />

Figure 2. Me<strong>as</strong>urement setup with the various rfpulses<br />

received.<br />

accurately determine the losses in the matching layer,<br />

first the amplitude of the reflected and transmitted<br />

signals Al(ref) and At(ref) were recorded without the<br />

matching layer present in the system <strong>as</strong> shown in<br />

Figure 2. Then the same echoes were me<strong>as</strong>ured with<br />

the matching layer present on the wafer. The<br />

difference between these signals represent the<br />

amplitude of the reflection and transmission<br />

coefficients of the liquid/matching layer/solid<br />

configuration, respectively.<br />

In order to estimate the mechanical properties of<br />

the material under test, the me<strong>as</strong>ured reflected and<br />

transmission coefficients were compared to the values<br />

predicted by a theoretical calculation of the response<br />

of the system. The theoretical reflection and<br />

transmission coefficients of the matching layer are<br />

given by<br />

and<br />

1338 - 1990 ULTRASONICS SYMPOSIUM<br />

where<br />

Aloss is given by<br />

where<br />

and Zj, is the input impedance of the matching<br />

layer/solid combination looking from the liquid side<br />

given by<br />

The attenuation constant a of the matching layer is<br />

<strong>as</strong>sumed to incre<strong>as</strong>e <strong>as</strong> the frequency to the power y.<br />

Z/, Z and Z, are the impedance of the liquid, matching<br />

layer and substrate, respectively. The matching layer<br />

h<strong>as</strong> a thickness of t and sound velocity of v. An<br />

alternative definition for the attenuation constant is<br />

the Q of the layer where Q=nf/va and f is the<br />

frequency.<br />

It should be noted here that since the ph<strong>as</strong>e of the<br />

reflection coefficient is not me<strong>as</strong>ured, there are two<br />

impedances that will match the me<strong>as</strong>ured magnitude<br />

of the reflection and transmission coefficients. These<br />

impedances are located symmetrically around the<br />

quarter-wave matching impedance Zv4= (Z/ZJW In<br />

order to determine the impedance of the matching<br />

layer unambiguously, me<strong>as</strong>urements were done using<br />

both water and isopropyl alcohol <strong>as</strong> the coupling<br />

liquid. Since isopropyl h<strong>as</strong> an impedance much less<br />

than that of water, it is e<strong>as</strong>y to determine the<br />

impedance of the matching layer accurately.<br />

The pol imide films2 were applied by spin coating<br />

on one sde of 2.5 mm thick double side polished<br />

silicon wafers. The wafers were spun at 1200<br />

rpm for 60 seconds which yielded final film thicknesses<br />

of about 5 pm. After a drying at 90°C for 10 minutes, a<br />

(3-stage cure w<strong>as</strong> done at 140OC for 30 minutes. Holes<br />

were photolithographically etched in the polyimide to<br />

expose the silicon surface. These holes allow the<br />

me<strong>as</strong>urement of the polyimide thickness <strong>as</strong> well <strong>as</strong> the<br />

me<strong>as</strong>urement of the reference data. A final high<br />

temperature cure w<strong>as</strong> then applied for 1 hour. In<br />

order to determine the dependence of the mechanical<br />

properties of the olyimide films on processing<br />

conditions, the fina P cure temperature w<strong>as</strong> varied<br />

between 14OOC and 325OC.<br />

The Parylene films were applied using vapor ph<strong>as</strong>e


deposition on pyrex gl<strong>as</strong>s plates. Two different types<br />

of Parylene films were me<strong>as</strong>ured, Parylene-N and<br />

Parylene-C. The thickness of all the films were<br />

mea ured by an a-Step machine with an accuracy of<br />

T 508.<br />

RESULTS<br />

Figures 3 and 4 show a typical set of data along<br />

with theoretical curves fitted on the experimental<br />

data. Figures 3(a) and (b) show the reflection and<br />

transmission loss, respectively, with water <strong>as</strong> the<br />

coupling fluid. Figures 4(a) and (b) are corresponding<br />

plots for isopropyl alcohol: The fit between the<br />

experimental and theoretical curves are excellent in<br />

most c<strong>as</strong>es. The uncertainty in determining the<br />

impedance of the matchin layer w<strong>as</strong> found to be<br />

T.05 Mrayl. The accuracy o 3 the velocity estimation is<br />

better than 50 m/sec. The-attenuation value of the<br />

J<br />

z<br />

: 51,,<br />

1<br />

,I<br />

, J - / = + , .<br />

..* . .<br />

'5 0 I00 150 200 250<br />

FREQUENCY (MHz ><br />

PMI-325 HRTER<br />

Figure3. (a) Me<strong>as</strong>ured reflection loss and (b)<br />

transmission loss for a polyimide film.<br />

Coupling liquid is water. Solid line is the<br />

theoretical curve fitted on the data.<br />

..<br />

PM1-325 15C<br />

20 ,<br />

E<br />

!<br />

I<br />

'5 t I I 1<br />

0,I. ~ ' 100 ~ " ~ 150 ~ ~ 200 ."""' " ~ c20 ~ ~ '<br />

FREQUENCY (MHzI<br />

Figure4. (a) Me<strong>as</strong>ured reflection loss and (b)<br />

transmission loss for a olyimide film.<br />

Couplin liquid is isopropy P alcohol. Solid<br />

line is $e theoretical curve fitted on the<br />

data.<br />

films, with the exception of Parylene-C, were found to<br />

be such that typical Q w<strong>as</strong> greater than 100 at 100<br />

MHz. The power dependence, y, of the attenuation<br />

constant w<strong>as</strong> <strong>as</strong>sumed to be 2 in all calculations. Such<br />

attenuation values are too low to perturb the<br />

me<strong>as</strong>ured reflection and. transmission losses<br />

significantly in the me<strong>as</strong>urement frequenc<br />

The accuracy of the Q me<strong>as</strong>urement is, there/or'ea.%<br />

and should be considered <strong>as</strong> a lower limit for the<br />

actual Q values. In order to determine the acoustic<br />

attenuation more accurately, higher frequency<br />

me<strong>as</strong>urements are needed.<br />

Table 1 shows the results of the me<strong>as</strong>urements. It<br />

can be seen that the impedance and sound velocity of<br />

the polyimide films are near 3.6 Mra I and 2.4 kmlsec,<br />

respectively. The change in the mec t! anical properties<br />

of the polyimide films with the cure temperature is<br />

1990 ULTRASONICS SYMPOSIUM - 1339


Cure<br />

Sample # Material Temperature 2 Q<br />

(kmysec, (Mrayls) (at 100 MHrl<br />

CO<br />

PM1-325 Polyimide 325 2.43 36 KN)<br />

PM1-240 Polyimide 240 2 55 36 1w<br />

PM1-180 Polyimide 180 2 53 37 100<br />

PM1-140 Polyimide 140 2 57 3 75 100<br />

PARNl ParyleneN<br />

- 2.1 2.85 100<br />

Table 1. The results of the me<strong>as</strong>urements.<br />

very small with a slight incre<strong>as</strong>e of the impedance <strong>as</strong><br />

the cure temperature is decre<strong>as</strong>ed. The Parylene films<br />

show a sound velocity of 2.2 km/sec with a lower<br />

impedance of about 2.9 Mrayl.<br />

Table 2 shows the predicted operation of<br />

polyimide films cured at 325OC for matching sound<br />

from water into various low impedance solids at<br />

frequencies <strong>as</strong> high <strong>as</strong> 600 MHz. The Q is <strong>as</strong>sumed to<br />

be 200 at 100 MHz with an inverse frequency<br />

dependence. It can be seen that these films offer a<br />

significant improvement in the transmission and<br />

reflection losses at these frequencies for the substrates<br />

considered. The acoustic attenuation is relatively low<br />

compared to the data reported by Selfridge3 for low<br />

impedance materials such <strong>as</strong> pl<strong>as</strong>tics. Both polyimide<br />

and Parylene also offer e<strong>as</strong>y application with thickness<br />

ranging from sub-micron to several microns. These<br />

materials are also relatively inert and stable4 which<br />

should make them ideal for matching layer<br />

applications.<br />

COUPLING SOUND FROM WATER INTO SILICON AND GLASS<br />

<strong>Matching</strong> layer: Polyimide (325%). U4 thick<br />

Table 2. Predicted response of polyimide films cured<br />

at 325oC.<br />

CONCLUSION<br />

We have me<strong>as</strong>ured the acoustic impedance,<br />

velocity of sound and mechanical Q of polymide and<br />

Parylene films. The me<strong>as</strong>ured impedances show that<br />

both of these materials should yield a significant<br />

improvement in the efficiency of coupling of sound<br />

1340 - 1990 ULTRASONICS SYMPOSIUM<br />

from liquids to low impedance solids such <strong>as</strong> silicon,<br />

l<strong>as</strong>s and quartz. The acoustic attenuation for these<br />

4. ilms are also low enough to suggest operation of<br />

these films up to a few hundred megahertz.<br />

ACKNOWLEDGEMENTS<br />

The authors wish to thank Robert Allen and<br />

Barbara Minott for supplying the polyimide wafers.<br />

1.<br />

2.<br />

3.<br />

4.<br />

REFERENCES<br />

D. Rugar, "Cryogenic <strong>Acoustic</strong> Microscopy," Ph.D.<br />

Dissertation, Stanford University (1981).<br />

PIX-1400, Hitachi Chemical Co. Ltd., Japan.<br />

A. R. Selfridge, "Approximate Material Properties<br />

of Isotropic Materials," IEEE Trans. Sonics and<br />

Ultr<strong>as</strong>on., SU-32, 381 (1985).<br />

See, for example, <strong>Polymer</strong>s for Electronic<br />

Applications, edited by J. H. Lai (CRC, Florida,<br />

1989), Chapters 2 and 3.

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