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CBM Progress Report 2006 - GSI

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Detector Developments <strong>CBM</strong> <strong>Progress</strong> <strong>Report</strong> <strong>2006</strong><br />

Development of Microstrip Sensors for the <strong>CBM</strong> Silicon Tracking System<br />

J. M. Heuser and Chr. J. Schmidt, <strong>GSI</strong>, Darmstadt, Germany<br />

We have designed the first prototype of a silicon<br />

micro-strip sensor that can serve as a building block of<br />

detector modules for <strong>CBM</strong>’s Silicon Tracking System.<br />

Tracking Stations<br />

The tracking stations are planar arrangements of<br />

micro-strip sensors, grouped into several modules of either<br />

the same or different length, that cover at given positions<br />

downstream of the target the fiducial area approximately<br />

between 2.5 and 25 degrees polar angle. Figure 1 visualizes<br />

this station concept with a vertical orientation of the<br />

modules and the long direction of the strips perpendicular<br />

to the bending plane of the magnet for best momentum<br />

measurement. The first and smallest station may be<br />

as close as 30 cm to the target. The last and largest station<br />

will be in about one meter distance from the target.<br />

One of the key requirements of the Silicon Tracking System<br />

is a low-mass design to achieve momentum measurement<br />

with about 1% resolution. Silicon micro-strip detectors<br />

are compatible with a low-mass design as the sensors<br />

themselves are thin. With an appropriate module structure,<br />

active readout electronics with its cooling requirements<br />

and material involved may be avoided in the aperture.<br />

The strongly inhomogeneous track density profile<br />

makes a sectorized module structure necessary. Close to<br />

the beam line, a module must comprise sensors with short<br />

strips. Longer strips, realized either on single wafers or<br />

by chaining two or more sensors, can be employed in the<br />

regions further outside. Those different “sectors” must be<br />

read out individually. This may be realized by routing the<br />

strips’ analog signals from every sector through thin flat<br />

multi-line cables to front-end electronics at the periphery<br />

of the stations.<br />

Figure 1: Silicon micro-strip sensors arranged into modules<br />

of different lengths building up a tracking station.<br />

30<br />

Sensor Design<br />

We focused on a sensor compatible with this detector<br />

module structure. The design, shown in Fig. 2, addresses in<br />

particular connectivity issues. We intend to employ doublesided<br />

sensors with one strip orientation along the module’s<br />

long axis, and a “stereo” direction on the second side. We<br />

strived to accomplish that both sensor sides can be contacted<br />

both at the top and the bottom edge. On the stereo<br />

side, this requires interconnections on a second metal layer<br />

between the strips of the two corner regions. This layout<br />

will enable us to chain several sensors, thus forming long<br />

strip sectors for the outer regions of the tracking stations.<br />

A staggered arrangement of the contact pads was applied<br />

allowing a wire-bonding scheme that conserves the correlation<br />

of neighbouring channels through the chain up to the<br />

readout electronics. Small stereo angles are preferred as<br />

unavoidable dead area on the sensor sides is kept small.<br />

Figure 2: (Left) Schematics of the sensor’s stereo side.<br />

(Right) Chained sensors and their interconnections.<br />

Detector R&D<br />

The first sensors, to be produced in 2007 [1], will have<br />

a thickness of 200–300 µm, are double-sided with 2×1024<br />

AC-coupled strips of 50 µm pitch and feature a 15 ◦ stereo<br />

angle between front and back side. They will be utilized<br />

for the construction of a prototype detector module: an<br />

assembly of chained sensors, readout electronics [2] and<br />

mechanical support. Forthcoming prototypes will address<br />

radiation hardness, the minimization of inactive area near<br />

the edges, and will touch e. g. the biasing technique and<br />

the layout of the guard rings structure. The development<br />

of readout cables, made from fine-pitch aluminum traces<br />

on polyimide material for minimum material budget, is a<br />

particular important task. The capacitance of sensor and<br />

cable at the input of the front-end electronics must be small<br />

enough to achieve a sufficiently large signal-to-noise ratio.<br />

References<br />

[1] CiS Institut für Mikrosensorik gGmbH, Erfurt, Germany<br />

[2] Chr. J. Schmidt et al., this report

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