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Contacting various metal compositions using ViProbe® Vertical ...

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ViProbe ® Advantages<br />

• Mechanically robust and reliable.<br />

• Consistent probe mark signature across full<br />

array.<br />

• Easily repaired, minimum downtime.<br />

• Same ViProbe ® Beam used for contacting<br />

WLCSP Solder bump, Al / Au / Cu Pad.<br />

• ViProbe ® improvements (innovation<br />

development from Fein<strong>metal</strong>l) keeping pace<br />

with customer requirements.<br />

June 6 to 9, 2010 IEEE SW Test Workshop 10

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