Contacting various metal compositions using ViProbe® Vertical ...

Motivation
• Minimum pad deformation post sort required
for,
– Die shipping direct to customer (automotive).
– FCOL (Flip Chip on Lead) Bumping process.
– OPM (Over Pad Metallisation) Assembly process.
• Multiple ‘contact pad’ metal compositions,
– Al, Au, Cu.
• Multi‐site Sort >8 sites / Grid Array Pattern.
– EWLP (Embedded Wafer Level Package).
• WLCSP (Minus bump).
June 6 to 9, 2010 IEEE SW Test Workshop 4