Contacting various metal compositions using ViProbe® Vertical ...

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ViProbe ® on Al Pad. • Flip Chip on Lead (FCOL) requires Sort before bumping. – Electroplated bump process requires smallest possible probe mark. – ViProbe ® was qualified to probe Al Pad (FCOL parts) before electroplated bump process. Flip Chip On Leadframe June 6 to 9, 2010 IEEE SW Test Workshop 18
ViProbe ® on Al Pad. • Automotive KGD, 3 Temperature pass (Ambient, ‐40’C, +160’C). • Critical Quality parameters, – Probe Mark Size, – No Pad edge incursions. June 6 to 9, 2010 IEEE SW Test Workshop 19
Page 1 and 2: Denis Deegan Analog Devices Inc Sim
Page 3 and 4: Motivation. ViProbe ® Vertical Pro
Page 5 and 6: Motivation (Cont.) • Temperature
Page 7 and 8: ViProbe ® Vertical Probe Technolog
Page 9 and 10: ViProbe ® Vertical Probe Technolog
Page 13 and 14: CRES Measurement Setup. Method 2:
Page 15 and 16: CRES Measurement Setup. • Experim
Page 17: Evaluation Results Al, Au, Cu Pad.
Page 21 and 22: ViProbe ® on Al Pad. • Zygo Prof
Page 23 and 24: ViProbe ® on Al Pad. Pass 1 Pass 2
Page 25 and 26: ViProbe ® on Al Pad. • CRES base
Page 27 and 28: ViProbe ® on Au Pad. • EWLP -Au
Page 29 and 30: ViProbe ® on Au Pad. • 3D PMI (Z
Page 31 and 32: ViProbe ® on Cu Pad. • Cu RDL +
Page 33 and 34: ViProbe ® on Cu Pad. • 3D PMI (Z
Page 35 and 36: ViProbe ® on Cu Pad. • Measure C
Page 37 and 38: ViProbe ® on Cu Pad. • Online Cl
Page 39 and 40: ViProbe ® on Cu Pad. • Cu CRES S
Page 41 and 42: ViProbe ® Temperature Probe 160‘
Page 43 and 44: ViProbe ® Temperature Probe 200‘
Page 47 and 48: ViProbe ® ADC Testing in Probe to
Page 53 and 54: Conclusions. • ViProbe ® used su
Page 55 and 56: Acknowledgements. • Analog Device

Contacting various metal compositions using ViProbe® Vertical ...

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