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use of metal templates for microcavity formation in alumina

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Wt (%)<br />

50<br />

45<br />

40<br />

35<br />

30<br />

25<br />

20<br />

15<br />

10<br />

5<br />

0<br />

0 100 200 300 400 500<br />

Figure 4.33. EDS l<strong>in</strong>e analysis <strong>of</strong> the sample CR15-St.<br />

4.3.6. Copper Diffusion <strong>in</strong>to Alum<strong>in</strong>a<br />

Distance (µm)<br />

Copper diffusion <strong>in</strong>to alum<strong>in</strong>a is shown <strong>in</strong> Figure 4.34. The circle <strong>in</strong>dicates<br />

diffusion region. The copper wire has almost completely melted <strong>in</strong>to the alum<strong>in</strong>a<br />

leav<strong>in</strong>g beh<strong>in</strong>d a void. The void diameter is much larger than the orig<strong>in</strong>al wire diameter.<br />

(a) (b)<br />

Al2O3<br />

Al wt%<br />

Cr wt%<br />

Fe wt%<br />

Ni wt%<br />

Figure 4.34. SEM micrographs <strong>of</strong> alum<strong>in</strong>a CR30F that conta<strong>in</strong>ed copper wire<br />

(a) 5 o C/m<strong>in</strong> at magnification <strong>of</strong> 100X (b) 5 o C/m<strong>in</strong> at magnification<br />

<strong>of</strong> 500X.<br />

53

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