S.N.A.K.E.: A Dynamically Reconfigurable Artificial Sensate Skin ...

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C:\Documents and Settings\Gerardo\My Documents\Work\SM (MIT)\Thesis\Code\Firmware\Blink.s43 JMP GC_ISR ; General Call RETI ; Start Condition RXRDY_ISR BIC.B #RXRDYIFG, &I2CIFG RETI GC_ISR MOV.B &I2CDRB,R5 ; RX data in R5 BIC.B #GCIFG+RXRDYIFG, &I2CIFG CMP.B #RESET_SKIN_INST, R5 ; Is it a reset? JNZ EndI2CISR ; No MOV #0, &WDTCTL ; Yup, reset EndI2CISR RETI ;------------------------------------------------------------------------------ ; Interrupt Vectors Used MSP430x13x/14x/15x/16x ;------------------------------------------------------------------------------ ORG 0FFFEh ; MSP430 RESET Vector DW RESET ; ORG 0FFF0h ; I2C interruplt vector DW I2C_ISR ; END Page 3 of 3
C:\Documents and Settings\Gerardo\My Documents\Work\SM (MIT)\Thesis\Code\Firmware\I2C_Master.s43 C:\Documents and Settings\Gerardo\My Documents\Work\SM (MIT)\Thesis\Code\Firmware\I2C_Master.s43 //INITIALIZE PORTS BIS.B #0FFh, &P2OUT ; Set all pins to 1 BIS.B #RD_+WR+SI_WU, &P2DIR ; Set P2 directions BIS.B #08h, &P2IES ; Interrupt generated with negative transition1 BIS.B #08h, &P2IE ; Activate RD interrupt MOV.B #0FEh, &P4OUT ; Turn off LED's BIS.B #07h, &P4DIR ; Set as outputs //INITIALIZE I2C PORT BIS.B #70h, P5SEL BIS.B #0Ah,&P3SEL ; Select I2C pins BIS.B #I2C+SYNC,&U0CTL ; Recommended init procedure BIC.B #I2CEN,&U0CTL ; Recommended init procedure BIS.B #XA,&U0CTL ; Recommended init procedure BIS.B #I2CSSEL0,&I2CTCTL ; ACLK MOV.B #7, I2CSCLH ; Set Baud Rate to 400Khz MOV.B #7, I2CSCLL ; Set Baud Rate to 400Khz BIS.B #I2CEN,&U0CTL ; Enable I2C //INITIALIZE VARIABLES MOV.B #0, I2CFlags MOV.W #0, USBBufPtr MOV.B #0, fileFlag MOV.W #130, R10 CALL #DELAY MOV.B #0FFh, &P4OUT //CALL #I2C_RESET EINT MainLoop ; Wait here until a code file is transfered BIT.B #80h, I2CFlags ; Is sampling on? JNC MainLoop ; Nope, don't do anything #include "msp430x16x.h" #define RD_ (0x0001) #define WR (0x0002) #define TXE_ (0x0004) #define RXF_ (0x0008) #define SI_WU (0x0010) #define PWREN_ (0x0020) #define MAX_CODE_SIZE (0x1000) #define REFLASH_INST (0xA0) #define RESET_BRAIN_INST (0xA2) #define RESET_SKIN_INST (0xA4) #define EXECUTE_CODE_INST (0xA6) #define REFLASH_DEV_INST (0xA8) #define RESET_DEV_INST (0xAA) #define START_SAMPLING_INST (0xAC) #define STOP_SAMPLING_INST (0xAE) #define I2C_BRAIN_ADDRESS (0x0100) #define DATA_BYTES (2) ;_______________________________________________________________________ ; Variables ;_______________________________________________________________________ ;RAM VARIABLES ORG 1140h USBBuf DS MAX_CODE_SIZE USBBufPtr DS 2 nBytes DS 2 Address DS 2 DataPacket DS 18 fileFlag DS 1 fileStatus DS 1 I2CFlags DS 1 BIC.B #I2CEN,&U0CTL ; Reconfigure I2C BIS.B #XA,&U0CTL ; Reconfigure I2C BIC.B #I2CRM,&I2CTCTL ; deactivate Repeat Mode MOV.B #DATA_BYTES, &I2CNDAT ; Read n bytes BIC.B #I2CTRX, I2CTCTL ; Read bytes BIS.B #I2CEN,&U0CTL ; Recommended init procedure BIS.B #MST,&U0CTL ; Master mode //MOV #272, Address ; Last node in network ;------------------------------------------------------------------------------ ORG 08000h ; Progam Start ;------------------------------------------------------------------------------ RESET MOV.W #1130h,SP ; Initialize 'x1x9 stackpointer //STOP WATCHDOG MOV.W #WDTPW+WDTHOLD, &WDTCTL ; stop watchdog //Read sensor info from node X ReadNode MOV Address, &I2CSA CLR R6 MOV #DATA_BYTES, nBytes BIS.B #I2CSTT+I2CSTP,&I2CTCTL ; Initiate transfer ReadByte MOV #0200h, R10 ; Timeout for reception CALL #I2C_GET_BYTE ; Get byte CALL #USB_SEND ; Send it through USB //MOV.B R5, DataPacket(R6) ; Save byte INC R6 DEC.B nBytes JNZ ReadByte //MOV #400, R10 //CALL #DELAY //INITIALIZE SVS MOV.B #060h+PORON,&SVSCTL ; SVS POR enabled @ 2.6V //INITIALIZE CRYSTAL (8.000 MHZ) BIC #OSCOFF,SR ; Turn on osc. BIS.B #XTS, &BCSCTL1 ; LFXTL high-freq mode L1 ; wait for crystal to stabilize BIC.B #OFIFG,&IFG1 ; Clear OFIFG MOV #0FFh,R15 ; Delay L2 DEC R15 JNZ L2 BIT.B #OFIFG,&IFG1 ; Re–test OFIFG JNZ L1 ; Repeat test if needed BIS.B #SELM0+SELM1,&BCSCTL2 ; Select XT1 as source for MCLK BIS.B #SELS, &BCSCTL2 ; select XT1CLK as source for SMCLK Page 2 of 8 Page 1 of 8
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Author S.N.A.K.E.: A Dynamically Re
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S.N.A.K.E.: A Dynamically Reconfigu
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Table of Contents Abstract 3 Acknow
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List of Figures 2-1 Created by MIT
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E-1 OpenGL Control Header File . .
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Chapter 1 Introduction “Imaginati
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The current project, named S.N.A.K.
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Hardware Each Skin Patch is compose
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living tissue. Particularly in the
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Figure 2-2: Leonardo’s Hand great
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Artificial Sensate Skins elsewhere
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2.1.2 Ultra-dense Sensor Arrays Thi
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2.2 Flexible Circuits Although, not
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2.2.2 Other Technologies Figure 2-6
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human skin. The following design pr
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(a) Skin Patches as data extraction
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Figure 3-3: I 2 C Routing pattern T
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3.2.2 Peer to Peer As we already me
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5. Audio: by adding a MEMS micropho
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Table 3.1: Material thicknesses and
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(a) Node Front (b) Node Back Figure
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Figure 3-9: Skin Patch mechanical t
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used, which only further complicate
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8. Teardrops and filleting were add
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(a) 7.4V, 2.2mAh Li-ion Battery (b)
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in more detail in the Results Chapt
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has a 30mA forward current with a f
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Figure 3-14: Strain gage layer prot
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an unbalanced Wheatstone bridge, fr
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Figure 3-16: QTC response curve for
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(a) Prototype boards used to calibr
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whisker is epoxied to the package o
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Sound The only sensing modality add
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Figure 3-20: Brain regular PCB fabr
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3.4.3 Communications unit The Commu
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Chapter 4 Software “A Scientist d
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Networks. Why is this relevant? Mai
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Figure 4-1: Bootloader memory map C
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Bit Flag Name Description 0x01 FILE
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Figure 4-3: Sampling timing example
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We also mentioned before that there
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Code Instruction Description 0xA0 R
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Component Description 1 Indicates t
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last chapter. Figure 4-5: Automatic
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An important point to stress is tha
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(a) Rotation control (b) Zooming co
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4.3 Communications Software The las
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4.3.2 Peer to Peer Peer to peer com
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Chapter 5 Analysis of Results and E
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Figure 5-1: Stress concentration po
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of the assembled skin patch don’t
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Node SG1 SG2 R(X) R(Y) Δ(X) Δ(Y)
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Or, ∆R = R3 R3 R3 + RC (5.2) Howe
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R3 Microstrain 162Ω −99.7337969
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Figure 5-3: Strain Gage electronic
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(a) Data from both strain gages (b)
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(a) Pressure data being extracted f
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many of these did not work as expec
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Data plots were also extracted for
Page 127 and 128: (a) Temperature sensor data plots (
Page 129 and 130: Figure 5-12: Raw microphone data wi
Page 131 and 132: (a) Activity sensor data (b) Whiske
Page 133 and 134: 5.3 Performance Metrics We have pre
Page 135 and 136: (a) I 2 C data when a 1500Ωs resi
Page 137 and 138: Component # per node Current consum
Page 139 and 140: Finally, since power is readily ava
Page 141 and 142: Chapter 6 Conclusions and Future Wo
Page 143 and 144: surface can be used to sense pressu
Page 145 and 146: Implement P2P Communications: curre
Page 147 and 148: Appendix A Abbreviations and Symbol
Page 149 and 150: Appendix B Bill of Materials 149
Page 151 and 152: Appendix C Schematics and PCB Layou
Page 153 and 154: 1 1 2 2 3 3 4 4 D D C C B B A A Tit
Page 155 and 156: Amp1 P0Amp101 P0Amp102 P0Amp103 P0A
Page 157 and 158: P0Cin02 P0East06 P0North06 P0South0
Page 159 and 160: Cain P0C ain01 P0Cain02 L1 P0L101 P
Page 161 and 162: Figure C-10: Node Bottom Overlay 16
Page 163 and 164: 4 3 2 1 A A Brain Communications Ac
Page 165 and 166: C3v P0C3v01 P0C3v02 Cavcc P0Cavcc01
Page 167 and 168: Appendix D Firmware 167
Page 169 and 170: C:\Documents and Settings\Gerardo\M
Page 177: C:\Documents and Settings\Gerardo\M
Page 183 and 184: Appendix E PC Code 183
Page 185 and 186: 1 c:\Documents and Settings\Gerardo
Page 201 and 202: 12 c:\Documents and Settings\Gerard
Page 207 and 208: Bibliography [1] John C. Ansel. Ski
Page 209 and 210: [33] Joseph Jacobson, B Comiskey, C
Page 211: [68] Vilis Tutis. The physiology of
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