S.N.A.K.E.: A Dynamically Reconfigurable Artificial Sensate Skin ...
S.N.A.K.E.: A Dynamically Reconfigurable Artificial Sensate Skin ...
S.N.A.K.E.: A Dynamically Reconfigurable Artificial Sensate Skin ...
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Figure 3-20: Brain<br />
regular PCB fabrication techniques, and their mechanical properties were of no relevant<br />
significance. Brains, as opposed by Nodes, need to have the ability of quickly and efficiently<br />
relaying information back and forth between the <strong>Skin</strong> Patches and the PC, while allowing<br />
other brains to do so as well.<br />
Given that Brains are not required to do any major data processing, the processing power is<br />
not a direct requirement, however larger and more powerful processors are generally needed<br />
to handle large amounts of data. In the specific case of this project though, data is locally<br />
processed at the nodes and higher-order features rather than pixelated data are transferred<br />
to the Brain by the nodes, which allows the Brains to concentrate more on administrative<br />
tasks of the network, rather than relaying data back and forth, and it also minimizing the<br />
bandwidth required.<br />
Brains are composed of a microcontroller unit, power unit and communications unit; one is<br />
shown in Figure 3-20 The schematics and layouts of the brain, which will be briefly outlined<br />
in the following subsections, are shown in Appendix C.<br />
3.4.1 Processor unit<br />
The processor unit of the brain is composed by the microcontroller, crystal, programming<br />
header and output devices. Having a faster MCU than the one used in the nodes could in<br />
theory, transfer data faster. This would be true if the MCU could extract information from<br />
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