Development of a New Electro-thermal Simulation Tool for RF circuits

More documents

Recommendations

Info

x List of Figures 3.38 Final electrothermal schematic ready for simulation: (a)Thermal resistances are read from file by (b) "ET SET VALUES" function. . . . . . 77 3.39 Schematic Electrothermal menu functions are available using menu buttons. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 3.40 Layout Electrothermal menu functions are available using menu buttons. 79 3.41 Isothermal schematic used in examples with external GUI preprocessor. 82 3.42 ADS IFF export operation steps. (1) From schematic menu user selects "File" and then "Export". . . . . . . . . . . . . . . . . . . . . . . . . . 82 3.43 ADS IFF export operation steps. (2) IFF export window. . . . . . . . . 83 3.44 GUI electrothermal simulator initial window. Preprocessing using (a)IFF and DSN file (b)IFF and TXT configuration file. (c) Next button (d) Options menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 3.45 The user must set the Design Kit Path in Options menu, otherwise (a) after clicking next button, (b) error window appears. . . . . . . . . . . 85 3.46 Options menu: (a) Design Kit Path option (b) Current dir option. . . . 85 3.47 Design kit path selection window with (a)browse button and (b)accept path button. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 3.48 Project dir path selection window with (a)browse button and (b)accept path button. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 3.49 Warning dialog, shown passing from first step to the second step if “Project Dir Path” is not set. . . . . . . . . . . . . . . . . . . . . . . . 86 3.50 GUI electrothermal simulator window for the second step (a) options menu (b) simulator selection menu (c)IFF file browse button (d) layout browse button. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 3.51 Second preprocessing step: (a) after selecting an IFF schematic file, its name appears. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 3.52 Second preprocessing step: (a) selected DSN layout file that does not contain heat sources produces warning. . . . . . . . . . . . . . . . . . . 88 3.53 Second preprocessing step: (a) after selecting a DSN layout file, its name appears. (b) “Next” button is visible. . . . . . . . . . . . . . . . . . . . 89 3.54 Third preprocessing step: (a) selecting the component to substitute, here "Agilent_NPN_Th" transistor (b) Selecting the heat source layer. . . . 89 3.55 Third preprocessing step: (a) from the pop-up menu all components available in IFF schematic. . . . . . . . . . . . . . . . . . . . . . . . . . 90 3.56 Third preprocessing step, where (a) selecting "Yes" the passing to the fourth preprocessing step is performed (b) selecting "No" fourth preprocessing step is omitted. . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
List of Figures xi 3.57 Fourth preprocessing step: (a) pop-up menu in order to select the name of the model (b) pop-up menu with the model instance name, selected in (a). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 3.58 Fifth preprocessing step (a) assigning device instances to (b) particular heat sources coordinates. . . . . . . . . . . . . . . . . . . . . . . . . . . 92 3.59 Heat source coordinates are represented by two pairs of coordinates. x1,y1 x2, y2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 3.60 Fifth preprocessing step: after assignement heat source-device, the table on the right side is increasing. . . . . . . . . . . . . . . . . . . . . . . . 93 3.61 Fifth preprocessing step: final assignment: devices-heat-sources. . . . . 93 3.62 Fifth preprocessing step: Thermal table can be easily arranged and changed according to the user’s desire. . . . . . . . . . . . . . . . . . . 93 3.63 Fifth preprocessing step: After any change in the thermal matrix table, the "assign data" button must be pressed to continue. . . . . . . . . . . 94 3.64 Fifth preprocessing step; Configuration file save window. . . . . . . . . 94 3.65 Fifth preprocessing step: Configuration path is empty, application returns an error. The preprocessing is stopped. . . . . . . . . . . . . . . . 95 3.66 Fifth preprocessing step, thermal matrix computation is performed after clicking yes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 3.67 Sixth preprocessing step: Selecting the substituting model. . . . . . . . 96 3.68 Seventh preprocessing step: Selecting (a)the electrothermal feedback block type (b) coordinates of the placement in the schematic. . . . . . . 96 3.69 Seventh preprocessing step: electrothermal feedback block coordinates can be selected by the user. . . . . . . . . . . . . . . . . . . . . . . . . 97 3.70 Seventh preprocessing step: The electrothermal feedback block coordinates have been accepted by a user. . . . . . . . . . . . . . . . . . . . . 97 3.71 Seventh preprocessing step: Saving the output IFF schematic file. . . . 97 3.72 Seventh preprocessing step: saving the output file . . . . . . . . . . . . 98 3.73 Final preprocessing window. . . . . . . . . . . . . . . . . . . . . . . . . 98 3.74 Anti-close program routine. . . . . . . . . . . . . . . . . . . . . . . . . 99 3.75 Schematic to Simulation 1 . . . . . . . . . . . . . . . . . . . . . . . . . 100 3.76 Graphical output of Simulation 1 . . . . . . . . . . . . . . . . . . . . . 100 3.77 Schematic to Simulation 2. . . . . . . . . . . . . . . . . . . . . . . . . . 101 3.78 Results of Simulation 2 (1). . . . . . . . . . . . . . . . . . . . . . . . . 102 3.79 Results of Simulation 2 (2). . . . . . . . . . . . . . . . . . . . . . . . . 103 3.80 Results of Simulation 2 (3). . . . . . . . . . . . . . . . . . . . . . . . . 103
Page 1: Tesi di Dottorato Università degli
Page 5 and 6: Preface Thermal interactions set a
Page 7 and 8: Contents v 3.2.2 Processing . . . .
Page 9 and 10: List of Figures vii 2.6 Case for th
Page 11: List of Figures ix 3.20 Selecting "
Page 15 and 16: List of Tables 1.1 Comparison betwe
Page 17 and 18: CHAPTER 1 The relevance of the elec
Page 19 and 20: Chapter 1. The relevance of the ele
Page 27 and 28: CHAPTER 2 Thermal models for the el
Page 29 and 30: Chapter 2. Thermal models for the e
Page 55 and 56: Chapter 3. Development of the elect
Page 63 and 64:
Chapter 3. Development of the elect
Page 65 and 66:
Page 67 and 68:
Page 69 and 70:
Page 71 and 72:
Page 73 and 74:
Page 75 and 76:
Page 77 and 78:
Page 79 and 80:
Page 81 and 82:
Page 83 and 84:
Page 85 and 86:
Page 87 and 88:
Page 89 and 90:
Page 91 and 92:
Page 93 and 94:
Page 95 and 96:
Page 97 and 98:
Page 99 and 100:
Page 101 and 102:
Page 103 and 104:
Page 105 and 106:
Page 107 and 108:
Page 109 and 110:
Page 111 and 112:
Page 113 and 114:
Page 115 and 116:
Page 117 and 118:
Page 119 and 120:
Page 121 and 122:
Page 123 and 124:
Page 125 and 126:
Page 127 and 128:
Page 129 and 130:
Page 131 and 132:
Page 133 and 134:
Page 135 and 136:
Page 137 and 138:
Page 139 and 140:
APPENDIX A Design of efficient opti
Page 141 and 142:
Appendix A. Design of efficient opt
Page 143 and 144:
Page 145 and 146:
Page 147 and 148:
Page 149 and 150:
Page 151 and 152:
Page 153 and 154:
List of publications ⋆ F. M. De P
Page 155 and 156:
Bibliography 139 [8] B. Jagannathan
Page 157 and 158:
Bibliography 141 ii. a novel analys
Page 159 and 160:
Bibliography 143 [50] C. C. McAndre
show all

Development of a New Electro-thermal Simulation Tool for RF circuits

Create successful ePaper yourself

Delete template?

Save as template?