Development of a New Electro-thermal Simulation Tool for RF circuits
Development of a New Electro-thermal Simulation Tool for RF circuits
Development of a New Electro-thermal Simulation Tool for RF circuits
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14 2.2. Chip <strong>thermal</strong> model - mathematical considerations<br />
The linearity is assumed, however in a final solution, by applying the Kirchh<strong>of</strong>f<br />
trans<strong>for</strong>m, the nonlinear solution can be received.<br />
For bipolar devices, the heat generation occurs in BC-SCR 1 region. (Fig. 2.1). A<br />
Figure 2.2: Assumptions <strong>for</strong> constructing the <strong>thermal</strong> domain <strong>for</strong> VHS and THS models.<br />
heat is located underneath the emitter window (n region). As an immediate consequence,<br />
the heat source can be approximated as a rectangular parallelepiped volume<br />
centred at a depth zs. In a more simple approximation, the heat source is treated as<br />
an infinetly thin rectangle. In both cases the power density is assumed to be uni<strong>for</strong>m.<br />
There<strong>for</strong>e, two cases will be considered:<br />
(a) Volume Heat Source (VHS). (b) Thin Heat Source (THS).<br />
Figure 2.3: BC-SCR region can be approximated by Volume or Thin Heat Sources.<br />
➤ Volume Heat Source (VHS), where the power density g inside the parallelepiped<br />
is defined as:<br />
g(x, y, z) = P<br />
[W/cm 3 ] (2.4)<br />
VHS<br />
where P is a power density and VHS = H · W · L. W is the BC-SCR width, L is<br />
the length and H thickness.<br />
➤ Thin Heat Source (THS), where the power density g is defined by Eq. 2.5<br />
g(x, y, z) = q · δ(z − zs) [W/cm 3 ] (2.5)<br />
where q = P/W L represents the power density per unit area.<br />
1 Base-Collector Space-Charge Region