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THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE
DALSA Semiconductor<br />
NOW THE WORLD’S LEADING INDEPENDENT<br />
PURE-PLAY MEMS FOUNDRY*<br />
WAFER-LEVEL PACKAGING PROCESS<br />
TECHNOLOGIES EXCEEDING<br />
YOUR EXPECTATIONS<br />
From design to completion, we can manage your<br />
custom project and bring your breakthrough<br />
concept to full volume production.<br />
With years of experience in 3D and wafer<br />
level packaging <strong>technologies</strong> including<br />
through-silicon vias and a wide range<br />
of bonding techniques, DALSA can help<br />
you transcend traditional design limitations.<br />
For additional information, call us toll free: 1-800-718-9701<br />
www.dalsa.com/semi<br />
*Yole Développement Annual Top 30 MEMS Company Ranking
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
ISSUE N°100 OCTOBER 12, 2010<br />
E D I T O R I A L<br />
People<br />
matter,<br />
<strong>technologies</strong><br />
will follow<br />
So here we are … <strong>the</strong> 100 th issue of <strong>Micronews</strong>!<br />
When we created <strong>the</strong> <strong>magazine</strong> 10 years ago<br />
(with <strong>the</strong> support of DARPA to create ETIP, <strong>the</strong><br />
European Technology Information Program),<br />
we did not even consider how far we could go<br />
and how far our readers would take us. Nei<strong>the</strong>r<br />
had we considered that <strong>Micronews</strong> could<br />
open <strong>the</strong> way to a complete Media activity,<br />
with four technological <strong>magazine</strong>s on MEMS,<br />
PV, 3D Packaging, Power & Compound<br />
Semiconductors, and a daily updated website<br />
(i-micronews). … Since <strong>the</strong> 1 st issue of<br />
<strong>Micronews</strong> to this 100th, not only has our<br />
media activity increased but our readership<br />
has increased by a factor of 5! We could have<br />
not done this without all <strong>the</strong> great input and<br />
feedback from you our readers, Thanks!<br />
MEMS<br />
PHOTONICS<br />
New markets inspire growth at Modulight<br />
Modulight, a privately held laser developer<br />
based in Tampere, Finland, has announced<br />
a 35% growth in sales for <strong>the</strong> first half of<br />
2010 compared with <strong>the</strong> same period last year. The<br />
result adds fuel to <strong>the</strong> fire that <strong>the</strong> optics industry<br />
has felt <strong>the</strong> worst effects of <strong>the</strong> global economic<br />
downturn and is moving steadily towards a period<br />
of greater stability.<br />
“One of our customers is involved in <strong>the</strong> handheld<br />
sports rangefinders business, a much more<br />
consumer-oriented field than our traditional highspecification<br />
applications. This market is really<br />
taking off for us - we are talking about hundreds of<br />
thousands of devices per year for initial production<br />
ramp up. Traditionally we have tried to keep away<br />
Medical lasers at Modulight<br />
from this type of high volume-low margin area, but at pico-projection, Modulight is targeting larger<br />
we happen to have an extremely competitive style cinema projection systems as it believes it<br />
offering,” he commented.<br />
can offer something different…<br />
Ano<strong>the</strong>r emerging market for Modulight is displays<br />
and projection, which exploits its ChiliLase red<br />
15<br />
…2 diode lasers. Unlike many laser companies aiming<br />
Pixtronix and Hitachi Displays announce successful joint development<br />
Displays built based upon Pixtronix PerfectLight MEMS display technology to be demonstrated at CEATEC.<br />
Pixtronix announced <strong>the</strong> successful joint<br />
development with Hitachi Displays, Ltd. of<br />
its PerfectLight low power MEMS display<br />
technology for mobile multimedia applications.<br />
The two companies recently completed <strong>the</strong><br />
development of prototype displays, which leverage<br />
ADVANCED PACKAGING<br />
3D-IC memory with wide I/O interface is coming by<br />
2013 says NOKIA<br />
Kauppi Kujala from NOKIA announced at Semicon Taiwan 2010 Show <strong>the</strong><br />
high volume adoption of through silicon vias (TSV) for « wide IO » for DRAM<br />
and logic integration by 2013.<br />
In a presentation made at Semicon Taiwan, senior<br />
engineering and R&D manager Kauppi Kujala of<br />
Nokia disclosed <strong>the</strong> company roadmaps for 3D<br />
integration. He described <strong>the</strong> steps from “2.5D” to true<br />
PLATINUM PARTNERS<br />
Handheld sports rangefinders and laser cinema fuel a 35% growth at Modulight<br />
during <strong>the</strong> first half of 2010.<br />
“3D” using various applications of TSVs in silicon<br />
interposers, memories and integrated<br />
circuits (ICs).<br />
19<br />
<strong>the</strong> Pixtronix proprietary technology and were built<br />
by Hitachi Displays. These displays were<br />
demonstrated by Hitachi Displays at CEATEC<br />
Japan exhibition, October 5-9, Makuhari Messe,<br />
Tokyo, Japan.<br />
The PerfectLight display is an innovative lowpower<br />
multimedia display for portable devices,<br />
achieving 135% NTSC color gamut, 24-bit color<br />
depth, 170-degree viewing angles, and 100<br />
microsecond shutter response times; all<br />
with a 75% power reduction over LCD<br />
6<br />
displays…<br />
C O N T E N T S<br />
•MEMS 6<br />
•MICROFLUIDICS 11<br />
•COMPOUND SEMICONDUCTORS 13<br />
•PHOTONICS 15<br />
•PHOTOVOLTAIC 16<br />
•ADVANCED PACKAGING 19<br />
•NANOTECHNOLOGY 21<br />
•POWER ELECTRONICS 22<br />
Y O L E D É V E L O P P E M E N T<br />
Free registration on<br />
www.i-micronews.com<br />
1
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
EDITORIAL<br />
From our first issue, which was mostly a focus on<br />
MEMS, we have broadened <strong>the</strong> scope of our<br />
analysis covering all <strong>the</strong> non-mainstream<br />
<strong>semiconductor</strong> industry. Today, <strong>Micronews</strong> is<br />
probably <strong>the</strong> only <strong>magazine</strong> with such a broad focus<br />
on MEMS, Advanced Packaging, Nano<strong>technologies</strong>,<br />
Compound Semiconductors, Power, Microfluidics,<br />
Photonics … We were probably <strong>the</strong> first to realize<br />
that MEMS <strong>technologies</strong> were diffusing into <strong>the</strong><br />
<strong>semiconductor</strong> through advanced packaging and<br />
3D integration. At <strong>the</strong> very beginning, we also have<br />
been realized very quickly how <strong>the</strong> cell phone would<br />
aggregate all innovative <strong>technologies</strong> with new<br />
sensors, new packaging, new functionalities… As<br />
you know our media coverage is driven by our Yole<br />
analysis activity, where we have enlarged <strong>the</strong> scope<br />
of our analysis and created new competencies to<br />
provide our customers real added value on <strong>the</strong><br />
<strong>technologies</strong> & markets evolution.<br />
Through <strong>the</strong>se 10 years, many people have<br />
contributed to <strong>the</strong> success of our media. And if you<br />
give a look at this issue 100 cover (we are quite<br />
proud of it …), you will probably recognize familiar<br />
faces. We have now expanded our Media network<br />
to external contributors and journalists.<br />
We hope to contribute to <strong>the</strong> MEMS history through<br />
our different Medias. Back to history, <strong>the</strong> major<br />
milestones we have identified since <strong>the</strong> first MEMS<br />
are:<br />
• 1965: The first MEMS (a resonator) by Westinghouse<br />
(a CMOS process!)<br />
• 1979: Bulk micromachined accelerometer by<br />
Stanford<br />
• 1982: Surface micromachined accelerometer by<br />
IBM<br />
• 1993: CMOS is used for lateral MEMS accelerometer<br />
by ADI<br />
• 2000: The Internet bubble explodes. Optical<br />
MEMS developments are slowly dying.<br />
• 2002: First issue of <strong>Micronews</strong><br />
• 2005: The MEMS market is above US$5B. MEMS<br />
are processed on 200mm. The DRIE is moving<br />
outside <strong>the</strong> MEMS industry for CMOS Image<br />
Sensors WLP.<br />
• 2005: DRIE is drifting from <strong>the</strong> MEMS industry to<br />
<strong>the</strong> IC world for 3D TSV. As for bonders and thin<br />
wafers handlers.<br />
• 2010: Airbag accelerometers have saved more<br />
100s of thousands lives. MEMS market is booming<br />
thanks to <strong>the</strong> consumer application. Disruptive<br />
<strong>technologies</strong> bring more and more functionalities<br />
and added value through <strong>the</strong> integration of new<br />
<strong>technologies</strong> (micro source of energy, wireless<br />
communication, sensor fusion …).<br />
In this issue, you will discover we are introducing a<br />
new column “inside”. The “Inside” article will present<br />
an end-product with an analysis of <strong>the</strong> internal<br />
WITH MEMS,<br />
THINGS WILL<br />
BE SMARTER<br />
YOU NEED<br />
ONE IN YOUR<br />
BRAIN !<br />
workings of <strong>the</strong> <strong>the</strong> micro/nano <strong>technologies</strong>. In this<br />
issue, we present what’s “inside“ a Wii accessory.<br />
It is our goal to always broaden <strong>the</strong> scope of our<br />
analysis, not only focusing on devices, but also on<br />
applications, markets and of course people! As<br />
always, we aim at being <strong>the</strong> first to identify and<br />
present to you what <strong>the</strong> new <strong>disruptive</strong> <strong>technologies</strong><br />
breakthroughs will be!<br />
2010 is close to <strong>the</strong> end, and with 2011 right around<br />
<strong>the</strong> corner. Stay tuned to our Media activities. You<br />
will discover new exciting content in <strong>the</strong> next<br />
months!<br />
Dr. Éric Mounier<br />
Editor-in-chief<br />
TO MEET US<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
MEMS Technology Summit - Stanford, CA -<br />
October 19-20, 2010<br />
The event will feature more than 30 speakers<br />
and panelists over two days that will represent<br />
<strong>the</strong> "who's who" of <strong>the</strong> MEMS community. The<br />
conference organizers include Janusz Bryzek,<br />
Joseph Mallon and Kurt Petersen, <strong>the</strong> founders<br />
of NovaSensor, and Roger Grace, a key fi gure<br />
in <strong>the</strong> MEMS Industry.<br />
Semicon Europa - Dresden, Germany -<br />
October 19-21, 2010<br />
SEMICON Europa is <strong>the</strong> industry’s leading<br />
European forum for addressing <strong>the</strong> challenges<br />
GOLD PARTNERS<br />
facing today’s global <strong>semiconductor</strong> industry.<br />
SEMICON Europa 2010 will be located again in<br />
Dresden at <strong>the</strong> heart of <strong>the</strong> Silicon Saxony, this<br />
time co-located with <strong>the</strong> Plastic Electronics<br />
Europe Conference under <strong>the</strong> umbrella of<br />
"Converging Electronics Week 2010.<br />
LOAC World - San Diego, CA - October 28-29,<br />
2010<br />
Select Biosciences is pleased to announce <strong>the</strong>ir<br />
second annual Lab-on-a-Chip World Congress.<br />
This year's event is being held in <strong>the</strong> fabulous<br />
location of La Jolla, San Diego. The congress<br />
is being co-located with Microarray World<br />
Congress, Molecular Diagnostics World<br />
Congress and Single Cell Analysis Summit. All<br />
delegates will have access to all four meetings,<br />
and <strong>the</strong> large combined exhibition, ensuring a<br />
very cost effective trip.<br />
CONSULTING<br />
2
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
INSIDE…<br />
Inside… Nintendo Wii MotionPlus<br />
Consumer electronics is <strong>the</strong> most dynamic market for motion sensing: accelerometers, gyroscopes & magnetometers.<br />
Yole Développement forecasts <strong>the</strong> gyros market value for consumer is growing from US$251M in 2009 to US$1B in 2015.<br />
Competition is tough between STMicroelectronics, Panasonic, Invensense, Epson Toyocom and Sony. Here <strong>the</strong> Reverse<br />
Engineering made by our partner System Plus Consulting shows <strong>the</strong> Wii accessory integrates both Epson Toyocom single<br />
axis and InvenSense dual-axis gyroscope.<br />
In <strong>the</strong> game console field, <strong>the</strong> Nintendo Wii<br />
MotionPlus accessory was <strong>the</strong> first to utilize high<br />
volumes of MEMS gyro sensors.<br />
This accessory comes as a supplement to <strong>the</strong><br />
standard remote controller, bringing a higher accuracy<br />
to movement detection, especially suited for sport<br />
games. It was introduced to <strong>the</strong> market in <strong>the</strong> spring<br />
of 2009.<br />
When we look INSIDE <strong>the</strong> device, we see 2 gyroscopes<br />
on <strong>the</strong> PCB:<br />
• The Epson Toyocom X3500W is a single axis<br />
gyroscope. It offers an integration of a QMEMS<br />
gyroscope and a control ASIC in one package.<br />
The gyro sensor is processed using a bulk<br />
micromachining process of a Quartz wafer<br />
(QMEMS process). The component is provided in<br />
a standard ceramic LCC 8-pin hermetic package.<br />
• The InvenSense IDG-600/650 is a dual-axis MEMS<br />
gyroscope using bulk micromachining process. It<br />
offers a 3-D integration of a MEMS gyroscope and a<br />
control ASIC in one package. The component is<br />
provided in a standard QFN 28-pin package.<br />
More than 50 million Motion Plus controllers have been<br />
sold since <strong>the</strong>ir introduction in June 2009.<br />
However, this is just <strong>the</strong> beginning, since new motion<br />
sensing solutions with MEMS gyroscope are now being<br />
released in <strong>the</strong> market. For example, released in<br />
September 2010, Sony Move game controller integrates<br />
9 degrees of freedom with <strong>the</strong> use of accelerometers,<br />
gyroscopes and compass. Utilizing complex sensor<br />
fusion algorithms creating more precise gesture<br />
recognition, more immersive gaming experiences are<br />
3A<br />
3A<br />
3A<br />
G<br />
MEMS & Sensors<br />
© October 2010<br />
Hokuriku<br />
Murata<br />
ADI<br />
2006 2008<br />
produced. And now, Nintendo plans to add motion<br />
sensing features in portable game stations, with <strong>the</strong><br />
integration of accelerometers and gyroscopes in <strong>the</strong><br />
3DS to be released in February 2011.<br />
Yole sees believes 2 gyroscope providers will benefit<br />
from <strong>the</strong>se changes in <strong>the</strong> industry:<br />
• The 2-axis gyro in <strong>the</strong> Move controller is from Sony,<br />
a newcomer in <strong>the</strong> MEMS gyroscope landscape.<br />
Sony has developed 2-axis solution that is now<br />
Motion sensors for gaming<br />
Supply chain<br />
2G<br />
ST<br />
G<br />
InvenSense<br />
Epson Toyocom<br />
Kionix<br />
Epson Toyocom<br />
Legend:<br />
3A: 3-axis accelerometer / G: single axis gyroscope / 2G: 2-axis gyro / 3G: 3axis gyro / 3M: 3-axis magnetometer<br />
2010<br />
3A<br />
2G<br />
3M<br />
3A<br />
3G<br />
3G<br />
Kionix<br />
Sony<br />
AKM?<br />
ST?<br />
Panasonic?<br />
Invensense 2-axes gyroscope<br />
Epson – Toyocom 1-axis gyroscope<br />
integrated in its own DSCs since end 2009 in all Sony<br />
DSCs except high-end products. Those parts are also<br />
sold to few DSC manufacturers in Japan, and now<br />
integrated in <strong>the</strong> PS3 Move game controller, which<br />
means that Sony now has a very large gyro market<br />
share!<br />
• Panasonic has recently launched its 3-axis gyroscope<br />
and is actively promoting it in <strong>the</strong> gaming and mobile<br />
phone industry. Yole expects to see Panasonic 3-axis<br />
gyroscope integrated in <strong>the</strong> future Nintendo 3DS<br />
Competition is gaining in intensity as <strong>the</strong> gaming<br />
gyroscope market becomes increasingly attractive.<br />
Established players (ST, Epson Toyocom, InvenSense)<br />
are also pushing hard to introduce 3-axis gyroscopes<br />
to this market while new large players such as (Bosch<br />
Sensortec) are also expected to enter this market. It is<br />
possible that a unique 3-axis gyro could be in <strong>the</strong> works<br />
to replace <strong>the</strong> 2-axis gryo + single axis gryo of <strong>the</strong><br />
Motion Plus controller<br />
Current integration of several types of sensors opens<br />
<strong>the</strong> way for even more technology or capability. Yole<br />
forecasts increased market traction for MEMS IMUs<br />
within one or two generation of products, provided that<br />
<strong>the</strong> cost of such package becomes more attractive<br />
compared to <strong>the</strong> simple addition of accelerometer and<br />
gyroscope discrete sensors.<br />
www.systemplus.fr<br />
www.yole.fr<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
3
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
4
THE DIS RUPTI VE SEMICONDUCTOR TECH N O LOGIES MAGAZI N E<br />
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
REVERSE ENGINEERING<br />
New Apple iPod Nano showcases 2x2mm 3-axis accelerometer by<br />
STMicroelectronics<br />
Chipworks finds STMicroelectronics design win in Apple's new Nano with stealth-mode 2x2 mm accelerometer.<br />
Recently Apple launched a range of updated<br />
products, including <strong>the</strong> sixth-generation<br />
iPod Nano MP3 player (Fig. 1). Chipworks<br />
performed our usual teardown and found<br />
some new design wins not seen in earlier models.<br />
Notable fi ndings include a touchscreen controller by<br />
Cypress Semiconductor, package-on-package (PoP)<br />
assembly containing <strong>the</strong> Apple processor and<br />
Samsung DRAM, an FM tuner from Silicon labs, and<br />
<strong>the</strong> first-of-its-kind 2 mm x 2 mm 3-axis MEMS<br />
accelerometer by STMicroelectronics (ST).<br />
On <strong>the</strong> circuit board from <strong>the</strong> Nano, <strong>the</strong> largest chip is<br />
<strong>the</strong> PoP with <strong>the</strong> Apple applications processor and 128<br />
MB of Samsung mobile DRAM, and we have highlighted<br />
<strong>the</strong> A2L accelerometer chip (Fig. 2). The package mark<br />
is obscure, but <strong>the</strong> Nano has a rotating display and is<br />
tap-sensitive, so <strong>the</strong>re has to be an accelerometer<br />
present, and this looked <strong>the</strong> most likely.<br />
A sideview x-ray (Fig.3) clears up any doubt that <strong>the</strong><br />
A2L is a MEMS, with an ASIC on top, and a notably<br />
tight wiring profi le to help achieve <strong>the</strong> 2 x 2 mm footprint<br />
package height is ~1 mm). The dark line between <strong>the</strong><br />
cap and <strong>the</strong> MEMS die is <strong>the</strong> gold hermetic seal for <strong>the</strong><br />
MEMS assembly.<br />
Fig. 4 shows <strong>the</strong> de-lidded C5L24A MEMS die which<br />
has been fabbed in ST’s THELMA process, and Fig 5<br />
<strong>the</strong> V565A ASIC die. The MEMS die is 1.33 mm x 1.53<br />
mm (2.03 mm 2 ), and <strong>the</strong> ASIC is 1.09 mm x 1.59 mm<br />
(1.73 mm 2 ).<br />
Given that Bosch Sensortec has claimed industry<br />
leadership with <strong>the</strong>ir 2 x 2 mm BMA220 accelerometer,<br />
is it surprising that ST appear to have made no<br />
announcement about this specific device, although <strong>the</strong>y<br />
did announce a 2 x 2 mm part (but no part number) at<br />
CES in January. Maybe Apple is enforcing a publicity<br />
ban on announcing <strong>the</strong> part; we have heard that when<br />
Fig. 1 Apple’s 6th-Gen iPod Nano<br />
an Apple design win is a fi rst for a new part, <strong>the</strong>y like<br />
suppliers to keep to <strong>the</strong>ir non-disclosure agreements,<br />
even after <strong>the</strong> public teardowns have appeared.<br />
The A2L has given <strong>the</strong> Nano new functionality to go with<br />
<strong>the</strong> new display, so ST has helped Apple push <strong>the</strong><br />
product into a new consumer space. Apple must have<br />
been at <strong>the</strong> head of <strong>the</strong> line for this one – <strong>the</strong> Nano was<br />
released in <strong>the</strong> fi rst week of September, and according<br />
to <strong>the</strong> CES press release, mass production at ST was<br />
due to start in Q3.<br />
By Dick James<br />
Senior Technology Analyst<br />
djames@chipworks.com<br />
Fig. 2 iPod Nano Board and<br />
A2L Accelerometer<br />
Fig. 3 Side-View X-ray Image of A2L Accelerometer<br />
Fig. 4 C5L24A MEMS Die with Lid Removed<br />
Fig. 5 V565A ASIC Die<br />
Recent Reports on STMicroelectronics MEMS Devices - Report Code<br />
• STMicroelectronics L3G4200D MEMS Three-Axis Gyroscope Exploratory Report - EXR-1006-802<br />
For ordering details, contact Chipworks<br />
• STMicroelectronics L3G4200D MEMS Three-Axis Gyroscope Layout Analysis (ICWorks Surveyor) - ICS-1006-801<br />
www.chipworks.com<br />
• STMicroelectronics LSM303DLH 3-Axis Accelerometer and 3-Axis Honeywell Magnetometer Sensor MEMS Process Review - MPR-1002-801<br />
• STMicroelectronics LYPR540AH Three-Axis Analog Output Gyroscope MEMS Process Review - MPR-1002-802<br />
• STMicroelectronics 2-Axis Gyroscopes: LPR530AL, LPY530AL, LPY430AL, and LPR430AL Exploratory Report - EXR-0908-801<br />
• STMicroelectronics LY530AL Single-Axis Analog and Digital Yaw Rate Gyroscope Exploratory Report - EXR-0904-801<br />
• STMicroelectronics LIS331DLH 3-Axis MEMS Accelerometer Exploratory Report - EXR-0903-801<br />
• STMicroelectronics LIS331DLH Three-Axis MEMS Accelerometer Layout Analysis (ICWorks Surveyor) - ICS-0903-801<br />
Inside Technology<br />
• STMicroelectronics LIS302DL 3-Axis ±2g/±8g Digital Output “Piccolo” Accelerometer Exploratory Report - EXR-0804-802<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
5
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
MEMS<br />
Pixtronix and Hitachi Displays announce successful joint development<br />
From page 1<br />
In addition, this new class of display offers<br />
Application Agility to dynamically optimize image<br />
quality and power consumption for all applications,<br />
ranging from full speed video to e-reader operation in<br />
SiTime introduces interactive, online design support tools<br />
SiTime announced <strong>the</strong> availability of interactive,<br />
online Part Number Generator and Cross<br />
Reference tools that accelerate <strong>the</strong><br />
deployment of SiTime's products. Both <strong>the</strong>se tools<br />
are closely integrated with a Sample Request page,<br />
ensuring that customers around <strong>the</strong> world can<br />
instantly configure and request <strong>the</strong> best SiTime<br />
product for <strong>the</strong>ir application and receive <strong>the</strong>m within<br />
a week. "Simplifi cation, worldwide availability and<br />
24x7 access are keys to success in <strong>the</strong> global<br />
electronics business," said Piyush Sevalia, Vice<br />
President of Marketing at SiTime. "These new<br />
a single device. The PerfectLight display is based<br />
upon Pixtronix's Digital Micro Shutter MEMS<br />
technology, which is built within LCD infrastructure<br />
and eliminates liquid crystals, polarizers and color<br />
New tools accelerate deployment of MEMS-based silicon timing solutions.<br />
interactive tools enable our customers to rapidly<br />
replace <strong>the</strong>ir legacy quartz-based oscillators with<br />
SiTime's MEMS-based silicon timing solutions and<br />
capture <strong>the</strong>ir benefi ts more quickly."<br />
Customers can use <strong>the</strong> Cross Reference Tool to<br />
locate <strong>the</strong> best SiTime product that replaces <strong>the</strong>ir<br />
existing quartz oscillator. Separately, customers can<br />
use <strong>the</strong> Part Number Generator, available on each<br />
product page, to confi gure SiTime's oscillators and<br />
create <strong>the</strong> most optimized solution for <strong>the</strong>ir system.<br />
The Part Number Generator has unique features that<br />
simplify operation, such as:<br />
filters to enable a highly efficient, programmable, and<br />
durable display.<br />
www.pixtronix.com<br />
• Real time configurability — <strong>the</strong> generated part<br />
number changes dynamically with changes in<br />
selected features<br />
• "Any Sequence" operation — a customer can select<br />
features in any convenient order<br />
• "Active Highlights" — which clearly show <strong>the</strong> features<br />
that have already been selected<br />
• One click reset and one click copy — for use of <strong>the</strong><br />
part number in o<strong>the</strong>r applications<br />
• Mouseover messages — for real time help<br />
www.sitime.com<br />
Discera and Si-Ware Systems announce successful delivery of ASIC technology<br />
for next-generation low-power MEMS devices<br />
Si-Ware Systems has delivered critical ASIC technology for Discera’s next generation low-power MEMS devices.<br />
Si-Ware Systems’ ASIC technology advances<br />
<strong>the</strong> capabilities frontier for Discera’s next<br />
generation products by enabling extended<br />
temperature range and stability and superior jitter<br />
performance over previous technology. “Delivering<br />
smaller, lower power products for consumer, mobile,<br />
and video applications requires <strong>the</strong> high quality of Si-<br />
Ware technology,” said Discera CEO Bruce Diamond.<br />
"Our extensive experience in ASIC <strong>technologies</strong> for<br />
MEMS devices allows us to consistently deliver high<br />
performance, high reliability products with Discera,"<br />
said Si-Ware Systems CEO Hisham Haddara.<br />
Leveraging its strong expertise in analog, mixed-signal<br />
and RF design, Si-Ware Systems works with its<br />
customers to deliver ASIC technology for a broad<br />
range of markets and applications. Si-Ware has a<br />
proven track record in providing high quality timing<br />
solutions, inertial sensing IC's, MEMS electronic<br />
systems and low power ASICs.<br />
www.si-ware.com<br />
www.discera.com<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
Microvision raises $12M through equity financing<br />
Microvision announced that it has raised $12.375 million pursuant to a previously announced equity financing facility with<br />
Azimuth Opportunity Ltd.<br />
Microvision issued approximately 6.3 million<br />
shares of its common stock to Azimuth for<br />
an aggregate purchase price of $12.5 million.<br />
Out of those proceeds, it paid a placement agent fee<br />
of $125,000 to Reedland Capital Partners, an<br />
institutional division of Financial West Group.<br />
Microvision intends to use <strong>the</strong> funds for general<br />
SPAWAR looks to smart system technology & commercialization center for<br />
MEMS sensor technology<br />
Military sensors specialists at <strong>the</strong> U.S. Space and Naval Warfare Systems Command (SPAWAR) are looking to<br />
microelectronics experts at <strong>the</strong> Smart System Technology & Commercialization Center (STC) to fabricate MEMS<br />
for military sensor systems.<br />
Officials of <strong>the</strong> SPAWAR Systems Center<br />
Pacifi c announced <strong>the</strong>ir plans to negotiate a<br />
sole-source contract with <strong>the</strong> STC to provide<br />
MEMS sensor fabrication and diagnostic support for<br />
sensors, including starting wafer material and masks<br />
necessary to fabricate <strong>the</strong> devices. STC will handle<br />
wafer sizes as large as 150 millimeters in diameter.<br />
SPAWAR will ask STC to fabricate intelligence,<br />
corporate purposes, including, but not limited to,<br />
working capital and capital expenditures.<br />
In August, Microvision announced that it had secured<br />
a committed equity fi nancing facility under which it<br />
may sell up to $60 million of its shares of common<br />
stock to Azimuth over a 24-month period. The<br />
company’s PicoP ® display technology platform is<br />
surveillance and reconnaissance (ISR) sensors;<br />
inertial sensor components; acoustic sensor<br />
components; energy-harvesting components; optoelectro-mechanical<br />
systems; and-resistive heaters.<br />
Located outside Rochester, N.Y., <strong>the</strong> 140,000-squarefoot<br />
STC facility has more than 50,000 square feet of<br />
certifi ed cleanroom space with 150-millimeter wafer<br />
production, plus a dedicated 8,000-square-foot<br />
designed to enable next-generation display and<br />
imaging products for pico projectors, vehicle displays<br />
and wearable displays that interface with mobile<br />
devices. Its projection display engine uses laser light<br />
sources to create images with high contrast and<br />
brightness.<br />
www.microvision.com<br />
MEMS and optoelectronic packaging facility. STC<br />
resulted from <strong>the</strong> 20 Sept. merger of <strong>the</strong> Infotonics<br />
Technology Center with <strong>the</strong> Center of Excellence in<br />
Nanoelectronics and Nanotechnology at <strong>the</strong> College<br />
of Nanoscale Science & Engineering (CNSE) in<br />
Albany, N.Y.<br />
www.militaryaerospace.com<br />
6
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
when size, performance and robustness matter<br />
SP100 Digital compensated pressure sensors<br />
Pressure range: 0,5, 1, 2, 7, 12, 15 bar<br />
Key features<br />
Digital interface, SPI<br />
Calibrated and compensated<br />
Sensor self-diagnostic<br />
Unique electronic sensor ID<br />
High reliability and accuracy over lifetime<br />
High media compatibility<br />
Temperature and supply voltage measurement<br />
Low standby current<br />
Wide temperature operating range<br />
SP300 Embedded microcontroller<br />
Pressure range: 0,5, 1, 2, 7, 15 bar<br />
Key features<br />
RISC microcontroller<br />
ROM library functions<br />
5 general RC oscillator<br />
Calibrated and compensated<br />
Sensor self-diagnostic<br />
2 channel LF receiver for wireless applications<br />
High reliability and accuracy over lifetime<br />
High media compatibility<br />
Temperature and supply voltage measurements output<br />
Read more: http://www.sensonor.com/pressure-products/pressure-sensors.aspx<br />
Sensonor Technologies AS • Horten, Norway • phone: + 47 3303 5000 • fax: + 47 3303 5005 • sales@sensonor.no • www.sensonor.com<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
7
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
MEMS<br />
Analog Devices’ MEMS digital gyroscope offers higher rate sensing accuracy<br />
where extreme shock and vibration are present<br />
ADI’s ADXRS453 digital iMEMS ® gyroscope achieves 0.01°/sec/g sensitivity during linear acceleration,16°/hr null offset<br />
stability, and is <strong>the</strong> industry’s most stable, vibration-immune MEMS gyro.<br />
Analog Devices, Inc. (ADI) introduced <strong>the</strong><br />
ADXRS453 iMEMS® gyroscope, <strong>the</strong> latest<br />
addition to ADI’s portfolio of fourth-generation<br />
high-performance, low-power gyroscopes with digital<br />
output. Specifically designed for angular rate<br />
(rotational) sensing in harsh environments, <strong>the</strong> new<br />
gyro features an advanced, differential Quad-<br />
Sensor design that enables it to operate accurately<br />
under intense shock and vibration conditions.<br />
The ADXRS453 is <strong>the</strong> most stable, vibration-immune<br />
MEMS gyro available, with sensitivity to linear<br />
acceleration specifi ed at only 0.01 °/sec/g, vibration<br />
rectifi cation of only 0.0002 °/sec/g2, a noise-rate<br />
density specifi cation of 0.023°/sec/√Hz at +105°C,<br />
null offset stability of 16°/hr and power consumption<br />
of only 6 milliamps under typical conditions. The new<br />
gyro is available in a cavity plastic SOIC-16 and an<br />
SMT-compatible vertical mount package and is<br />
capable of operating across a wide voltage range of<br />
3.3 V to 5 V and an extended temperature range of<br />
-40°C to 125°C. The ADXRS453 is well suited for<br />
industrial and defense applications.<br />
“The ADXRS453 features an innovative Quad-<br />
Sensor design that rejects <strong>the</strong> infl uence of linear<br />
acceleration caused by intense shock and vibration,”<br />
said Kelly Atkinson, defense electronics marketing<br />
manager, Analog Devices. “This enables <strong>the</strong><br />
ADXRS453 to enable complex navigation and GPSaided<br />
dead-reckoning in exceedingly harsh<br />
environments like unmanned aerial vehicles (UAVs),<br />
platform stabilization in land- and sea-based military<br />
vehicles, and avionics equipment where shock and<br />
vibration are present and can cause measurement<br />
errors in less capable gyros.”<br />
The digital output ADXRS453 is capable of sensing<br />
angular rates up to ±300°/sec and its angular rate data<br />
is presented as a 16-bit word within a 32-bit serial<br />
peripheral interface (SPI) message. The ADXRS453<br />
utilizes an internal, continuous self-test architecture.<br />
The integrity of <strong>the</strong> electromechanical system is<br />
checked by applying a high frequency electrostatic<br />
force to <strong>the</strong> sense structure to generate a rate signal<br />
that can be differentiated from <strong>the</strong> baseband rate data<br />
and internally analyzed.<br />
The high-performance ADXRS453 and ADXRS450<br />
iMEMS gyroscopes are available today in sample<br />
quantities with production release scheduled for<br />
December 2010. The ADXRS453 comes in a small<br />
16-lead plastic SOIC package and an SMT-compatible<br />
ceramic vertical-mount package.<br />
www.analog.com<br />
MARKET FOCUS<br />
IMU & High Performance Inertial MEMS 2010 Report<br />
Complete review of <strong>the</strong> 2009-2015 IMU & high performance MEMS market<br />
Yole Développement updated its market & <strong>technologies</strong> dedicated to inertial measurement unit (IMU) and high<br />
performance inertial MEMS devices. The report IMU & High Performance Inertial MEMS 2010 provides worldwide market<br />
metrics from 2009 to 2015, market shares and key IMU applications. It also gives a deep description of gyroscopes and<br />
accelerometers <strong>technologies</strong> and analyzes <strong>the</strong> level of performance for each application.<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
High performance motion sensing is<br />
gaining interest in many industries<br />
In <strong>the</strong> military & aerospace areas, <strong>the</strong> use of Inertial<br />
Measurement Units (IMUs) and o<strong>the</strong>r systems based<br />
on high-performance gyroscopes has been<br />
widespread for navigation, flight control or stabilization<br />
functions for decades. Today Yole Développement<br />
now sees many industrial and healthcare applications<br />
emerging, driven by <strong>the</strong> possibility to integrate new<br />
functionality at low cost, mostly thanks to <strong>the</strong> recent<br />
developments in MEMS accelerometer and gyroscope<br />
technology.<br />
The market for IMUs is estimated to be $1.55B in<br />
2009, dominated by defense and aerospace<br />
applications. Yole Développement sees this market<br />
growing at a 9% annual growth rate, to reach $2.60B<br />
in 2015. Industrial, commercial naval and offshore<br />
applications will be <strong>the</strong> most dynamic with 16.5%<br />
yearly growth, when <strong>the</strong> aerospace and defense<br />
markets will be limited to a 5.5% and 6.8% annual<br />
growth.<br />
Several <strong>technologies</strong> are currently on <strong>the</strong> market,<br />
RLG and FOG-based systems being <strong>the</strong> most<br />
widespread and still benefi ting from progresses in<br />
photonics. However <strong>the</strong> recent and rapid development<br />
of tactical-grade MEMS gyroscope <strong>technologies</strong> has<br />
<strong>the</strong> largest impact on <strong>the</strong> market landscape and on<br />
<strong>the</strong> competition. It is crucial for <strong>the</strong> companies<br />
involved in those markets to invest in <strong>the</strong> right<br />
<strong>technologies</strong> and partners, depending on <strong>the</strong> endmarkets<br />
which are targeted. Different strategies are<br />
observed: some companies carefully invest in<br />
selected <strong>technologies</strong> like <strong>the</strong> market leader<br />
Honeywell, while o<strong>the</strong>rs love all inertial <strong>technologies</strong>,<br />
like Northrop Grumman.<br />
MEMS industrial and tactical-grade type<br />
of sensors, <strong>the</strong> most dynamic technology<br />
Yole Développement sees <strong>the</strong> market growing from<br />
$361.8M in 2009 to $604.6M in 2015 for single MEMS<br />
accelerometers and gyroscopes or assembly of<br />
MEMS accelerometers / gyroscopes. However many<br />
technical and commercial challenges are predicted<br />
for <strong>the</strong> players involved in MEMS: how to guarantee<br />
a high level of vacuum for keeping high performance<br />
over <strong>the</strong> years, how to bring down <strong>the</strong> costs when<br />
most of <strong>the</strong> applications are in <strong>the</strong> 100 or 1000 unit<br />
range per year, why is it so important to avoid export<br />
restrictions like ITAR, what are <strong>the</strong> best business<br />
partners to enter new markets which are sometimes<br />
captive…<br />
The recent availability of tactical-grade MEMS IMUs<br />
is clearly attractive for a wide range of applications.<br />
Indeed many applications will fi nd interest in low-cost<br />
devices while it also opens new market opportunities<br />
such as precision guided munitions or small size<br />
UAVs. This explains why nearly each major IMU<br />
manufacturer has a MEMS technology today,<br />
although <strong>the</strong> status of developments is not <strong>the</strong> same<br />
for all players.<br />
This report is more than a simple update of <strong>the</strong> “IMU<br />
market 2007-2012” report. The involvement of Yole<br />
Developpement on <strong>the</strong> high-end inertial market has<br />
continued to grow in <strong>the</strong> last couple of years, with<br />
discussions with key companies involved in <strong>the</strong> fi eld<br />
all over <strong>the</strong> world and participation in many<br />
conferences.<br />
For more information about this report, please contact<br />
David Jourdan (jourdan@yole.fr)<br />
8
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
24th International Trade Fair<br />
New Munich Trade Fair Centre<br />
09–12 November 2010<br />
Register online and enjoy <strong>the</strong> benefits:<br />
www.electronica.de/en/tickets<br />
e<br />
explor<br />
<strong>the</strong> possibilities of tomorrow.<br />
Automotive e-Mobility<br />
Displays / e-Signage Embedded systems / software<br />
Medical / MEMS Photovoltaics<br />
Time for electronics. Time for <strong>the</strong> future.<br />
Key topics, trends and <strong>technologies</strong>. The latest components, systems and applications.<br />
Visit electronica 2010, <strong>the</strong> international trade fair that will show you today what is<br />
important tomorrow and generate momentum for real growth.<br />
Parallel event: hybridica. Trade fair for hybrid-component production. www.hybridica.de<br />
get <strong>the</strong> whole picture<br />
electronica 2010<br />
components | systems | applications<br />
www.electronica.de/en<br />
100378 e2010Dach-st_MicroNews_186x132_E.indd 1 30.06.10 11:36<br />
Dispensing<br />
Pharmaceutical research<br />
Industrial and environmental testing<br />
Analytical devices<br />
IVD Diagnostic<br />
ic<br />
Trends in IVD:<br />
•Major trend towards point<br />
of care testing through<br />
integration of disposable<br />
biosensors in portable<br />
devices<br />
•Combination of<br />
biosensors and dispensing<br />
devices for <strong>the</strong>ranostics<br />
•Increase sensor density to<br />
enable multiplexing and<br />
screening<br />
5000<br />
4500<br />
4000<br />
3500<br />
3000<br />
2500<br />
2000<br />
1500<br />
1000<br />
500<br />
0<br />
Kidney Dialysis<br />
Safety<br />
Trends in medical:<br />
•Development of BioMEMS<br />
lead to a technology shift<br />
Comfort<br />
Infusion devices Point of care<br />
towards “home Care”<br />
Trends in Home Care:<br />
through miniaturization and<br />
•Home care consists today<br />
integration, from portable<br />
Blood Monitoring<br />
mainly in monitoring of<br />
to implantable<br />
Surgery , imaging,<br />
Patient monitoring<br />
some basic parameters,<br />
•Combination of diagnostic Camera pills<br />
such as temperature, blood<br />
via Bio Sensors and<br />
Home Care<br />
pressure, glucose, comfort<br />
treatment such as drug<br />
Medical<br />
Cardiac Monitoring<br />
and activity.<br />
delivery systems will lead<br />
•Development towards<br />
to improved patient<br />
Activity Monitoring portable technology will<br />
Microsystem monitoring devices for healthcare Respiratory applications Monitoring market 2009-2015 in $M<br />
lead to a transfer of postoperation<br />
monitoring<br />
Oxygen concentrators<br />
Capnographs<br />
Hearing aids<br />
towards home care<br />
•Improvements of sensors<br />
SEPTEMBER 2010 - BIOMEMS REPORT and bio-sensors will lead to<br />
Medical devices<br />
Ventilator and anes<strong>the</strong>sia<br />
improved patient<br />
Home Care<br />
monitoring and prevention<br />
In Vitro Diagnostics<br />
Pharmaceutical and biological Research<br />
2009 2010 2011 2012 2013 2014 2015<br />
Y O L E D É V E L O P P E M E N T<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
9
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
10
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
MICROFLUIDICS<br />
New microfluidic device helps identify and capture breast cancer cells<br />
Researchers have developed a new disposable device that could help identify patients with advanced breast cancer<br />
awaiting drug <strong>the</strong>rapy with trastuzumab, and capture cancer cells that have an abnormal amount of <strong>the</strong> protein HER2.<br />
Benjamin Thierry, of <strong>the</strong> Ian Wark Research<br />
Institute at <strong>the</strong> University of South Australia,<br />
along with his colleagues, has created an<br />
elastic, disposable microfluidic device that can<br />
efficiently catch <strong>the</strong> protein HER2 – which is <strong>the</strong><br />
tyrosine kinase human epidermal growth factor<br />
receptor 2 – found in "aggressive breast cancers with<br />
poor prognosis."<br />
The only way to find out HER2 status in breast cancer<br />
patients now is through fluorescence in situ<br />
hybridization (FISH) or immunohistochemistry, both<br />
of which require biopsies. The problem with biopsybased<br />
testing is that it could lead to treatment that is<br />
ineffective, because <strong>the</strong> HER2 status of <strong>the</strong> primary<br />
tumor in 20 percent of breast cancers differs from <strong>the</strong><br />
HER2 status in that of a metastatic tumor. This<br />
information has led to <strong>the</strong> idea of isolating circulating<br />
tumor cells (CTCs), but this is difficult because<br />
circulating tumor cells exist at very low ratios of 1 to<br />
10 per billion blood cells.<br />
Establishing HER2 status is very critical because<br />
HER2 positive breast cancer patients have benefitted<br />
from drug <strong>the</strong>rapy with trastuzumab (Herceptin), which<br />
are humanized monoclonal antibodies against HER2.<br />
It also decreases recurrence risk by half. Also, <strong>the</strong> side<br />
effects and cost makes it a priority to identify patients<br />
who are HER2 positive. Now, Thierry and his colleagues'<br />
device has <strong>the</strong> ability to detect <strong>the</strong> status of HER2 and<br />
help capture circulating tumor cells. The device is made<br />
of organic silicon found in most contact lenses, and<br />
polydimethylsiloxane (PDMS), which are shampoos<br />
that are transparent, permeable to gasses, and<br />
compatible with soft molding techniques. The device<br />
also contains a polymeric layer on its surface, which has<br />
a large number of reactive molecules in it. Through <strong>the</strong><br />
use of a plasma-based polymerization process, this<br />
layer can attach to proteins that are able to catch cancer<br />
cells while leaving normal blood cells alone.<br />
Thierry's device showed an 80 percent immunocapture<br />
efficacy of HER2 positive cells, and is also<br />
cheaper and easier to make than previous<br />
microfabricated devices, which were developed to<br />
bind to cells of epi<strong>the</strong>lial tissues where <strong>the</strong> cancer<br />
originated, ultimately isolating CTCs.<br />
www.unisa.edu.au<br />
Lockheed Martin and ZyGEM accelerate DNA identification for law enforcement,<br />
homeland security and defense communities<br />
New, fast sample-to-answer DNA analysis platform previewed at 2010 Biometric Consortium conference.<br />
Lockheed Martin and ZyGEM Corp. Ltd. are<br />
unveiling a new DNA analysis system that has<br />
potential to transform how law enforcement,<br />
homeland security and defense communities use<br />
DNA-based identification in support of <strong>the</strong>ir missions.<br />
The prototype, called RapI.D., will be previewed at<br />
a 2010 Biometric Consortium Conference special<br />
session on Rapid DNA.<br />
Developed in collaboration with ZyGEM as a Lockheed<br />
Martin Technology Innovation Initiative, RapI.D.<br />
leverages <strong>the</strong> latest in microfluidic research and<br />
development to accelerate <strong>the</strong> DNA identification<br />
process – essentially building a laboratory on a small,<br />
single chip that reduces <strong>the</strong> processing steps and time<br />
needed for analysis. The RapI.D. platform is<br />
currently in prototype at ZyGEM's Charlottesville, Va.,<br />
MicroLab laboratories, with a Beta version expected<br />
to be released for testing in select laboratories early<br />
next year. The cost and complexity of current forensic<br />
DNA analysis methods has contributed to significant<br />
processing backlogs throughout <strong>the</strong> criminal justice<br />
system. Data from <strong>the</strong> Justice Department's FY 2009<br />
Forensic DNA Backlog Reduction Program suggest<br />
that <strong>the</strong> backlog has increased in recent years,<br />
indicating that <strong>the</strong> 2008 backlogged cases reported<br />
by state and local government applicants for funding<br />
under <strong>the</strong> program had nearly tripled compared to<br />
comparable data from 2005.<br />
www.lockheedmartin.com<br />
www.zygem.com<br />
Pacific Biosciences to raise up to $230 M in IPO<br />
Pacific Biosciences of California Inc said it<br />
expects to raise up to $230 million in an initial<br />
public offering of its common stock. The Menlo<br />
Park, California-based company expects to offer<br />
12.5 million shares at $15-$17 each, with an overallotment<br />
option of 1.9 million shares, it said in an<br />
amended filing.<br />
The life sciences company, which designs machines<br />
to speed up DNA sequencing in labs, sees net proceeds<br />
of $182.5 million, assuming <strong>the</strong> offering priced at $16<br />
per share, <strong>the</strong> mid-point of <strong>the</strong> range. The company<br />
plans to invest about $60-$70 million of <strong>the</strong> proceeds<br />
in its technology platform called single molecule, realtime,<br />
or SMRT technology. Pacific Biosciences initially<br />
filed for an IPO in August. The amended filing detailed<br />
<strong>the</strong> expected pricing of <strong>the</strong> common stock sale.<br />
JP Morgan, Morgan Stanley, Deutsche Bank and Piper<br />
Jaffray are underwriting <strong>the</strong> IPO, <strong>the</strong> company said.<br />
Pacific Biosciences plans to list its shares under <strong>the</strong><br />
ticker symbol "PACB" on Nasdaq.<br />
www.pacificbiosciences.com<br />
FluimediX closes financing round<br />
Funding Supports continued development of <strong>the</strong> NanoCycler platform to include a Warfarin Diagnostic Test.<br />
FluimediX announced that it has received<br />
funding for <strong>the</strong> continued development of <strong>the</strong><br />
NanoCycler, a diagnostic platform for <strong>the</strong><br />
measurement of relevant genetic mutations in<br />
patients. The proceeds of this financing round will be<br />
dedicated to developing a diagnostic test for Warfarin<br />
metabolism. The investment round was led by SEED<br />
Capital Denmark, a leading early stage investor<br />
managing more than € 200 million in total assets.<br />
Existing shareholders also participated in <strong>the</strong><br />
financing. The size of <strong>the</strong> round was not disclosed.<br />
Tomas Ussing, CEO and founder of FluimediX,<br />
commented: “Firstly, it is comprised of low cost, wellestablished<br />
components. Secondly, <strong>the</strong> use of<br />
plastic disposables enables extremely competitive<br />
molecular diagnostic testing, and will thus bring this<br />
type of testing closer to <strong>the</strong> patient. Thirdly, <strong>the</strong> built-in<br />
broad versatility of <strong>the</strong> NanoCycler device will allow<br />
o<strong>the</strong>r tests to be transferred to or developed for <strong>the</strong><br />
NanoCycler platform in <strong>the</strong> future.”<br />
The use of a diagnostic test for Warfarin metabolism<br />
would deliver important clinical benefits and cost<br />
savings to <strong>the</strong> healthcare system. Approximately two<br />
million people start taking Warfarin each year in <strong>the</strong><br />
U.S. Unfortunately, <strong>the</strong> optimal dose differs significantly<br />
due to patient-to-patient genetic variation in how<br />
quickly Warfarin is metabolized, and <strong>the</strong> medical<br />
consequences of under- or over-dosing <strong>the</strong> drug<br />
can be severe. Roughly one-third of <strong>the</strong> population<br />
carries a genetic mutation that results in slow<br />
metabolism of <strong>the</strong> drug, so <strong>the</strong> identification of those<br />
patients who have this mutation could help avoid <strong>the</strong><br />
consequences of under- or over-dosing.<br />
FX device lunch-box<br />
www.fluimedix.com<br />
FX chip<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
11
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
Register Today<br />
to explore “Innovations in High Density<br />
Flowcell Etching”<br />
Wednesday,<br />
October 13<br />
8:00 AM PDT<br />
NEW LIVE WEBCAST<br />
Next Generation Flowcells:<br />
Advanced Fabrication<br />
and Packaging Solutions<br />
Moderator & Speakers:<br />
Frédéric Breussin<br />
Yole Développement<br />
Join our panel of experts, led by Frédéric Breussin<br />
of Yole Développement to discuss <strong>the</strong>se critical issues.<br />
• Genomics companies are pursuing a cost per sequencing<br />
curve that can only be achieved with higher data<br />
density from flowcells.<br />
Wilbur Catabay<br />
SVTC Technologies<br />
• Higher data density requires finer geometries in surface<br />
patterning as well as improved surface chemistry.<br />
• Semiconductor tools, process integration know-how<br />
and understanding <strong>the</strong> properties of <strong>the</strong> materials used<br />
in fabricating and assembling flowcells are required<br />
to maintain <strong>the</strong> density curve.<br />
Chip Spangler<br />
Aspen Technologies<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
For FREE REGISTRATION, please go<br />
to i-micronews, webcast section or click here.<br />
Hosted by Sponsored by Partners<br />
Michael Grimes<br />
Applied Microstructures<br />
12
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
COMPOUND SEMICONDUCTORS<br />
Sony releases 400mW-output blue-violet laser diode for blu-ray disc<br />
Sony Corp released <strong>the</strong> "SLD3237VF," a new blue-violet laser diode expected to be used for recording and playing<br />
Blu-ray discs.<br />
It features a pulsed output as high as 400mW and<br />
supports "BDXL," a new standard for largecapacity<br />
Blu-ray discs.<br />
According to Sony, <strong>the</strong> SLD3237VF is <strong>the</strong> industry's<br />
first blue-violet laser diode that has an output of<br />
400mW or higher. The high output allows to use a<br />
wider variety of optical components such as lenses<br />
and prisms and, thus, to design hardware more<br />
freely.<br />
To realize <strong>the</strong> high output, innovative <strong>technologies</strong><br />
are necessary to prevent <strong>the</strong> end face of a laser<br />
resonator from being melted by <strong>the</strong> heat from laser (a<br />
phenomenon called "catastrophic optical damage"<br />
(COD)) and to enhance <strong>the</strong> crystal quality of GaN<br />
crystal, which is a constituent material for ensuring a<br />
high reliability, <strong>the</strong> company said.<br />
This time, Sony newly developed an end-face coating<br />
material and a film forming method and succeeded in<br />
heightening <strong>the</strong> optical output level that causes COD,<br />
compared with that of <strong>the</strong> company's 300mW-class<br />
laser diode.<br />
Moreover, to improve <strong>the</strong> crystal quality, Sony<br />
developed new MOCVD crystal growth equipment<br />
that is optimized for producing GaN materials. The<br />
equipment can grow crystals on multiple substrates<br />
at <strong>the</strong> same time and deal with a future increase in <strong>the</strong><br />
demand for laser diodes used for Blu-ray discs, <strong>the</strong><br />
company said.<br />
Fur<strong>the</strong>rmore, Sony developed a process and<br />
processing equipment that realize a high production<br />
efficiency in <strong>the</strong> process of processing wafers, which<br />
follows <strong>the</strong> crystal growth process.<br />
The SLD3237VF is mounted in a standard package<br />
with a diameter of 5.6mm. Its operating temperature<br />
range is from 0 to 85°C.<br />
The "SLD3237VF" with an output of 400mW (left) and <strong>the</strong><br />
"SLD3237VFR" with an output of 350mW.<br />
This time, Sony also released <strong>the</strong> "SLD3237VFR,"<br />
which has a pulsed output of 350mW and is mounted<br />
in a package with a diameter of 3.8mm. Its operating<br />
temperature range is from 0 to 90°C.<br />
www.sony.net<br />
Dow Corning to produce 100mm Silicon Carbide epitaxy<br />
Dow Corning announced that it will begin production of 100mm SiC epitaxy, providing a single source for SiC substrates<br />
used in power electronics device manufacturing.<br />
The new product expands Dow Corning’s<br />
product line beyond its existing offerings of<br />
76mm SiC wafers and epitaxy and 100 mm SiC<br />
wafers.<br />
Dow Corning supplies SiC and silicone materials that<br />
can be used in high power applications such as hightech<br />
communications, solar and wind energy systems,<br />
large scale electrical distribution grids, vehicles, and<br />
academic research.<br />
"We are committed to supporting <strong>the</strong> success of our<br />
customers by developing products that enhance<br />
performance while being cost effective," said Fred<br />
Bue<strong>the</strong>r, Commercial Manager, Dow Corning<br />
Compound Semiconductor Solutions. "Dow Corning<br />
is committed to continuing its leadership in supplying<br />
materials solutions to a broad cross section of <strong>the</strong><br />
global electronics industry. Our global expertise and<br />
collaborative approach enable us to deliver solutions<br />
that reliably perform, time after time."<br />
www.dowcorning.com<br />
UCSB researchers claim semi-polar nitride light extraction comparable to<br />
conventional LEDs<br />
Researchers at <strong>the</strong> University of California Santa Barbara report substantial improvement in <strong>the</strong> extraction efficiency of<br />
LEDs grown on semi-polar nitride substrates.<br />
The researchers claim that <strong>the</strong> efficiency's are<br />
comparable to those of conventional c-plane<br />
devices. The findings were published in Applied<br />
Physics Express.<br />
At a drive current of 20mA, <strong>the</strong> devices emitted<br />
SETI drives single chip germicidal UV LED optical output power to a record 100mW<br />
Sensor Electronic Technology Inc (SETI) says that, in its continuing program to develop UV LEDs for germicidal applications,<br />
it has achieved single chip constant current performance of 100mW in <strong>the</strong> germicidal wavelength range.<br />
According to <strong>the</strong> firm, this achievement exceeds<br />
<strong>the</strong> record for maximum optical power out of<br />
a single chip device of this type.<br />
SETI says that although this level of single chip<br />
performance is not yet available in its production<br />
LEDs, high power UV LED lamps are available<br />
under <strong>the</strong> UVCLEAN trademark with germicidal<br />
powers up to 50mW. “High power UV LEDs are<br />
essential to achieve <strong>the</strong> level of disinfection required<br />
in point-of-use and point-of-entry water treatment<br />
systems,” said Remis Gaska, president and CEO<br />
of SETI. “This ongoing development of large area<br />
high power UV LEDs will help to reduce <strong>the</strong> price<br />
per milliwatt and allow UV LEDs to enter cost<br />
sensitive disinfection markets.”<br />
31.1mW, with external quantum efficiency (EQE) of<br />
54.7%.<br />
Researchers expect non-polar and semi-polar nitride<br />
materials to produce improved efficiency LEDs<br />
because of reduced spontaneous and straindependent<br />
(piezoelectric) polarization fields. These<br />
polarization fields tend to pull electrons and holes<br />
apart in <strong>the</strong> light-emitting active region, thus reducing<br />
<strong>the</strong> chances of recombination occurring as photons.<br />
www.ucsb.edu<br />
The firm announced that it had been awarded a<br />
$475,000 Small Business Innovation Research<br />
(SBIR) Phase II award from <strong>the</strong> US National Science<br />
Foundation (NSF) to develop point-of-use (POU)<br />
drinking water disinfection systems based on deep<br />
ultraviolet LEDs (DUV LEDs).<br />
www.s-et.com<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
13
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
Compound Semiconductor<br />
Substrates 2010<br />
A comprehensive survey of usage and markets for:<br />
GaAs, GaP, InP, SiC, Sapphire and bulk-GaN<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
MARKET TRENDS<br />
“GaAs, GaN, GaP, GaAs, InP, SiC and Sapphire substrates now<br />
account for 1.1% of <strong>the</strong> 7,504 million square inches annually<br />
processed in <strong>semiconductor</strong> foundries. However, that small portion<br />
of processed area is compensated by a higher merchant price leading<br />
to a $880M raw substrate market size in 2009 and reaching <strong>the</strong> billion<br />
dollar threshold in 2010” says Dr Philippe Roussel, Project Manager,<br />
Compound Semiconductors.<br />
KEY FEATURES<br />
For each material, <strong>the</strong> report describes:<br />
• The main targeted devices and related market size<br />
• List of <strong>the</strong> main material suppliers and users with product description,<br />
market share and ranking<br />
• Substrate market value and volume<br />
• Overview of current developments and new innovations<br />
• Projection of <strong>the</strong> CS materials market in 2013 and beyond<br />
CONTACT US<br />
For more information, feel free to contact David Jourdan:<br />
Tel: +33 472 83 01 90, Email: jourdan@yole.fr<br />
Y O L E D É V E L O P P E M E N T<br />
14
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
PHOTONICS<br />
New markets inspire growth at Modulight<br />
From page 1<br />
The company’s red lasers are also gaining<br />
traction in <strong>the</strong> medical field, particularly for<br />
fluorescence, photodynamic <strong>the</strong>rapy (PDT)<br />
and surgery.<br />
In <strong>the</strong> midst of <strong>the</strong>se emerging applications, Modulight<br />
still goes back to its roots and is developing new<br />
products for communications. “Today <strong>the</strong> most<br />
interesting market segment <strong>the</strong>re is test and<br />
measurement, specifically <strong>the</strong> optical time-domain<br />
reflectometers used to characterise optical fibers,”<br />
said Petteri. “This is <strong>the</strong> ideal application for our<br />
singlemode high-power pulsed lasers emitting<br />
between 1310 and 1650 nm.”<br />
www.modulight.com<br />
OTDR lasers<br />
UGent and imec launch silicon photonics spin-off Caliopa<br />
Silicon photonics allows for small, highly integrated & low power optical transceivers for data and telecommunication.<br />
Ghent University (UGent) and imec announced<br />
<strong>the</strong> creation of Caliopa, a spin-off from <strong>the</strong>ir<br />
world leading Photonics Research Group. An<br />
initial 2 million Euro in funding was raised from<br />
Baekeland, Fidimec, PMV-Vinnof, a private investor and<br />
<strong>the</strong> founders. Caliopa will develop and market advanced<br />
silicon photonics based optical transceivers for <strong>the</strong> data<br />
and telecommunications markets.<br />
According to <strong>the</strong> latest Market Forecast from<br />
LightCounting LLC, <strong>the</strong> global sales of optical<br />
transceivers will reach $2.4 billion in 2010, with <strong>the</strong><br />
market posting a 13% compound annual growth rate<br />
(CAGR) between 2011 and 2014, as <strong>the</strong> industry<br />
catches up with <strong>the</strong> steadily growing demand for<br />
bandwidth. Caliopa will be able to build on <strong>the</strong> know-how,<br />
intellectual property and experience of years of research<br />
by <strong>the</strong> world renowned Photonics Research Group at<br />
Ghent University and imec led by Prof. Roel Baets. In<br />
addition, it will use <strong>the</strong> expertise in silicon processing of<br />
<strong>the</strong> world-leading nanoelectronics research center<br />
imec. To develop its first products, <strong>the</strong> company raised<br />
2 million Euro in funding from a consortium of investors<br />
led by Baekeland, Fidimec and PMV-Vinnof.<br />
www.caliopa.com<br />
Leti demonstrates <strong>the</strong> integration of CMOS-compatible plasmonic optical<br />
waveguides with silicon photonic devices<br />
Copper waveguides offer potential for developing smaller, more efficient, high-performance photonic components.<br />
CEA-Leti, a leading European research and<br />
development institute in <strong>the</strong> field of silicon<br />
photonics technology, announced that it has<br />
demonstrated <strong>the</strong> efficient integration of silicon<br />
photonic devices with fully complementary metal-oxide<br />
<strong>semiconductor</strong> (CMOS)-compatible plasmonic optical<br />
waveguides. This new capability sets <strong>the</strong> stage for <strong>the</strong><br />
fabrication of smaller, faster and more efficient optoelectronic<br />
interfaces, which could ultimately allow <strong>the</strong><br />
development of significantly higher-performance<br />
sensors, computer chips and o<strong>the</strong>r electronic<br />
components. Waveguides, including optical fibers, are<br />
used to transmit signals and power in a variety of radio<br />
and optical communications uses. Leti's new devices<br />
channel light through a narrow silicon waveguide<br />
placed in close proximity to a metal waveguide, causing<br />
<strong>the</strong> light to excite small, high-frequency electromagnetic<br />
waves, known as surface plasmons, in <strong>the</strong> metallic<br />
structures. The resulting devices can convert optical<br />
signals in <strong>the</strong> 1.5 micrometers (μm) communications<br />
band into plasmonic electron waves, and convert <strong>the</strong><br />
plasmonic waves back into optical signals.<br />
Leti's pioneering combination of extremely small<br />
plasmonic-optical interfaces that connect to standard<br />
optical fibers provides high coupling efficiencies (up to<br />
70 percent) over a wide spectral range. And unlike<br />
previous devices that have relied on metal waveguides<br />
made from gold, Leti's metal waveguides are fabricated<br />
with copper, allowing <strong>the</strong>m to be easily integrated into<br />
standard CMOS chip manufacturing processes.<br />
The plasmonic-optical devices were designed and<br />
fabricated by Leti, which collaborated with France's<br />
Université de Technologie de Troyes (UTT) for<br />
additional near-field scanning optical microscope<br />
testing and characterization. The project results were<br />
presented earlier this month at <strong>the</strong> Group Four<br />
Photonics 2010 show in Beijing, and published in Nano<br />
Letters, a journal of <strong>the</strong> American Chemical Society.<br />
www.leti.fr<br />
Quantum signals converted to telecom wavelengths<br />
Using optically dense, ultracold clouds of rubidium atoms, three key elements needed for quantum information systems<br />
have been advanced — including a technique for converting photons carrying quantum data to wavelengths that can<br />
be transmitted long distances on optical fiber telecom networks.<br />
The developments move quantum information<br />
networks — which securely encode information<br />
by entangling photons and atoms — closer to a<br />
possible prototype system. Researchers at <strong>the</strong> Georgia<br />
Institute of Technology reported <strong>the</strong> findings Sept. 26 in<br />
<strong>the</strong> journal Nature Physics, and in a manuscript<br />
submitted for publication in <strong>the</strong> journal Physical Review<br />
Letters.<br />
The advances include:<br />
• Development of an efficient, low-noise system for<br />
converting photons carrying quantum information at<br />
infrared wavelengths to longer wavelengths suitable<br />
for transmission on conventional telecommunications<br />
systems. The researchers have demonstrated that<br />
<strong>the</strong> system, believed to be <strong>the</strong> first of its kind, maintains<br />
<strong>the</strong> entangled information during conversion to<br />
telecom wavelengths — and back down to <strong>the</strong> original<br />
infrared wavelengths.<br />
• A significant improvement in <strong>the</strong> length of time that a<br />
quantum repeater — which would be necessary to<br />
transmit <strong>the</strong> information — can maintain <strong>the</strong> information<br />
in memory. The Georgia Tech team reported memory<br />
lasting as long as 0.1 second, 30 times longer than<br />
previously reported for systems based on cold neutral<br />
atoms and approaching <strong>the</strong> quantum memory goal of<br />
at least one second — long enough to transmit <strong>the</strong><br />
information to <strong>the</strong> next node in <strong>the</strong> network.<br />
• An efficient, low-noise system able to convert photons<br />
of telecom wavelengths back to infrared wavelengths.<br />
Such a system would be necessary for detecting<br />
entangled photons transmitted by a quantum<br />
information system.<br />
www.gatech.edu<br />
Experimental equipment used to study quantum<br />
information systems at Georgia Tech<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
15
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
PHOTOVOLTAIC<br />
Satcon expands partnership with GCL Solar to include strategic manufacturing<br />
agreement<br />
Additional 500 megawatts in expected annual production capacity beginning in March 2011 increases worldwide<br />
manufacturing capacity to over 2 gigawatts.<br />
Satcon Technology Corporation, a provider of<br />
utility scale power solutions for <strong>the</strong> renewable<br />
energy market, announced a strategic<br />
manufacturing agreement with GCL Solar Systems<br />
Limited, one of China's largest utility solar power plant<br />
developers, to enhance production of <strong>the</strong>ir industry<br />
leading 500 kilowatt (kW) PowerGate Plus line of solar<br />
PV inverters for <strong>the</strong> Asia Pacific market.<br />
Under <strong>the</strong> terms of <strong>the</strong> agreement, GCL Solar is<br />
commissioning a manufacturing facility in Nanjing,<br />
China, which is expected to be capable of producing<br />
over 500 megawatts (MW) of production of <strong>the</strong> 500kW<br />
PowerGate Plus inverters in 2011. Satcon is expected<br />
to provide GCL Solar with <strong>the</strong> core manufacturing<br />
processes and <strong>technologies</strong> for <strong>the</strong> PowerGate Plus<br />
solutions for final assembly at <strong>the</strong> GCL Solar plant.<br />
GCL Solar has agreed to purchase from Satcon <strong>the</strong><br />
capacity to produce a minimum of 300MW per year<br />
out of <strong>the</strong> GCL Nanjing operation. The PowerGate<br />
Plus 500kW inverters manufactured at <strong>the</strong> Nanjing<br />
facility under this Agreement are expected to be sold<br />
by GCL Solar into <strong>the</strong> Chinese solar PV market, and<br />
used on GCL Solar funded utility solar developments<br />
around <strong>the</strong> world.<br />
Production out of <strong>the</strong> Nanjing manufacturing facility<br />
is expected to begin in March of 2011, and when<br />
combined with <strong>the</strong> expanded Burlington, Ontario<br />
operations is expected to increase worldwide<br />
manufacturing capacity to over 2 annual gigawatts.<br />
www.satcon.com<br />
PowerGate 500 kW PV Inverter<br />
Dow Corning unveils plans for new solar energy exploration & development center<br />
Announcement event followed by roundtable discussion on innovation as driver of sustainable growth.<br />
Dow Corning today unveiled plans for its $13<br />
million investment in a Solar Energy<br />
Exploration & Development Center (SEED)<br />
at its European headquarters in Seneffe, Belgium.<br />
This investment expands <strong>the</strong> company’s ability to<br />
innovate with a broad range of European customers<br />
using its silicon-based materials while also enhancing<br />
<strong>the</strong> company’s European-based solar energy<br />
research and development capabilities.<br />
Following a ceremony, which included <strong>the</strong> unveiling<br />
of <strong>the</strong> investment plans, political representatives and<br />
business leaders shared <strong>the</strong>ir views on <strong>the</strong> role of<br />
innovation as a key driver for economic growth in <strong>the</strong><br />
21st Century in Belgium and Europe. The dialogue<br />
created an opportunity for participants to present <strong>the</strong>ir<br />
opinion on ‘Plan Marshall 2.Vert’ (Marshall Plan<br />
2.Green) launched by <strong>the</strong> Walloon government in<br />
September 2009 to boost Wallonia’s economic<br />
growth, including <strong>the</strong> sixth competitiveness pole<br />
announced by Jean-Claude Marcourt, Vice-President<br />
and Minister of Economy of <strong>the</strong> Walloon region, earlier<br />
this year as well as <strong>the</strong> upcoming innovation strategy<br />
and <strong>the</strong> revision of <strong>the</strong> EU’s industrial policy.<br />
The investment in SEED includes two new buildings<br />
that will complement <strong>the</strong> company’s existing Business<br />
& Technology Center in Seneffe, increasing<br />
capabilities and capacity for research and development<br />
in Europe.<br />
One facility, a Syn<strong>the</strong>sis Technology Center for <strong>the</strong><br />
European area, will house laboratories and chemists<br />
focused on increasing Dow Corning’s innovation<br />
portfolio of silicon-based materials and boosting<br />
research in sustainable <strong>technologies</strong>. A second<br />
facility, a European Solar Solutions Application<br />
Center, will seek to advance <strong>the</strong> company’s technology<br />
for use in photovoltaic cells. Construction is expected<br />
to begin later in 2010.<br />
The Walloon region has granted Dow Corning<br />
€ 7.5 million of subsidies to help <strong>the</strong> company with<br />
its investments.<br />
www.dowcorning.com<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
Tigo Energy ® teams with SCHOTT Solar to bring electronic intelligence to<br />
photovoltaic projects<br />
The companies are working toge<strong>the</strong>r to bring electronic intelligence to <strong>the</strong> solar module and increase power output.<br />
As part of <strong>the</strong> partnership, SCHOTT Solar has<br />
extensively tested and established system<br />
compatibility, including <strong>the</strong> frame mounting<br />
procedure, with <strong>the</strong> Tigo Energy Maximizer Solution<br />
and SCHOTT’s industry-leading solar photovoltaic<br />
(PV) modules. Additionally, Tigo Energy will be<br />
actively supporting <strong>the</strong> SCHOTT Solar initiative to<br />
include intelligent electronics in next-generation<br />
module design.<br />
The Tigo Energy Maximizer Solution creates smart<br />
modules that provide up to a 20 percent increase in<br />
energy production, active management capabilities<br />
and enhanced safety for utility, commercial and<br />
residential solar arrays. The implementation of <strong>the</strong><br />
Tigo Energy PV-Safe feature, which enables <strong>the</strong><br />
deactivation of all high voltage DC on <strong>the</strong> rooftop, was<br />
reviewed by local fire agencies and recognized to<br />
significantly reduce risk during a fire emergency.<br />
As part of <strong>the</strong> evaluation stage of <strong>the</strong> partnership,<br />
SCHOTT Solar and Tigo Energy engaged <strong>the</strong><br />
installation community to validate <strong>the</strong> customer<br />
benefits of <strong>the</strong> solution. “The Tigo Energy Maximizer<br />
solution keeps <strong>the</strong> SCHOTT POLY 235 modules<br />
running at <strong>the</strong>ir peak output,” said Jeff Wiggins, CEO<br />
of SolNV and President of Nevada SEIA. “Tigo Energy<br />
and Schott Solar give our customers <strong>the</strong> peace-ofmind<br />
of being able to watch <strong>the</strong> energy production of<br />
each module for <strong>the</strong> full life of <strong>the</strong> installation.” SolNV<br />
completed <strong>the</strong> 5.7kW system installation earlier this<br />
year.<br />
Tigo Energy has developed its innovative Maximizer<br />
technology aimed at accelerating <strong>the</strong> adoption of<br />
today's photovoltaic components and <strong>technologies</strong><br />
increasing system output and maintenance<br />
effectiveness. Tigo Energy products are available in<br />
high volume and can be deployed in residential,<br />
commercial or utility scale systems today.<br />
www.tigoenergy.com<br />
www.schottsolar.com<br />
16
Surface<br />
cleaning<br />
> Wet cleaning<br />
Saw Damage<br />
Removing<br />
> Wet surface<br />
> Etching<br />
Firing<br />
> Infra red Belt<br />
> Furnace<br />
Texturization<br />
> Wet surface etching PN Junction<br />
> Plasma (R&D) Formation<br />
> Phosphorous<br />
diffusion<br />
PSG removal<br />
> Wet bench<br />
> PECVD<br />
Edge Isolation<br />
> Wet etching<br />
> Plasma Etching<br />
> Laser Cutting<br />
Anti reflective<br />
coating<br />
> PECVD<br />
> Sputtering<br />
Front Contact Deposition<br />
> Screen Printing (SP)<br />
> SP + Electroplating<br />
> Inkjet (R&D)<br />
Back Contact Deposition<br />
> Screen Printing<br />
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
MARKET FOCUS<br />
Photovoltaic Technology Roadmap<br />
Latest technology trends in crystalline and thin-film solar cells: An overview on <strong>the</strong> PV industry<br />
up to 2015<br />
Get a clear picture of tomorrow’s winning PV <strong>technologies</strong>.<br />
Yole Développement announces <strong>the</strong> release of<br />
its latest photovoltaic research study, named<br />
Photovoltaic Technology Roadmap, which<br />
presents and analyses <strong>the</strong> latest tech-nology trends<br />
in crystalline and thin-film solar cells.<br />
The results were obtained as a result of a meticulous<br />
data collection process over more than 80 companies<br />
and R&D labs.<br />
There is no doubt that <strong>the</strong> government incentive<br />
programs helped industrial to achieve, step by step,<br />
drastic cost reduction and performance improvements<br />
in a very short period of time but without real<br />
revolutions.<br />
The photovoltaic (PV) industry has also seen <strong>the</strong><br />
emergence of large scale production facili-ties,<br />
international R&D centres, and innovative equipment<br />
makers thus resulting in <strong>the</strong> im-pressive cost reduction<br />
Yole Développement knows. But if large production<br />
facilities can play <strong>the</strong> scale effect card to lower <strong>the</strong> cost<br />
of raw material and increase <strong>the</strong>ir yield, many o<strong>the</strong>r<br />
levers exist in order to reduce <strong>the</strong> production cost.<br />
Photovoltaic<br />
Strategies to reduce production cost<br />
Price reduction - impact of raw material<br />
Increased light trapping effect by<br />
improving surface structuring and<br />
texturization<br />
© August 2010<br />
Crystalline cell manufacturing process<br />
Crys<br />
Redistributing <strong>the</strong> emitter profile on<br />
<strong>the</strong> front surface<br />
Upgrading or changing<br />
metallization processes in order to<br />
get thinner contacts with excellent<br />
electrical properties<br />
New Step<br />
Optimizing <strong>the</strong> passivation layer on<br />
both surfaces to reduce <strong>the</strong><br />
recombination losses<br />
In <strong>the</strong> next slides, fur<strong>the</strong>r details on each step will be provided<br />
“In this PV Technology roadmap report, we describes<br />
all <strong>the</strong> different aspects linked to pro-duction cost<br />
reduction, explains Arnaud Duteil, Market &<br />
Technology Analyst at Yole Développement: from<br />
cell structure innovations to modification of<br />
manufacturing proc-esses.” The microtech market<br />
research company in fact describes all <strong>the</strong> existing<br />
technolo-gies: From those developed by <strong>the</strong><br />
University of New South Wales (UNS W), to <strong>the</strong> metal<br />
wrap through (MWT) concept developed by <strong>the</strong> ECN<br />
and industrialized with Solland, to <strong>the</strong> new emitter<br />
wrap through (EWT) technology being developed by<br />
Bosh Solar.<br />
Conventional crystalline silicon cells could bump up<br />
against <strong>the</strong>ir <strong>the</strong>oretical maximum effi-ciency of 29%<br />
as soon as 2020. Sanyo Electric Co. Ltd., for instance,<br />
demonstrated ~23% ef-ficiency with a 10cm² R&D<br />
unit of its heterojunction with intrinsic thin layer (HIT)<br />
cells last year.<br />
It figures that thinner surface contacts, better<br />
transparent conductors, and lower defect density can<br />
improve performance by several more percentage<br />
points, to likely get commer-cial efficiency up to about<br />
as close as practical to <strong>the</strong> <strong>the</strong>oretical limit within<br />
about ten years.<br />
For more information about this report,<br />
please contact David Jourdan (jourdan@yole.fr)<br />
PV Incentive Programs Country Profiles<br />
Understand <strong>the</strong> impact of incentive programs on PV installations in more than 25 countries<br />
After discussing with key experts of each country, Yole has<br />
analysed <strong>the</strong>ir programs to provide an in-depth analysis on <strong>the</strong><br />
PV demand.<br />
This report provides <strong>the</strong> best information on each country active<br />
in <strong>the</strong> PV field with data summarizing <strong>the</strong> type and <strong>the</strong> definition<br />
of incentive programs in a concise way.<br />
KEY FEATURES<br />
For each country <strong>the</strong> following information is provided:<br />
• General country data<br />
• Share of electricity by source<br />
• Irradiation map<br />
• Description of <strong>the</strong> incentive program<br />
• Breakdown of installation<br />
• Past amount of installation and forecast of governments<br />
CONTACT US<br />
For more information, feel free to contact David Jourdan:<br />
Tel: +33 472 83 01 90, Email: jourdan@yole.fr<br />
• Basic data<br />
• Irradiation<br />
Population 2006 (million) 61.35<br />
GDP 2006 (billion 2000$) 1468.3<br />
Growth of GDP 1990-2006 (%) 2%<br />
Total Energy production (Mtoe) 137.02<br />
Energy use (Mtoe) 272.67<br />
Energy use growth 2005-2006 (%) -1.18<br />
Electricity production (GWh) 574473<br />
Electricity consumption (GWh) 429913<br />
Electric Power consumption per<br />
7585<br />
capita (kWh per capita)<br />
• Source of electricity<br />
Oil 1.24%<br />
Gas 3.84%<br />
Nuclear 78.37%<br />
Hydro 10.63%<br />
Coal/pet 4.58%<br />
Renewable & waste 0.96%<br />
Geo<strong>the</strong>rmal/Solar Thermal/wind 0.37%<br />
Solar PV 0.0038%<br />
• Feed-in-Tariffs* -Tariffs* 2010 granted for 20 years:<br />
Type of<br />
Type of building<br />
Feed-in-tariff<br />
Installation<br />
Houses, schools and hospitals<br />
0.58 /kWh<br />
BIPV installations<br />
Industrial, commercial and agricultural buildings 0.50 /kWh<br />
Roof mounted Industrial, commercial and agricultural buildings 0.42 /kWh<br />
Ground mounted < 250 Kw 0.314 /kWh<br />
Ground mounted > 250 Kw 0.314 /kWh (High irradiation)<br />
0.377 /kWh (Low irradiation)<br />
*Feed-in-tariffs will not change for <strong>the</strong> next 2 years. They will <strong>the</strong>n be revised in 2012 based on inflation rate<br />
and price of installation by <strong>the</strong> Ministry of <strong>the</strong> environment and sustainable development.<br />
• Photovoltaic support scheme is today based on <strong>the</strong> “Decree of July <strong>the</strong> 10 th , 2006, modified on<br />
January <strong>the</strong> 13 th , 2010.<br />
• Capacity planned by <strong>the</strong> government (connected installations<br />
• Type of installations<br />
in MWp)<br />
– Grid Connected: 99 %<br />
2006 2007 2008 2009 2010 2011 2012 2013 2015 2020<br />
• Residential (72%)<br />
• Commercial (15.7%)<br />
Annual 12 28 97 110 170 270 380 550 550 550<br />
• Solar farms (12.3%)<br />
– Rural electrification: 1%<br />
Cumulative 45 73 170 280 450 720 1100 1650 2750 5500<br />
Y O L E D É V E L O P P E M E N T<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
17
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
All over <strong>the</strong> World,<br />
stay connected<br />
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18
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
ADVANCED PACKAGING<br />
3D-IC memory with wide I/O interface is coming by 2013 says NOKIA<br />
From page 1<br />
Kauppi Kujala focused particularly on <strong>the</strong> “wide<br />
IO interface” concept, which aims at increasing<br />
<strong>the</strong> bandwidth between <strong>the</strong> memory and its<br />
driving logic IC thanks to a large “high IO count” data<br />
bus between <strong>the</strong> two circuits. M. Kujala announced<br />
that Nokia is planning to integrate wide IO interface<br />
structures using TSVs for mobile phones in volumes<br />
starting in 2013. These integrated solutions will first<br />
be driven in high end phones addressing <strong>the</strong> need for<br />
higher bandwidth between <strong>the</strong> application processor<br />
and its DRAMs and for lower power consumption too.<br />
Nokia’s preference and first target is to integrate a<br />
stack of 4 DRAMs with TSVs on a processor with<br />
TSVs, all in a single package.<br />
www.yole.fr<br />
Wide IO Package Solutions<br />
• Single package Wide IO. Logic +<br />
up to 4 DRAM. F2B connection.<br />
• Wide IO ogic + 1 DRAM &<br />
additional DRAM on bord.<br />
F2B connection, no TSV<br />
needed for memory.<br />
• Wide IO POP with Logic + 1<br />
DRAM in bottom package &<br />
additional memory as POP F2B<br />
connection, no TSV needed for<br />
memory.<br />
The Wide I/O interface concept to interconnect Logic and stacked DRAM was recently discussed by NOKIA<br />
Qualcomm defines format for 3-D chip stress<br />
Qualcomm has teamed up with Synopsys to define a new data exchange format it believes could be critical for supporting<br />
3-D chip stacks that use through silicon vias.<br />
Qualcomm has already gotten support from at<br />
least one foundry and one chip assembler for<br />
<strong>the</strong> so-called Stress Exchange Format.<br />
The new technique is one of many efforts driving 3-D<br />
chip stacks using through silicon vias (TSVs).<br />
The Global Semiconductor Alliance announced it is<br />
forming a working group on TSVs. Nokia said it has<br />
TSVs on its road map at a recent Sematech meeting<br />
in Taiwan. And Jedec is defining a standard for memory<br />
chips using TSVs. Digital cameras already use TSVs<br />
with 30-50 micron spacing to stack CMOS imagers,<br />
memories and DSPs. A range of o<strong>the</strong>r applications are<br />
in <strong>the</strong> labs using TSVs with spacings in <strong>the</strong> single digits,<br />
said Nakamoto. "You will see products in <strong>the</strong> market<br />
next year," he said.<br />
SEF is essentially a way existing global an local<br />
packaging models can share stress data with new local<br />
models for chips using TSVs. The 3-D stacks face<br />
stress from a variety of mechanical and <strong>the</strong>rmal<br />
sources, in part because <strong>the</strong> stacked dice and vias are<br />
sometimes made of different materials. SEF calculates<br />
an overall factor called residual stress based on <strong>the</strong><br />
result of a variety of stress factors. It applies a 3-D<br />
matrix to <strong>the</strong> silicon area and defi nes residual strain<br />
vectors for each sector. The approach requires<br />
foundries to supply chip designers with 3-D Process<br />
Design Kits that provide data about <strong>the</strong> materials <strong>the</strong>y<br />
use. Synopsys has become <strong>the</strong> fi rst EDA company to<br />
automate <strong>the</strong> process of porting SEF data into a tool,<br />
in this case its Fammos technical CAD program.<br />
Qualcomm has created multiple proof-of-concept<br />
designs using SEF including some fabricated chips<br />
about which it would not share details. Ultimately,<br />
Qualcomm hopes all foundries, packaging houses and<br />
EDA vendors will support SEF.<br />
www.qualcomm.com<br />
RUSNANO to open new 3D Assembly R&D center in Russia<br />
A project to establish technology center for three-dimensional assembly of integrated circuits in Russia has secured<br />
approval from <strong>the</strong> Supervisory Council of RUSNANO.<br />
The technology for three-dimensional assembly<br />
of <strong>semiconductor</strong> elements, or 3D assembly, is<br />
one of today’s most promising methods for<br />
reducing <strong>the</strong> size of <strong>the</strong> integrated circuit. It does this<br />
by making <strong>the</strong> substrate more dense, by raising <strong>the</strong><br />
connectivity inside <strong>the</strong> chip, and by reducing its energy<br />
consumption. The technology makes it possible to<br />
combine components—digital and analog circuits,<br />
memory, and MEMS systems—that have been<br />
produced with different <strong>technologies</strong> in one<br />
encasement. The 3D assembly raises <strong>the</strong> reliability of<br />
microelectronic goods and continues <strong>the</strong> downward<br />
trend in production costs.<br />
In 2008 <strong>the</strong> world market for 3D assembly was $1.3<br />
billion. Experts forecast that microelectronic products<br />
manufactured with 3D assembly will grow fi vefold by<br />
2012 after which <strong>the</strong> technology will attain widespread<br />
use. Forecasted volume in 2015 is $42 billion.<br />
The project that RUSNANO has agreed to support will<br />
create a center where technological processes for 3D<br />
assembly will be developed. There <strong>the</strong> project company<br />
will organize production of three lines: electrochemical<br />
materials based on self-optimizing additives used in<br />
3D assembly of chips with silicon current-conducting<br />
channels, metallization of integrated circuits, and solar<br />
elements. In addition, <strong>the</strong> project intends to produce<br />
electronic elements for 3D assembly that are formed<br />
from its own electrochemical materials.<br />
In 2015 sales of <strong>the</strong> project company in <strong>the</strong> 3D assembly<br />
sector are forecasted at 992 million rubles in <strong>the</strong> global<br />
market and 1.13 billion rubles in <strong>the</strong> domestic market.<br />
In <strong>the</strong> sector for electrochemical materials for copper<br />
metallization, something not done in Russia to date,<br />
<strong>the</strong> company will achieve 6.7 percent of <strong>the</strong> world<br />
market and 100 percent of <strong>the</strong> Russian market. Project<br />
company earnings in 2015 are put at 2.5 billion<br />
rubles.<br />
New production will be based on <strong>the</strong> unique experience<br />
of <strong>the</strong> project applicants, Voronezh Semiconductor<br />
Plant–Assembly and NANO3D SYSTEMS LLC.<br />
There will be two phases for realization of <strong>the</strong> project:<br />
In <strong>the</strong> fi rst (2010–2012), <strong>the</strong> company will organize<br />
production of electrochemical materials and establish<br />
pilot production of electronic devices using 3D<br />
assembly. In <strong>the</strong> second phase (2013–2015),<br />
production of electrochemical materials will grow and<br />
commercial production of electronic devices will<br />
begin.<br />
The total budget for project implementation is about<br />
$50Million. RUSNANO will invest up to $10M in equity<br />
of <strong>the</strong> project company and, in <strong>the</strong> second phase,<br />
extend a guarantee of up to $20M.<br />
www.rusnano.com<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
19
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
MEPTEC PRESENTS<br />
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20
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
NANOTECHNOLOGY<br />
Start-up uses a new laser process for <strong>the</strong> production of highly sterile nanoparticles<br />
The newest spin-off of <strong>the</strong> Laser Zentrum Hannover (LZH) is <strong>the</strong> "Particular GmbH", which uses a new laser process for<br />
<strong>the</strong> production of highly sterile nanoparticles made of almost any material.<br />
The Particular GmbH is a new spin-off firm<br />
from <strong>the</strong> LZH, which was started by two LZH<br />
scientists. Particular uses a new laser process<br />
for <strong>the</strong> production of highly sterile nanoparticles made<br />
of almost any material. There is a high demand for<br />
nanoparticles for research purposes such as medical<br />
technology, and Particular can use <strong>the</strong> new process<br />
to significantly reduce costs for <strong>the</strong>se high-tech<br />
particles. Laser-generated nanoparticles are not only<br />
interesting for medical technology, but also for o<strong>the</strong>r<br />
high-quality products.<br />
Apart from <strong>the</strong> good cooperation between Particular<br />
and <strong>the</strong> LZH, Bärsch emphasizes <strong>the</strong> support of <strong>the</strong><br />
promotional program "EXIST-Research Transfer",<br />
through which Particular receives funding from <strong>the</strong><br />
German Federal Ministry of Economics and Technology<br />
during <strong>the</strong> start-up phase, up to <strong>the</strong> end of 2011.<br />
http://particular.eu/company.html<br />
Growing nanowires horizontally yields new benefit: 'Nano-LEDs'<br />
While refining <strong>the</strong>ir novel method for making nanoscale wires, chemists at <strong>the</strong> NIST discovered an unexpected<br />
bonus — a new way to create nanowires that produce light similar to that from LEDs.<br />
These “nano-LEDs” may one day have <strong>the</strong>ir<br />
light-emission abilities put to work serving<br />
miniature devices such as nanogenerators or<br />
lab-on-a-chip systems.<br />
Like many vertical growth CVD methods, <strong>the</strong> NIST<br />
fabrication technique uses gold as a catalyst for<br />
crystal formation. The difference is that <strong>the</strong> gold<br />
deposited in <strong>the</strong> NIST method is heated to 900<br />
degrees Celsius (1,652 degrees Fahrenheit),<br />
converting it to a nanoparticle that serves as growth<br />
site and medium for <strong>the</strong> crystallization of zinc oxide<br />
molecules. As <strong>the</strong> zinc oxide nanocrystal grows, it<br />
pushes <strong>the</strong> gold nanoparticle along <strong>the</strong> surface of <strong>the</strong><br />
substrate (in this experiment, gallium nitride) to form<br />
a nanowire that grows horizontally across <strong>the</strong><br />
substrate and so exhibits properties strongly<br />
influenced by its base material.<br />
In recent work published in ACS Nano, NIST chemists<br />
Nikoobakht and Herzing increased <strong>the</strong> thickness of<br />
<strong>the</strong> gold catalyst nanoparticle from less than 8<br />
nanometers to approximately 20 nanometers. The<br />
change resulted in nanowires that grew a secondary<br />
structure, a shark-like “dorsal fin” (referred to as a<br />
“nanowall”) where <strong>the</strong> zinc oxide portion is electronrich<br />
and <strong>the</strong> gallium nitride portion is electron-poor.<br />
The interface between <strong>the</strong>se two materials—known<br />
as a p-n heterojunction—allows electrons to flow<br />
across it when <strong>the</strong> nanowire-nanowall combination<br />
was charged with electricity. In turn, <strong>the</strong> movement of<br />
electrons produced light and led <strong>the</strong> researchers to<br />
dub it a “nano LED.”<br />
Unlike previous techniques for producing<br />
heterojunctions, <strong>the</strong> NIST “surface-directed”<br />
fabrication method makes it easy to locate individual<br />
heterojunctions on <strong>the</strong> surface. This feature is<br />
especially useful when a large number of<br />
heterojunctions must be grouped in an array so<br />
that <strong>the</strong>y can be electrically charged as a lightemitting<br />
unit.<br />
Transmission electron microscope (TEM) examination<br />
of <strong>the</strong> zinc oxide-gallium nitride nanowires and<br />
nanowalls revealed few structural defects in <strong>the</strong><br />
nanowires and very distinct p-n heterojunctions in <strong>the</strong><br />
nanowalls, both affirmations of <strong>the</strong> effectiveness of<br />
<strong>the</strong> NIST “surface directed” fabrication method.<br />
www.nist.gov<br />
Transmission electron microscope image<br />
of “nano LEDs” emitting light.<br />
Insight into using graphene in electronics<br />
New findings from <strong>the</strong> laboratory of ECE Professor Joseph W. Lyding, a researcher in <strong>the</strong> Beckman Institute, are<br />
providing valuable insight into graphene, a single two-dimensional layer of graphite with numerous electronic<br />
and mechanical properties that make it attractive for use in electronics.<br />
Lyding, who heads <strong>the</strong> Nanoelectronics and<br />
Nanomaterials group at <strong>the</strong> Beckman Institute,<br />
and his lab report using a dry deposition<br />
method <strong>the</strong>y developed to deposit pieces of<br />
graphene on semiconducting substrates and on <strong>the</strong><br />
electronic character of graphene at room temperature<br />
<strong>the</strong>y observed using <strong>the</strong> method.<br />
The researchers wrote this of graphene’s potential,<br />
especially as compared to its elemental cousin,<br />
carbon nanotubes, for use in electronics and o<strong>the</strong>r<br />
applications: “Unlike carbon nanotubes, graphene<br />
can be patterned using standard e-beam lithographic<br />
techniques, making it an attractive prospect for use<br />
in <strong>semiconductor</strong> devices.” To reach that goal,<br />
issues associated with graphene must be overcome,<br />
and this paper gives insight into a much-needed<br />
step in that direction: understanding substrategraphene<br />
interactions toward integration into future<br />
nanoelectronic devices. The project investigated<br />
<strong>the</strong> electronic character of <strong>the</strong> underlying substrate<br />
of graphene at room temperature and reports on “an<br />
apparent electronic semitransparency at high bias<br />
of <strong>the</strong> nanometer-sized monolayer graphene pieces<br />
observed using an ultrahigh vacuum scanning<br />
tunneling microscope (UHV-STM) and corroborated<br />
via first-principles studies.” This semitransparency<br />
was made manifest by observation of <strong>the</strong> substrate<br />
atomic structure through <strong>the</strong> graphene.<br />
Lyding’s research group had developed a nonchemical<br />
(dry) technique for depositing carbon<br />
nanotubes (CNTs) on a surface called Dry Contact<br />
Transfer that allowed <strong>the</strong> CNTs to maintain <strong>the</strong>ir<br />
electronic properties. They later applied <strong>the</strong> method<br />
to graphene and were able to deposit pristine,<br />
nanometer-sized graphene pieces in situ onto<br />
atomically flat UHV-cleaved Gallium arsenide and<br />
Indium arsenide <strong>semiconductor</strong> substrates with low<br />
amounts of extraneous contamination.<br />
The electronic semitransparency of <strong>the</strong> graphene<br />
pieces was observed when <strong>the</strong> UHV STM probe<br />
pushed <strong>the</strong> graphene 0.05 nm closer to <strong>the</strong> surface,<br />
causing its electronic structure to mix with that of<br />
<strong>the</strong> surface.<br />
www.ece.illinois.edu<br />
Visualization of nanoscale interaction between a<br />
semiconducting substrate (below) and graphene<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
21
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
POWER ELECTRONIC<br />
Toyota, Daihatsu team up on light cars, EV/HEV business<br />
Toyota Motor Corp and Daihatsu Motor Co Ltd announced that Daihatsu will supply its light cars to Toyota, which<br />
will sell <strong>the</strong>m under <strong>the</strong> Toyota brand in <strong>the</strong> Japanese market.<br />
As <strong>the</strong> market for light cars is expanding, an<br />
increasing number of Toyota customers are<br />
willing to buy a light car, <strong>the</strong> companies said.<br />
Daihatsu will supply <strong>the</strong> Move Conte and Hijet Cargo<br />
light cars to Toyota from <strong>the</strong> fall of 2011 through <strong>the</strong><br />
end of 2011. And, in 2012, Daihatsu will supply ano<strong>the</strong>r<br />
type of passenger car to Toyota though <strong>the</strong> type of <strong>the</strong><br />
vehicle has not been determined yet.<br />
"Though <strong>the</strong>ir Daihatsu logos will be replaced with<br />
Toyota logos, <strong>the</strong>y will have <strong>the</strong> same specifications,"<br />
said Koichi Ina, president of Daihatsu. "We consider<br />
it as OEM supply of existing vehicles. But, if <strong>the</strong>y are<br />
fully remodeled, we will supply <strong>the</strong> new models."<br />
Toyota and Daihatsu have a contract called TAD<br />
(Toyota Alliance with Daihatsu), under which <strong>the</strong>ir<br />
outlet stores introduce <strong>the</strong>ir customers to each o<strong>the</strong>r.<br />
The number of light cars sold at Toyota's outlet stores<br />
under <strong>the</strong> contract is about 30,000 per year. In<br />
consideration of <strong>the</strong> expanding light car market, Toyota<br />
expects that <strong>the</strong> number will increase to 100,000 per<br />
year in about 2012 (40,000 under <strong>the</strong> TAD contract<br />
and 60,000 due to <strong>the</strong> OEM supply). Toyota will sell<br />
<strong>the</strong> three types of vehicles supplied by Daihatsu at its<br />
"Corolla" and "Netz" outlet stores across Japan. And,<br />
in some areas where <strong>the</strong> ratio of light cars is high,<br />
Toyota will also sell <strong>the</strong>m at its "Toyota" and "Toyopet"<br />
outlet stores. This time, Toyota and Daihatsu agreed<br />
to collaborate on EVs and HEVs. Toyota will provide<br />
EV/HEV <strong>technologies</strong> to Daihatsu, and Daihatsu will<br />
consider releasing light EVs and HEVs. Daihatsu<br />
plans to decide <strong>the</strong> kinds of <strong>technologies</strong> and <strong>the</strong> types<br />
of light EVs and HEVs by <strong>the</strong> end of 2011.<br />
www.toyota.co.jp<br />
www.daihatsu.com<br />
Toyota, Daihatsu team up on light cars, EV/HEV business<br />
Power MOSFETs pack dual chips in small package<br />
Renesas Electronics Corp. presents <strong>the</strong> RJK0222DNS and RJK0223DNS, two power <strong>semiconductor</strong> devices with<br />
ultra-compact packages for use in DC/DC converters that provide power to <strong>the</strong> CPU, memory, and o<strong>the</strong>r circuit blocks<br />
of products such as servers and notebook PCs.<br />
The power <strong>semiconductor</strong> products each<br />
integrate a pair of power MOSFETs into a<br />
single package, enabling designs of DC/DC<br />
converters that are more compact with higher<br />
mounting density.<br />
The compact, low-loss, 11th generation power<br />
MOSFETs are contained in an ultra-compact package<br />
measuring only 3.2mm × 4.8mm × 0.8mm (max.),<br />
making it possible to reduce <strong>the</strong> mounting area by<br />
about half compared with previous Renesas<br />
Electronics power MOSFET products. At a switching<br />
frequency of 300kHz, <strong>the</strong> power MOSFETs claim a<br />
maximum efficiency of 95.2 per cent (input voltage:<br />
12V, output voltage: 3.3V) which contributes to<br />
improved overall power supply efficiency and reduced<br />
power consumption. Within <strong>the</strong> pair of power<br />
MOSFETs used for voltage conversion, <strong>the</strong> one used<br />
for synchronous rectification (low-side) incorporates<br />
an on-chip Schottky barrier diode. During <strong>the</strong> DC/DC<br />
converter's dead time, <strong>the</strong> faster current switching<br />
time from <strong>the</strong> power MOSFET to <strong>the</strong> Schottky barrier<br />
diode reduces power loss. In addition, it effectively<br />
suppresses <strong>the</strong> spike voltage when <strong>the</strong> power<br />
MOSFET switches on, reducing <strong>the</strong> electromagnetic<br />
noise. Like Renesas Electronics' existing WPAK<br />
package, <strong>the</strong> HWSON3046 package offers heat<br />
radiation and has a die pad on <strong>the</strong> bottom of <strong>the</strong><br />
device that allows heat to pass to <strong>the</strong> printed wiring<br />
board while <strong>the</strong> power MOSFET is operating, enabling<br />
<strong>the</strong> power MOSFET to handle large currents.<br />
Renesas Electronics plans to develop a full line-up<br />
of dual-chip products using <strong>the</strong> HWSON3046<br />
package for a variety of DC/DC converter<br />
specifications.<br />
Samples of Renesas Electronics' power MOSFETs<br />
are currently available. Mass production is scheduled<br />
to begin in December 2010 and is expected to reach<br />
a combined volume of 20 lakh units per month after<br />
July 2011.<br />
www.renesas.eu<br />
Dual chips in small package<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
Diamond-based SBD eliminates need for cooling<br />
Japanese researchers made a Schottky barrier diode (SBD) by using diamond <strong>semiconductor</strong>.<br />
When <strong>the</strong>y checked <strong>the</strong> temperature<br />
characteristics of <strong>the</strong> SBD, <strong>the</strong>y found that<br />
its current characteristics (when it is turned<br />
off), etc do not have a temperature dependence<br />
within a temperature range of 25-200°C.<br />
This was announced by Osaka University and Japan's<br />
National Institute of Advanced Industrial Science and<br />
Technology (AIST) at <strong>the</strong> 71th Autumn Meeting 2010<br />
of <strong>the</strong> Japan Society of Applied Physics, which took<br />
place from Sept 14 to 17, 2010, in Japan.<br />
The university and AIST made a SBD by combining<br />
diamond <strong>semiconductor</strong> and Schottky electrodes<br />
made by using ru<strong>the</strong>nium (Ru) and checked its<br />
switching performance. As a result, <strong>the</strong>y confirmed<br />
that <strong>the</strong> SBD is capable of high-speed switching of<br />
0.01μs and <strong>the</strong> recovery current dependent on <strong>the</strong><br />
rate of change (di/dt) of current and parasitic<br />
inductance is as small as 40A/cm2. Therefore, <strong>the</strong><br />
loss of <strong>the</strong> SBD is low. The switching performance<br />
did not change when <strong>the</strong> temperature was changed<br />
between 25-200°C. So, <strong>the</strong> university and AIST<br />
concluded that <strong>the</strong> SBD using diamond <strong>semiconductor</strong><br />
can potentially be applied to electric power conversion<br />
systems that do not use a cooling system.<br />
Some SiC-based power <strong>semiconductor</strong> chips stably<br />
operate at temperatures higher than 200°. However,<br />
in such high-temperature environments, it becomes<br />
important to ensure <strong>the</strong> heat resistances of solder,<br />
elemental devices (including packages), peripheral<br />
circuits and so forth.<br />
www.osaka-u.ac.jp<br />
www.aist.go.jp<br />
The diamond SBD<br />
22
Kongsberg<br />
OCTOBER 2010 issue n°100<br />
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE<br />
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Status of <strong>the</strong> MEMS industry 2010<br />
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business models evolution. Finally, it analyzes <strong>the</strong> main technological trends for detector/microbolometer.<br />
Released in June 2010<br />
Copyrights © Yole Développement SA. All rights reserved - Recycled paper<br />
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