Embedded Die - I-Micronews

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WL-CSP Applications Space Logic Basebands RF connectivity Multi-Mode Transceivers PMUs CMOS image sensors Wireless RF chips: - GPS + Bluetooth - FM radio <strong>Embedded</strong> WLP technologies are extending WLCSP application space to higher pin counts: > 140-300 I/Os IPD for ESD/EMI LED Drivers MEMS inertials (gyroscopes, accelerometers) Logic / analog parts Audio Amplifiers Operational Amplifiers MEMS (RF, Siliconmicrophones…) Headphones drivers Temperature sensors MOSFET 5 10 > 50 >100 200-350 I/Os © 2010 • 10 Copyrights © Yole Développement SARL. All rights reserved.
Fan-Out WLP technology is emerging on both 200mm / 300mm infrastructures • Infineon is having a great sucess with its proprietary eWLB technology – The first FO-WLP eWLB wafers are mass produced on 200mm both Infineon (GE), ASE (TW) and StatschippaC (SG) since 2009. – Indeed, Fan-Out WLP is extending the general concept of Wafer Scale Packaging to new application categories, especially the ones with higher pin-counts and larger chip size such as wireless communication ICs • First embedded wafer-level-package products based on eWLB have been identified within LGE and Nokia handsets – This year, a few additional players are even more aggressive in putting further capacity for eWLB manufacturing as both StatschippaC (SG) and NANIUM (PT) are at the moment rampingup their facilities for manufacturing the first generation eWLB of Infineon on 300mm reconfigured wafers – Other packaging houses such as SPIL, Amkor, UTAC and others are also on the point to announce the start of their own Fan-out wafer level packaging operations 300mm eWLB reconfigured wafer (Courtesy of NANIUM) © 2010 • 11 Copyrights © Yole Développement SARL. All rights reserved.
Page 1 and 2: Embedded Wafer-Level-Packaging Fan-
Page 3 and 4: Table of Contents (2/2) 2) Fan-Out
Page 5 and 6: Objectives of the Report • This i
Page 7 and 8: Companies cited in this Report 3D-P
Page 9: Fan-out WLP Concept • A new SiP-f
Page 13 and 14: FOWLP versus Chip Embedding: Compet
Page 15 and 16: Embedded Wafer-Level-Package techno
Page 17 and 18: About the Authors of this Report
Page 19: What about on-site workshops? • O

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