Embedded Die - I-Micronews

Table of Contents (1/2)
• Scope of the Report & Definitions …...……. 3
– Objectives of the report ………….……... 4
• Executive Summary ………………………..… 9
1) Embedded Packaging of active dies and
passive components ………………….……. 10
– Motivations and Drivers ………………... 18
– Applications & End-markets: Status of
commercialization …………………..…... 24
• Cell-phone & Consumer applications
• Automotive applications
• Medical applications
– 2009-2015 market forecasts for Embedded
packages ………………………………….... 32
• In Package shipments (Munits)
• In Packaging revenues ($M)
– Supply chain emerging for embedded dies
………………………………….…………….. 44
• Players and positioning in the electronic value
chain
• Who is the most aggressive in the
commercialization?
• Who is doing what: partnership identified
– Technology flavors for embedded package ... 51
• Chip first versus chip last?
• Single die embedding versus SiP module?
• SiP multi-die integration
• Discrete passive integration
• Specific features integration (silicon interposers,
holes, fluidic, hermetic cavities, etc…)
• Challenges related to yield & supply chain
– Equt & Material Tool-Box for Embedded die … 78
– Cost structure for Embedded package
manufacturing …………………………………..... 95
• Comparison with competitive package alternative
that Embedded die technology is looking for direct
replacement (QFN, BGA, WLCSP, SOT, PoP…)
• Cost structure target of Embedded die for different
application case (RFID, IPD, Power MOSFET / IGBT,
DC/DC converters, PMU, Wireless Connectivity ICs,
Digital Baseband, Memories, etc …)
– Conclusion on “sweets spots” for the
introduction of Embedded die technology in the
short / medium / long term ……………………. 102
• Global Roadmap for Embedded die
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