Embedded Die - I-Micronews
Embedded Die - I-Micronews
Embedded Die - I-Micronews
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Current / Future Tool-Box for 3D Packaging<br />
I/O<br />
. Count<br />
> 1 000<br />
TSV<br />
Silicon/Glass<br />
WLP <strong>Embedded</strong> BGA/PoP<br />
Logic<br />
3-D SOC<br />
Silicon PoP<br />
3-D Logic SiP<br />
3-D Flip-Chip<br />
500<br />
300<br />
120<br />
50<br />
15<br />
MEMS<br />
WLP<br />
3-D<br />
RF-SiP<br />
WLP Fan-Out<br />
Logic<br />
eFlash<br />
eDRAM<br />
Analog<br />
RF + I/Os<br />
Interposer<br />
WLP Fan-in<br />
FO WLP - SiP<br />
<strong>Embedded</strong> <strong>Die</strong><br />
<strong>Embedded</strong> PoP<br />
FO WLP - MCP<br />
<strong>Embedded</strong> SiP Module<br />
PoP ‟Bottom Package‟ evolution:<br />
Face to Face<br />
TMV<br />
PoP High Density<br />
2<br />
© 2010 • 14<br />
2mm2<br />
20mm2 50mm2 80mm2 100mm2 500mm2<br />
Copyrights © Yole Développement SARL. All rights reserved.<br />
Chip /<br />
Package<br />
Size
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