Fan-in WLCSP matures, what's next? IMT on the role ... - I-Micronews
Fan-in WLCSP matures, what's next? IMT on the role ... - I-Micronews
Fan-in WLCSP matures, what's next? IMT on the role ... - I-Micronews
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F E B R U A R Y 2 0 1 0 i s s u e n ° 1 4<br />
N e w s l e t t e r o n 3 D I C , T S V , W L P & E m b e d d e d T e c h n o l o g i e s<br />
TSV <str<strong>on</strong>g>in</str<strong>on</strong>g>tegrati<strong>on</strong> <str<strong>on</strong>g>in</str<strong>on</strong>g> <strong>the</strong>ir first BSI sensor. As before, an epoxy is used both to<br />
attach a fr<strong>on</strong>t glass to <strong>the</strong> light receiv<str<strong>on</strong>g>in</str<strong>on</strong>g>g side of <strong>the</strong> sensor, and also as part of<br />
<strong>the</strong> redistributi<strong>on</strong> layer build up.<br />
While arguably not as elegant as TSVs, <strong>the</strong> ShellOP packag<str<strong>on</strong>g>in</str<strong>on</strong>g>g provides<br />
nearly <strong>the</strong> same advantages, and has proven to be a highly manufacturable<br />
approach for 200 mm CIS wafers. For now, OmniVisi<strong>on</strong>/TSMC are happy to<br />
not add TSV <str<strong>on</strong>g>in</str<strong>on</strong>g>tegrati<strong>on</strong> costs to <strong>the</strong> already significant <str<strong>on</strong>g>in</str<strong>on</strong>g>vestment it took<br />
to get BSI <str<strong>on</strong>g>in</str<strong>on</strong>g>to mass producti<strong>on</strong>. It is worth menti<strong>on</strong><str<strong>on</strong>g>in</str<strong>on</strong>g>g that <strong>the</strong> real world<br />
examples are a snapshot of current producti<strong>on</strong>. TSMC developed its TSV<br />
technology <str<strong>on</strong>g>in</str<strong>on</strong>g> parallel, but did not <str<strong>on</strong>g>in</str<strong>on</strong>g>sert it <str<strong>on</strong>g>in</str<strong>on</strong>g>to producti<strong>on</strong>, <str<strong>on</strong>g>in</str<strong>on</strong>g> part because<br />
of mechanical stress issues impact<str<strong>on</strong>g>in</str<strong>on</strong>g>g wafer yield. TSMC estimates a 5% to<br />
15% gross die per wafer yield <str<strong>on</strong>g>in</str<strong>on</strong>g>crease (compared to exist<str<strong>on</strong>g>in</str<strong>on</strong>g>g sidewall CSP)<br />
is possible through TSV <str<strong>on</strong>g>in</str<strong>on</strong>g>tegrati<strong>on</strong>. The sensor area reducti<strong>on</strong> comes from<br />
elim<str<strong>on</strong>g>in</str<strong>on</strong>g>at<str<strong>on</strong>g>in</str<strong>on</strong>g>g <strong>the</strong> lateral extensi<strong>on</strong>s and mov<str<strong>on</strong>g>in</str<strong>on</strong>g>g <strong>the</strong> circuitry under <strong>the</strong> pads<br />
(CUP), form<str<strong>on</strong>g>in</str<strong>on</strong>g>g a vertical <str<strong>on</strong>g>in</str<strong>on</strong>g>terc<strong>on</strong>nect.<br />
Look<str<strong>on</strong>g>in</str<strong>on</strong>g>g at <strong>the</strong> competitive landscape, <strong>the</strong> simplest opti<strong>on</strong> was executed by<br />
S<strong>on</strong>y, who was first to market with a SOI-based BSI sensor. The relatively<br />
relaxed form factor c<strong>on</strong>stra<str<strong>on</strong>g>in</str<strong>on</strong>g>ts of its camcorder CIS enabled a simple<br />
backside wire b<strong>on</strong>d<str<strong>on</strong>g>in</str<strong>on</strong>g>g approach. While effective for <strong>the</strong> applicati<strong>on</strong>, this<br />
approach would not be an opti<strong>on</strong> for a camera ph<strong>on</strong>e module. With<str<strong>on</strong>g>in</str<strong>on</strong>g> <strong>the</strong><br />
realm of camera ph<strong>on</strong>e modules, Chipworks has analyzed fr<strong>on</strong>t illum<str<strong>on</strong>g>in</str<strong>on</strong>g>ated<br />
image sensors us<str<strong>on</strong>g>in</str<strong>on</strong>g>g TSVs fabricated by Toshiba and STMicroelectr<strong>on</strong>ics.<br />
Both companies are <str<strong>on</strong>g>in</str<strong>on</strong>g> BSI development, and will likely go straight to BSI +<br />
TSV. Several o<strong>the</strong>r CIS companies have published papers and/or have been<br />
awarded patents for both BSI and TSV implementati<strong>on</strong>s. One th<str<strong>on</strong>g>in</str<strong>on</strong>g>g is certa<str<strong>on</strong>g>in</str<strong>on</strong>g>:<br />
to vary<str<strong>on</strong>g>in</str<strong>on</strong>g>g degrees all CIS IDMs and foundries will be forced to evolve <strong>the</strong>ir<br />
packag<str<strong>on</strong>g>in</str<strong>on</strong>g>g soluti<strong>on</strong>s. TSVs may not be a necessity at <strong>the</strong> moment, but <str<strong>on</strong>g>in</str<strong>on</strong>g> <strong>the</strong><br />
quest for a 3D <str<strong>on</strong>g>in</str<strong>on</strong>g>tegrated imager, <strong>the</strong>ir <str<strong>on</strong>g>in</str<strong>on</strong>g>tegrati<strong>on</strong> seems <str<strong>on</strong>g>in</str<strong>on</strong>g>evitable.<br />
Lithography for 3D-ICs and CMOS image sensors<br />
Wafer-to-wafer and chip-to-wafer b<strong>on</strong>d<str<strong>on</strong>g>in</str<strong>on</strong>g>g<br />
www.chipworks.com<br />
Temporary b<strong>on</strong>d<str<strong>on</strong>g>in</str<strong>on</strong>g>g and deb<strong>on</strong>d<str<strong>on</strong>g>in</str<strong>on</strong>g>g for th<str<strong>on</strong>g>in</str<strong>on</strong>g> wafer<br />
process<str<strong>on</strong>g>in</str<strong>on</strong>g>g<br />
Ray F<strong>on</strong>ta<str<strong>on</strong>g>in</str<strong>on</strong>g>e has been a process analyst at Chipworks s<str<strong>on</strong>g>in</str<strong>on</strong>g>ce<br />
2001, specializ<str<strong>on</strong>g>in</str<strong>on</strong>g>g <str<strong>on</strong>g>in</str<strong>on</strong>g> image sensors. He has authored and<br />
technically reviewed numerous image sensor process review<br />
(IPR) reports.<br />
Chipworks is <strong>the</strong> recognized leader <str<strong>on</strong>g>in</str<strong>on</strong>g> reverse eng<str<strong>on</strong>g>in</str<strong>on</strong>g>eer<str<strong>on</strong>g>in</str<strong>on</strong>g>g and patent<br />
<str<strong>on</strong>g>in</str<strong>on</strong>g>fr<str<strong>on</strong>g>in</str<strong>on</strong>g>gement analysis of semic<strong>on</strong>ductors and electr<strong>on</strong>ic systems. The<br />
company’s ability to analyze <strong>the</strong> circuitry and physical compositi<strong>on</strong> of<br />
<strong>the</strong>se systems makes <strong>the</strong>m a key partner <str<strong>on</strong>g>in</str<strong>on</strong>g> <strong>the</strong> success of <strong>the</strong> world’s<br />
largest semic<strong>on</strong>ductor and microelectr<strong>on</strong>ics companies. Intellectual<br />
property groups and <strong>the</strong>ir legal counsel trust Chipworks for success <str<strong>on</strong>g>in</str<strong>on</strong>g><br />
patent licens<str<strong>on</strong>g>in</str<strong>on</strong>g>g and litigati<strong>on</strong> – earn<str<strong>on</strong>g>in</str<strong>on</strong>g>g hundreds of milli<strong>on</strong>s of dollars<br />
<str<strong>on</strong>g>in</str<strong>on</strong>g> patent licenses and sav<str<strong>on</strong>g>in</str<strong>on</strong>g>g as much <str<strong>on</strong>g>in</str<strong>on</strong>g> royalty payments. Research &<br />
Development and Product Management rely <strong>on</strong> Chipworks for success<br />
<str<strong>on</strong>g>in</str<strong>on</strong>g> new product design and launch, sav<str<strong>on</strong>g>in</str<strong>on</strong>g>g hundreds of milli<strong>on</strong>s of dollars<br />
<str<strong>on</strong>g>in</str<strong>on</strong>g> design and earn<str<strong>on</strong>g>in</str<strong>on</strong>g>g even more through superior product design and<br />
faster launches. Headquartered <str<strong>on</strong>g>in</str<strong>on</strong>g> Canada, Chipworks ma<str<strong>on</strong>g>in</str<strong>on</strong>g>ta<str<strong>on</strong>g>in</str<strong>on</strong>g>s offices<br />
<str<strong>on</strong>g>in</str<strong>on</strong>g> <strong>the</strong> USA, Japan, Korea, and Taiwan.<br />
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