Podium Presentation Template - Semiconductor Wafer Test Workshop

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Direct Dock Vertical Probe Maintenance Process Insert contact thru upper die, lower die and push past detent Removal: Grasp contact and pull contact out June 8 to 11, 2008 IEEE SW Test Workshop 20
Reduced Probe Marks • Pointed probe design for lower CRES • Pad sizes shrinking, thus smaller scrub marks are desirable • Probe and re-probe on same pads are now possible with minimal damage June 8 to 11, 2008 IEEE SW Test Workshop 21
Page 1 and 2: Robert Doherty Analog Devices, Inc.
Page 3 and 4: Overview • Analog Devices Inc. te
Page 5 and 6: Project Objective • Develop a low
Page 7 and 8: Vertical Probe Benefits • Longer
Page 9 and 10: Test Plan • Test a Power Manageme
Page 11 and 12: Comparison of Substrate vs Direct D
Page 13 and 14: Comparison of Substrate vs Direct D
Page 15 and 16: Direct Dock PCB Design • Eliminat
Page 17 and 18: Vertical Direct Dock Probe Card •
Page 19: BeCu Pointed Saber ® Probe Propert
Page 23 and 24: Results June 8 to 11, 2008 IEEE SW
Page 25 and 26: Results: Scrub Mark Comparison Vert
Page 27 and 28: Probe Mark Analysis - 5 um pad pene
Page 29 and 30: Cleaning Process Used • Using Int
Page 31 and 32: Testing Conclusions • Direct Dock
Page 33: Acknowledgements • John McHatton

Podium Presentation Template - Semiconductor Wafer Test Workshop

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