Podium Presentation Template - Semiconductor Wafer Test Workshop

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Introduction This presentation summarizes Analog Devices, Inc.’s evaluation and testing results using an alternative vertical probe card with pointed probes for testing ADI’ s mixed signal, multi dut applications on bond pads. This evaluation is intended to investigate vertical probe card technology as an alternative to traditional cantilever cards used by ADI. The potential benefits of smaller scrub marks, higher frequency, longer card life, easy in house maintenance and potential over-all value when compared to either cantilever or higher cost membrane cards which ADI’s uses for higher frequency applications. June 8 to 11, 2008 IEEE SW Test Workshop 2
Overview • Analog Devices Inc. testing needs • Project Objective • Benefits • Testing Plan • Results • Probe design making this possible • Next Steps June 8 to 11, 2008 IEEE SW Test Workshop 3
Page 1: Robert Doherty Analog Devices, Inc.
Page 5 and 6: Project Objective • Develop a low
Page 7 and 8: Vertical Probe Benefits • Longer
Page 9 and 10: Test Plan • Test a Power Manageme
Page 11 and 12: Comparison of Substrate vs Direct D
Page 13 and 14: Comparison of Substrate vs Direct D
Page 15 and 16: Direct Dock PCB Design • Eliminat
Page 17 and 18: Vertical Direct Dock Probe Card •
Page 19 and 20: BeCu Pointed Saber ® Probe Propert
Page 21 and 22: Reduced Probe Marks • Pointed pro
Page 23 and 24: Results June 8 to 11, 2008 IEEE SW
Page 25 and 26: Results: Scrub Mark Comparison Vert
Page 27 and 28: Probe Mark Analysis - 5 um pad pene
Page 29 and 30: Cleaning Process Used • Using Int
Page 31 and 32: Testing Conclusions • Direct Dock
Page 33: Acknowledgements • John McHatton

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