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Podium Presentation Template - Semiconductor Wafer Test Workshop

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Design Objective<br />

Gussets<br />

Head Plate<br />

<strong>Test</strong> Head Direct Dock<br />

0.120 inches<br />

Fewer interconnects, decrease<br />

the signal path length across a<br />

probe card PCB to actual probe<br />

needle connection.<br />

3.03<br />

mm<br />

Probe<br />

Application<br />

HW<br />

June 8 to 11, 2008<br />

IEEE SW <strong>Test</strong> <strong>Workshop</strong> 6

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