2012-2016 Microsystem Technology Strategy and Roadmaps
2012-2016 Microsystem Technology Strategy and Roadmaps
2012-2016 Microsystem Technology Strategy and Roadmaps
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MEMS <strong>Technology</strong> Focus<br />
• Focus on integratibility of MEMS with microelectronics, photonics, <strong>and</strong><br />
microfluidics in a microsystem<br />
• Use two main methods to integrate MEMS with microsystem technologies<br />
– Post-processing <strong>and</strong> monolithic integration (deposition, etching, surface<br />
micromachining of a die or wafer, embedded waveguides, MEMS on<br />
CMOS, etc.)<br />
– Conventional packaging & assembly (flip-chip, wirebonding, SiP, etc.)<br />
• Support emerging silicon <strong>and</strong> new material based MEMS technologies for<br />
developing custom components targeting<br />
– RF MEMS<br />
– Energy Harvesting<br />
– Optical MEMS<br />
• In addition to commercial sourcing, increased involvement with FACT (MNT<br />
labs) for delivering technologies for building customized MEMS devices or<br />
components<br />
© <strong>2012</strong>, CMC <strong>Microsystem</strong>s <strong>Strategy</strong> <strong>and</strong> Roadmap, Work in Progress 26
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